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CYD09S18V18-200BBXC
Rochester Electronics LLC
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Check for Price | Yes | Yes | Active | 9.4372 Mbit | 18 | 512KX18 | 1.5 V | 3.3 ns | DUAL-PORT SRAM | PIPELINED OR FLOW-THROUGH ARCHITECTURE, IT CAN ALSO OPERATES AT 1.8V | 1 | 512000 | 524.288 k | SYNCHRONOUS | PARALLEL | 1.58 V | 1.42 V | CMOS | COMMERCIAL | S-PBGA-B256 | COMMERCIAL | e1 | NOT SPECIFIED | 70 °C | 260 | 20 | 256 | PLASTIC/EPOXY | LBGA | SQUARE | GRID ARRAY, LOW PROFILE | YES | TIN SILVER COPPER | BALL | 1 mm | BOTTOM | 1.7 mm | 17 mm | 17 mm | ROCHESTER ELECTRONICS LLC | BGA | 17 X 17 MM, 1.70 MM HEIGHT, 1 MM PITCH, LEAD FREE, MO-192, FBGA-256 | 256 | unknown | |||||||||||||
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CYD09S18V18-200BBXI
Cypress Semiconductor
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Check for Price | Yes | Yes | Obsolete | 9.4372 Mbit | 18 | 512KX18 | 1.5 V | 3.3 ns | 200 MHz | MULTI-PORT SRAM | PIPELINED OR FLOW-THROUGH ARCHITECTURE, IT CAN ALSO OPERATES AT 1.8V | COMMON | 1 | 2 | 512000 | 524.288 k | SYNCHRONOUS | 3-STATE | PARALLEL | 220 mA | 1.4 V | 690 µA | 1.58 V | 1.42 V | CMOS | INDUSTRIAL | S-PBGA-B256 | Not Qualified | e1 | 3 | 85 °C | -40 °C | 260 | 20 | 256 | PLASTIC/EPOXY | LBGA | BGA256,16X16,40 | SQUARE | GRID ARRAY, LOW PROFILE | YES | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 1 mm | BOTTOM | 1.7 mm | 17 mm | 17 mm | CYPRESS SEMICONDUCTOR CORP | BGA | 17 X 17 MM, 1.70 MM HEIGHT, 1 MM PITCH, LEAD FREE, MO-192, FBGA-256 | 256 | unknown | 3A991.B.2.A | 8542.32.00.41 | ||
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CYD09S18V18-167BBXC
Rochester Electronics LLC
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Check for Price | Yes | Yes | Active | 9.4372 Mbit | 18 | 512KX18 | 1.5 V | 4 ns | DUAL-PORT SRAM | PIPELINED OR FLOW-THROUGH ARCHITECTURE, IT CAN ALSO OPERATES AT 1.8V | 1 | 512000 | 524.288 k | SYNCHRONOUS | PARALLEL | 1.58 V | 1.42 V | CMOS | COMMERCIAL | S-PBGA-B256 | COMMERCIAL | e1 | NOT SPECIFIED | 70 °C | 260 | 20 | 256 | PLASTIC/EPOXY | LBGA | SQUARE | GRID ARRAY, LOW PROFILE | YES | TIN SILVER COPPER | BALL | 1 mm | BOTTOM | 1.7 mm | 17 mm | 17 mm | ROCHESTER ELECTRONICS LLC | BGA | 17 X 17 MM, 1 MM PITCH, LEAD FREE, MO-192, FBGA-256 | 256 | unknown | |||||||||||||
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CYD09S18V18-167BBXC
Cypress Semiconductor
