Parametric results for: DS250 under OTP ROMs

All Filters Access Time-Max Additional Feature I/O Type JESD-30 Code JESD-609 Code Length Manufacturer Memory Density Memory IC Type Memory Width Moisture Sensitivity Level Mounting Feature Number of Functions Number of Terminals Number of Words Number of Words Code Operating Mode Operating Temperature-Max Operating Temperature-Min Organization Output Characteristics Package Body Material Package Code Package Equivalence Code Package Shape Package Style Supply Voltage-Nom (Vsup) Access Time-Max (1)

15 µs 49

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MICROLAN COMPATIBLE 78

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COMMON 70

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O-PBCY-T3 45 R-PBCY-W3 2 R-PBGA-B135 2 R-PBGA-B2 5 R-PDSO-C6 40 R-PDSO-G3 3 R-PDSO-G6 5 R-PDSO-G8 24 R-PSIP-T3 2 S-PBCC-B2 1 S-PBGA-B101 4 S-PBGA-B36 2 S-PQCC-N32 2

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e0 54 e1 8 e2 4 e3 40 e4 3

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1.6 mm 4 2.92 mm 3 3.937 mm 2 3.94 mm 26 4.9 mm 11 5 mm 4 5.31 mm 4 6 mm 5

Min (mm) - Max (mm)

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Manufacturer (8)

Analog Devices Inc 20 Dallas Semiconductor 41 Ketema Rodan Division 183 Maxim Integrated Products 66 Rochester Electronics LLC 9 RTI Electronics Inc 131 Spectrum Control 132 Texas Instruments 11

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Memory Density (4)

512 bit 4 1.024 kbit 79 16.384 kbit 31 65.536 kbit 15

Min (bit) - Max (bit)

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OTP ROM 132

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Memory Width (2)

1 71 8 58

Min - Max

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1 50 3 8 NOT SPECIFIED 4

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THROUGH HOLE MOUNT 446

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1.0 132 2.0 4

Min - Max

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101 4 135 2 2 452 3 52 32 2 36 2 4 2 6 45 8 24

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64 words 1 128 words 49 512 words 3 1.024 k 30 2.048 k 5 8.192 k 3 16.384 k 26 65.536 k 12

Min (words) - Max (words)

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64.0 1 128.0 49 512.0 3 1000.0 30 2000.0 5 8000.0 3 16000.0 26 64000.0 12

Min - Max

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ASYNCHRONOUS 97 SYNCHRONOUS 25

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85.0 °C 139 150.0 °C 446

Min (°C) - Max (°C)

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-65.0 °C 446 -40.0 °C 137 -10.0 °C 2

Min (°C) - Max (°C)

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Organization (8)

128X8 49 16KX1 26 1KX1 30 2KX8 5 512X1 3 64KX1 12 64X8 1 8KX8 3

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OPEN-DRAIN 26

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PLASTIC/EPOXY 139

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BGA 2 FBGA 1 LFBGA 2 LSOC 10 QCCN 2 SOC 21 SOP 24 TFBGA 4 TO-92 24 TSSOP 3 VBCC 1 VBGA 4

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BGA2,1X2,37 2 BGA4,2X2,37/16 4 LCC32,.2SQ,20 2 SIP3,.1 6 SIP3,.1,50 17 SOC6,.17 22 SOP8,.25 10 SOP8,.3 5 SURF MNT 2,.25SQ 1 TO-236 3

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RECTANGULAR 83 ROUND 45 SQUARE 9 TUBULAR PACKAGE 446

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CHIP CARRIER, HEAT SINK/SLUG 2 CHIP CARRIER, VERY THIN PROFILE 1 CYLINDRICAL 46 GRID ARRAY 2 GRID ARRAY, FINE PITCH 1 GRID ARRAY, LOW PROFILE, FINE PITCH 2 GRID ARRAY, THIN PROFILE, FINE PITCH 4 GRID ARRAY, VERY THIN PROFILE 4 IN-LINE 2 SMALL OUTLINE 56 SMALL OUTLINE, LOW PROFILE 10 SMALL OUTLINE, THIN PROFILE, SHRINK PITCH 3

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Supply Voltage-Nom (Vsup) (1)

5 V 88

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