Findchips: Parametric Search Results for EDI88512CAXN36C

Parametric results for: EDI88512CAXN36C under SRAMs

Select parts from the table below to compare.

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Select Parts		Part Number

		EDI88512CA15N36M Microsemi Corporation
		EDI88512CA25N36M Electronic Designs Inc
		EDI88512CA25KM Electronic Designs Inc
		EDI88512CA25CM Microsemi Corporation
		EDI88512CA20F32I Microsemi Corporation
		EDI88512CA17F36I Microsemi Corporation
		EDI88512CA55F36M White Electronic Designs Corp
		EDI88512CA45C Microsemi Corporation
		EDI88512CA45KC Mercury Systems Inc
		EDI88512CA15F32C White Microelectronics

				Most Relevant					Technical																		Compliance			Operating Conditions				Physical											Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Memory Density	Memory Width	Organization	Supply Voltage-Nom (Vsup)	Access Time-Max	Memory IC Type	Additional Feature	I/O Type	Number of Functions	Number of Ports	Number of Words Code	Number of Words	Operating Mode	Output Characteristics	Output Enable	Parallel/Serial	Standby Current-Max	Standby Voltage-Min	Supply Current-Max	Supply Voltage-Max (Vsup)	Supply Voltage-Min (Vsup)	Technology	Temperature Grade	JESD-30 Code	Qualification Status	JESD-609 Code	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Length	Width	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Reach Compliance Code	ECCN Code	HTS Code