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Check for Price | Yes | Obsolete | 9.4372 Mbit | 18 | 512KX18 | 1.5 V | 4 ns | 167 MHz | MULTI-PORT SRAM | PIPELINED OR FLOW-THROUGH ARCHITECTURE, IT CAN ALSO OPERATES AT 1.8V | COMMON | 1 | 2 | 512000 | 524.288 k | SYNCHRONOUS | 3-STATE | PARALLEL | 200 mA | 1.4 V | 580 µA | 1.58 V | 1.42 V | CMOS | COMMERCIAL | S-PBGA-B256 | Not Qualified | e1 | 3 | 70 °C | 260 | 20 | 256 | PLASTIC/EPOXY | LBGA | BGA256,16X16,40 | SQUARE | GRID ARRAY, LOW PROFILE | YES | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 1 mm | BOTTOM | 1.7 mm | 17 mm | 17 mm | CYPRESS SEMICONDUCTOR CORP | BGA | 17 X 17 MM, 1 MM PITCH, LEAD FREE, MO-192, FBGA-256 | 256 | unknown | 3A991.B.2.A | 8542.32.00.41 | ||||
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CYD09S18V18-167BBC
Cypress Semiconductor
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Check for Price | No | No | Obsolete | 9.4372 Mbit | 18 | 512KX18 | 1.5 V | 11 ns | 167 MHz | MULTI-PORT SRAM | PIPELINED OR FLOW-THROUGH ARCHITECTURE, IT CAN ALSO OPERATES AT 1.8V | COMMON | 1 | 2 | 512000 | 524.288 k | SYNCHRONOUS | 3-STATE | PARALLEL | 200 mA | 1.4 V | 580 µA | 1.58 V | 1.42 V | CMOS | COMMERCIAL | S-PBGA-B256 | Not Qualified | e0 | 3 | 70 °C | NOT SPECIFIED | NOT SPECIFIED | 256 | PLASTIC/EPOXY | LBGA | BGA256,16X16,40 | SQUARE | GRID ARRAY, LOW PROFILE | YES | Tin/Lead (Sn/Pb) | BALL | 1 mm | BOTTOM | 1.7 mm | 17 mm | 17 mm | CYPRESS SEMICONDUCTOR CORP | BGA | 17 X 17 MM, 1 MM PITCH, MO-192, FBGA-256 | 256 | compliant | 3A991.B.2.A | 8542.32.00.41 | |||
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CYD09S18V18-200BBXI
Rochester Electronics LLC
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Check for Price | Yes | Yes | Active | 9.4372 Mbit | 18 | 512KX18 | 1.5 V | 3.3 ns | DUAL-PORT SRAM | PIPELINED OR FLOW-THROUGH ARCHITECTURE, IT CAN ALSO OPERATES AT 1.8V | 1 | 512000 | 524.288 k | SYNCHRONOUS | PARALLEL | 1.58 V | 1.42 V | CMOS | INDUSTRIAL | S-PBGA-B256 | COMMERCIAL | e1 | NOT SPECIFIED | 85 °C | -40 °C | 260 | 20 | 256 | PLASTIC/EPOXY | LBGA | SQUARE | GRID ARRAY, LOW PROFILE | YES | TIN SILVER COPPER | BALL | 1 mm | BOTTOM | 1.7 mm | 17 mm | 17 mm | ROCHESTER ELECTRONICS LLC | BGA | 17 X 17 MM, 1.70 MM HEIGHT, 1 MM PITCH, LEAD FREE, MO-192, FBGA-256 | 256 | unknown | ||||||||||||
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CYD09S18V18-167BBI
Cypress Semiconductor
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Check for Price | No | No | Obsolete | 9.4372 Mbit | 18 | 512KX18 | 1.5 V | 11 ns | 167 MHz | MULTI-PORT SRAM | PIPELINED OR FLOW-THROUGH ARCHITECTURE, IT CAN ALSO OPERATES AT 1.8V | COMMON | 1 | 2 | 512000 | 524.288 k | SYNCHRONOUS | 3-STATE | PARALLEL | 220 mA | 1.4 V | 610 µA | 1.58 V | 1.42 V | CMOS | INDUSTRIAL | S-PBGA-B256 | Not Qualified | e0 | 3 | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 256 | PLASTIC/EPOXY | LBGA | BGA256,16X16,40 | SQUARE | GRID ARRAY, LOW PROFILE | YES | Tin/Lead (Sn/Pb) | BALL | 1 mm | BOTTOM | 1.7 mm | 17 mm | 17 mm | CYPRESS SEMICONDUCTOR CORP | BGA | 17 X 17 MM, 1 MM PITCH, MO-192, FBGA-256 | 256 | compliant | 3A991.B.2.A | 8542.32.00.41 | ||
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CYD09S18V18-167BBXI
Cypress Semiconductor
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Check for Price | Yes | Yes | Obsolete | 9.4372 Mbit | 18 | 512KX18 | 1.5 V | 4 ns | 167 MHz | MULTI-PORT SRAM | PIPELINED OR FLOW-THROUGH ARCHITECTURE, IT CAN ALSO OPERATES AT 1.8V | COMMON | 1 | 2 | 512000 | 524.288 k | SYNCHRONOUS | 3-STATE | PARALLEL | 220 mA | 1.4 V | 610 µA | 1.58 V | 1.42 V | CMOS | INDUSTRIAL | S-PBGA-B256 | Not Qualified | e1 | 3 | 85 °C | -40 °C | 260 | 20 | 256 | PLASTIC/EPOXY | LBGA | BGA256,16X16,40 | SQUARE | GRID ARRAY, LOW PROFILE | YES | TIN SILVER COPPER | BALL | 1 mm | BOTTOM | 1.7 mm | 17 mm | 17 mm | CYPRESS SEMICONDUCTOR CORP | BGA | 17 X 17 MM, 1.70 MM HEIGHT, 1 MM PITCH, LEAD FREE, MO-192, FBGA-256 | 256 | compliant | 3A991.B.2.A | 8542.32.00.41 | ||
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CYD09S18V18-200BBXC
Cypress Semiconductor
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Check for Price | Yes | Yes | Obsolete | 9.4372 Mbit | 18 | 512KX18 | 1.5 V | 3.3 ns | 200 MHz | MULTI-PORT SRAM | PIPELINED OR FLOW-THROUGH ARCHITECTURE, IT CAN ALSO OPERATES AT 1.8V | COMMON | 1 | 2 | 512000 | 524.288 k | SYNCHRONOUS | 3-STATE | PARALLEL | 200 mA | 1.4 V | 660 µA | 1.58 V | 1.42 V | CMOS | COMMERCIAL | S-PBGA-B256 | Not Qualified | e1 | 3 | 70 °C | 260 | 20 | 256 | PLASTIC/EPOXY | LBGA | BGA256,16X16,40 | SQUARE | GRID ARRAY, LOW PROFILE | YES | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 1 mm | BOTTOM | 1.7 mm | 17 mm | 17 mm | CYPRESS SEMICONDUCTOR CORP | BGA | 17 X 17 MM, 1.70 MM HEIGHT, 1 MM PITCH, LEAD FREE, MO-192, FBGA-256 | 256 | unknown | 3A991.B.2.A | 8542.32.00.41 | |||
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CYD09S18V18-200BBC
Cypress Semiconductor
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Check for Price | No | No | Obsolete | 9.4372 Mbit | 18 | 512KX18 | 1.5 V | 9 ns | 200 MHz | MULTI-PORT SRAM | PIPELINED OR FLOW-THROUGH ARCHITECTURE, IT CAN ALSO OPERATES AT 1.8V | COMMON | 1 | 2 | 512000 | 524.288 k | SYNCHRONOUS | 3-STATE | PARALLEL | 200 mA | 1.4 V | 660 µA | 1.58 V | 1.42 V | CMOS | COMMERCIAL | S-PBGA-B256 | Not Qualified | e0 | 3 | 70 °C | NOT SPECIFIED | NOT SPECIFIED | 256 | PLASTIC/EPOXY | LBGA | BGA256,16X16,40 | SQUARE | GRID ARRAY, LOW PROFILE | YES | Tin/Lead (Sn/Pb) | BALL | 1 mm | BOTTOM | 1.7 mm | 17 mm | 17 mm | CYPRESS SEMICONDUCTOR CORP | BGA | 17 X 17 MM, 1 MM PITCH, MO-192, FBGA-256 | 256 | compliant | 3A991.B.2.A | 8542.32.00.41 |