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Transferred

4.1943 Mbit

512KX8

5 V

15 ns

STANDARD SRAM

TTL COMPATIBLE INPUTS/OUTPUTS

512000

524.288 k

ASYNCHRONOUS

PARALLEL

5.5 V

4.5 V

CMOS

MILITARY

R-CDSO-J36

Not Qualified

125 °C

-55 °C

NOT SPECIFIED

CERAMIC, METAL-SEALED COFIRED

SOJ

RECTANGULAR

SMALL OUTLINE

YES

J BEND

1.27 mm

DUAL

3.937 mm

23.622 mm

11.1506 mm

MICROSEMI CORP

SOJ

CERAMIC, SOJ-36

unknown

3A001.A.2.C

8542.32.00.41

Check for Price

Obsolete

4.1943 Mbit

512KX8

5 V

25 ns

STANDARD SRAM

TTL COMPATIBLE INPUTS/OUTPUTS

COMMON

512000

524.288 k

ASYNCHRONOUS

3-STATE

YES

PARALLEL

25 mA

4.5 V

225 µA

5.5 V

4.5 V

CMOS

MILITARY

R-CDSO-J36

Not Qualified

125 °C

-55 °C

CERAMIC, METAL-SEALED COFIRED

SOJ

SOJ36,.44

RECTANGULAR

SMALL OUTLINE

YES

TIN LEAD

J BEND

1.27 mm

DUAL

ELECTRONIC DESIGNS INC

unknown

3A001.A.2.C

8542.32.00.41

Check for Price

Transferred

4.1943 Mbit

512KX8

5 V

25 ns

STANDARD SRAM

TTL COMPATIBLE INPUTS/OUTPUTS

512000

524.288 k

ASYNCHRONOUS

PARALLEL

5.5 V

4.5 V

CMOS

MILITARY

R-CDSO-N36

Not Qualified

125 °C

-55 °C

CERAMIC, METAL-SEALED COFIRED

RECTANGULAR

SMALL OUTLINE

YES

NO LEAD

DUAL

ELECTRONIC DESIGNS INC

unknown

3A001.A.2.C

8542.32.00.41

Check for Price

Transferred

4.1943 Mbit

512KX8

5 V

25 ns

STANDARD SRAM

TTL COMPATIBLE INPUTS/OUTPUTS

512000

524.288 k

ASYNCHRONOUS

PARALLEL

5.5 V

4.5 V

CMOS

MILITARY

R-CDIP-T32

Not Qualified

125 °C

-55 °C

NOT SPECIFIED

CERAMIC, METAL-SEALED COFIRED

DIP

RECTANGULAR

IN-LINE

THROUGH-HOLE

2.54 mm

DUAL

3.937 mm

40.64 mm

15.24 mm

MICROSEMI CORP

DIP

0.600 INCH, SIDE BRAZED, CERAMIC, DIP-32

unknown

3A001.A.2.C

8542.32.00.41

Check for Price

Transferred

4.1943 Mbit

512KX8

5 V

20 ns

STANDARD SRAM

TTL COMPATIBLE INPUTS/OUTPUTS; LG-MAX

512000

524.288 k

ASYNCHRONOUS

PARALLEL

5.5 V

4.5 V

CMOS

INDUSTRIAL

R-CDFP-F32

Not Qualified

85 °C

-40 °C

NOT SPECIFIED

CERAMIC, METAL-SEALED COFIRED

DFP

RECTANGULAR

FLATPACK

YES

FLAT

1.27 mm

DUAL

2.8448 mm

21.2852 mm

10.7442 mm

MICROSEMI CORP

DFP

CERAMIC, DFP-32

unknown

3A991.B.2.A

8542.32.00.41

Check for Price

Transferred

4.1943 Mbit

512KX8

5 V

17 ns

STANDARD SRAM

TTL COMPATIBLE INPUTS/OUTPUTS

512000

524.288 k

ASYNCHRONOUS

PARALLEL

5.5 V

4.5 V

CMOS

INDUSTRIAL

R-CDFP-F36

Not Qualified

85 °C

-40 °C

NOT SPECIFIED

CERAMIC, METAL-SEALED COFIRED

DFP

RECTANGULAR

FLATPACK

YES

FLAT

1.27 mm

DUAL

3.175 mm

23.368 mm

12.954 mm

MICROSEMI CORP

DFP

CERAMIC, DFP-36

unknown

3A991.B.2.A

8542.32.00.41

Check for Price

Transferred

4.1943 Mbit

512KX8

5 V

55 ns

STANDARD SRAM

TTL COMPATIBLE INPUTS/OUTPUTS

COMMON

512000

524.288 k

ASYNCHRONOUS

3-STATE

PARALLEL

25 mA

4.5 V

225 µA

5.5 V

4.5 V

CMOS

MILITARY

R-CDFP-F36

Not Qualified

125 °C

-55 °C

NOT SPECIFIED

CERAMIC, METAL-SEALED COFIRED

DFP

FL36,.5

RECTANGULAR

FLATPACK

YES

FLAT

1.27 mm

DUAL

3.175 mm

23.368 mm

12.954 mm

WHITE ELECTRONIC DESIGNS CORP

CERAMIC, DFP-36

unknown

3A001.A.2.C

8542.32.00.41

Check for Price

Active

STANDARD SRAM

MICROSEMI CORP

unknown

Check for Price

Active

4.1943 Mbit

512KX8

5 V

45 ns

STANDARD SRAM

512000

524.288 k

ASYNCHRONOUS

PARALLEL

225 µA

5.5 V

4.5 V

CMOS

COMMERCIAL

R-CDSO-N36

70 °C

CERAMIC, METAL-SEALED COFIRED

SON

RECTANGULAR

SMALL OUTLINE

YES

NO LEAD

1.27 mm

DUAL

2.54 mm

23.368 mm

11.4935 mm

MERCURY SYSTEMS INC

CERAMIC, LCC-36

compliant

3A991.B.2.A

8542.32.00.41

Check for Price

Obsolete

4.1943 Mbit

512KX8

5 V

15 ns

STANDARD SRAM

512000

524.288 k

ASYNCHRONOUS

PARALLEL

5.5 V

4.5 V

CMOS

COMMERCIAL

R-CDFP-F32

Not Qualified

70 °C

CERAMIC, METAL-SEALED COFIRED

DFP

RECTANGULAR

FLATPACK

YES

FLAT

DUAL

WHITE MICROELECTRONICS

CERAMIC, FP-32

unknown

1 2 3 4 5 Next

Compare

EDI88512CA15N36M

Microsemi Corporation

Check for Price

Transferred

4.1943 Mbit

512KX8

5 V

15 ns

STANDARD SRAM

TTL COMPATIBLE INPUTS/OUTPUTS

512000

524.288 k

ASYNCHRONOUS

PARALLEL

5.5 V

4.5 V

CMOS

MILITARY

R-CDSO-J36

Not Qualified

125 °C

-55 °C

NOT SPECIFIED

CERAMIC, METAL-SEALED COFIRED

SOJ

RECTANGULAR

SMALL OUTLINE

YES

J BEND

1.27 mm

DUAL

3.937 mm

23.622 mm

11.1506 mm

MICROSEMI CORP

SOJ

CERAMIC, SOJ-36

unknown

3A001.A.2.C

8542.32.00.41

EDI88512CA25N36M

Electronic Designs Inc

Check for Price

Obsolete

4.1943 Mbit

512KX8

5 V

25 ns

STANDARD SRAM

TTL COMPATIBLE INPUTS/OUTPUTS

COMMON

512000

524.288 k

ASYNCHRONOUS

3-STATE

YES

PARALLEL

25 mA

4.5 V

225 µA

5.5 V

4.5 V

CMOS

MILITARY

R-CDSO-J36

Not Qualified

125 °C

-55 °C

CERAMIC, METAL-SEALED COFIRED

SOJ

SOJ36,.44

RECTANGULAR

SMALL OUTLINE

YES

TIN LEAD

J BEND

1.27 mm

DUAL

ELECTRONIC DESIGNS INC

unknown

3A001.A.2.C

8542.32.00.41

EDI88512CA25KM

Electronic Designs Inc

Check for Price

Transferred

4.1943 Mbit

512KX8

5 V

25 ns

STANDARD SRAM

TTL COMPATIBLE INPUTS/OUTPUTS

512000

524.288 k

ASYNCHRONOUS

PARALLEL

5.5 V

4.5 V

CMOS

MILITARY

R-CDSO-N36

Not Qualified

125 °C

-55 °C

CERAMIC, METAL-SEALED COFIRED

RECTANGULAR

SMALL OUTLINE

YES

NO LEAD

DUAL

ELECTRONIC DESIGNS INC

unknown

3A001.A.2.C

8542.32.00.41

EDI88512CA25CM

Microsemi Corporation

Check for Price

Transferred

4.1943 Mbit

512KX8

5 V

25 ns

STANDARD SRAM

TTL COMPATIBLE INPUTS/OUTPUTS

512000

524.288 k

ASYNCHRONOUS

PARALLEL

5.5 V

4.5 V

CMOS

MILITARY

R-CDIP-T32

Not Qualified

125 °C

-55 °C

NOT SPECIFIED

CERAMIC, METAL-SEALED COFIRED

DIP

RECTANGULAR

IN-LINE

THROUGH-HOLE

2.54 mm

DUAL

3.937 mm

40.64 mm

15.24 mm

MICROSEMI CORP

DIP

0.600 INCH, SIDE BRAZED, CERAMIC, DIP-32

unknown

3A001.A.2.C

8542.32.00.41

EDI88512CA20F32I

Microsemi Corporation

Check for Price

Transferred

4.1943 Mbit

512KX8

5 V

20 ns

STANDARD SRAM

TTL COMPATIBLE INPUTS/OUTPUTS; LG-MAX

512000

524.288 k

ASYNCHRONOUS

PARALLEL

5.5 V

4.5 V

CMOS

INDUSTRIAL

R-CDFP-F32

Not Qualified

85 °C

-40 °C

NOT SPECIFIED

CERAMIC, METAL-SEALED COFIRED

DFP

RECTANGULAR

FLATPACK

YES

FLAT

1.27 mm

DUAL

2.8448 mm

21.2852 mm

10.7442 mm

MICROSEMI CORP

DFP

CERAMIC, DFP-32

unknown

3A991.B.2.A

8542.32.00.41

EDI88512CA17F36I

Microsemi Corporation

Check for Price

Transferred

4.1943 Mbit

512KX8

5 V

17 ns

STANDARD SRAM

TTL COMPATIBLE INPUTS/OUTPUTS

512000

524.288 k

ASYNCHRONOUS

PARALLEL

5.5 V

4.5 V

CMOS

INDUSTRIAL

R-CDFP-F36

Not Qualified

85 °C

-40 °C

NOT SPECIFIED

CERAMIC, METAL-SEALED COFIRED

DFP

RECTANGULAR

FLATPACK

YES

FLAT

1.27 mm

DUAL

3.175 mm

23.368 mm

12.954 mm

MICROSEMI CORP

DFP

CERAMIC, DFP-36

unknown

3A991.B.2.A

8542.32.00.41

EDI88512CA55F36M

White Electronic Designs Corp

Check for Price

Transferred

4.1943 Mbit

512KX8

5 V

55 ns

STANDARD SRAM

TTL COMPATIBLE INPUTS/OUTPUTS

COMMON

512000

524.288 k

ASYNCHRONOUS

3-STATE

PARALLEL

25 mA

4.5 V

225 µA

5.5 V

4.5 V

CMOS

MILITARY

R-CDFP-F36

Not Qualified

125 °C

-55 °C

NOT SPECIFIED

CERAMIC, METAL-SEALED COFIRED

DFP

FL36,.5

RECTANGULAR

FLATPACK

YES

FLAT

1.27 mm

DUAL

3.175 mm

23.368 mm

12.954 mm

WHITE ELECTRONIC DESIGNS CORP

CERAMIC, DFP-36

unknown

3A001.A.2.C

8542.32.00.41

EDI88512CA45C

Microsemi Corporation

Check for Price

Active

STANDARD SRAM

MICROSEMI CORP

unknown

EDI88512CA45KC

Mercury Systems Inc

Check for Price

Active

4.1943 Mbit

512KX8

5 V

45 ns

STANDARD SRAM

512000

524.288 k

ASYNCHRONOUS

PARALLEL

225 µA

5.5 V

4.5 V

CMOS

COMMERCIAL

R-CDSO-N36

70 °C

CERAMIC, METAL-SEALED COFIRED

SON

RECTANGULAR

SMALL OUTLINE

YES

NO LEAD

1.27 mm

DUAL

2.54 mm

23.368 mm

11.4935 mm

MERCURY SYSTEMS INC

CERAMIC, LCC-36

compliant

3A991.B.2.A

8542.32.00.41

EDI88512CA15F32C

White Microelectronics

Check for Price

Obsolete

4.1943 Mbit

512KX8

5 V

15 ns

STANDARD SRAM

512000

524.288 k

ASYNCHRONOUS

PARALLEL

5.5 V

4.5 V

CMOS

COMMERCIAL

R-CDFP-F32

Not Qualified

70 °C

CERAMIC, METAL-SEALED COFIRED

DFP

RECTANGULAR

FLATPACK

YES

FLAT

DUAL

WHITE MICROELECTRONICS

CERAMIC, FP-32

unknown

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