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FSUSB23BQX_NL
Fairchild Semiconductor Corporation
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Check for Price | Obsolete | 3.3 V | YES | -4.5 V | 10 Ω | 300 mΩ | 13 ns | 11 ns | DIFFERENTIAL MULTIPLEXER | CMOS | -6 V | 2 | 1 | 30 dB | 3.6 V | 3 V | INDUSTRIAL | R-XQCC-N16 | Not Qualified | e3 | 85 °C | -40 °C | 16 | UNSPECIFIED | VQCCN | RECTANGULAR | CHIP CARRIER, VERY THIN PROFILE | TIN | NO LEAD | 500 µm | QUAD | 3.5 mm | 800 µm | 2.5 mm | QFN | 2.50 X 3.50 MM, LEAD FREE, MO-241AB, DQFN-16 | 16 | 8542.39.00.60 | |||||||||||||
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FSUSB23L10X
Fairchild Semiconductor Corporation
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Check for Price | Yes | Yes | Obsolete | 3.3 V | YES | 10 Ω | 300 mΩ | 13 ns | 11 ns | DIFFERENTIAL MULTIPLEXER | 2 | 1 | 30 dB | SEPARATE OUTPUT | 3.6 V | 3 V | BREAK-BEFORE-MAKE | INDUSTRIAL | R-XQCC-N10 | Not Qualified | 1 | 85 °C | -40 °C | 260 | 30 | 10 | UNSPECIFIED | VQCCN | LCC10,.06X.08,20 | RECTANGULAR | CHIP CARRIER, VERY THIN PROFILE | NO LEAD | 500 µm | QUAD | 2.1 mm | 550 µm | 1.6 mm | MICROPAK MLP | 1.60 X 2.10 MM, LEAD FREE, MO-255UABD, MICROPAK-10 | 10 | 8542.31.00.01 | 10LD,MICROPAK,JEDEC MO255,1.6 X 2.1MM (PREMOLDED) | EAR99 | ||||||||
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FSUSB23L10X
Rochester Electronics LLC
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Check for Price | Yes | Yes | Obsolete | DIFFERENTIAL MULTIPLEXER | QFN | 10 | 8542.39.00.60 | ||||||||||||||||||||||||||||||||||||||||||||
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FSUSB23BQX
onsemi
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Check for Price | Yes | Obsolete | 3.3 V | YES | 10 Ω | 300 mΩ | 13 ns | 11 ns | DIFFERENTIAL MULTIPLEXER | CMOS | NO/NC | 2 | 2 | 30 dB | COMMON OUTPUT | 3.6 V | 3 V | BREAK-BEFORE-MAKE | INDUSTRIAL | R-XQCC-N16 | 85 °C | -40 °C | 16 | UNSPECIFIED | HVQCCN | RECTANGULAR | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | NO LEAD | 500 µm | QUAD | 3.5 mm | 800 µm | 2.5 mm | DQFN-16 | 8542.39.00.60 | MLP16E | |||||||||||||||
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FSUSB23BQX
Fairchild Semiconductor Corporation
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Check for Price | Yes | Yes | Obsolete | 3.3 V | YES | 10 Ω | 300 mΩ | 13 ns | 11 ns | DIFFERENTIAL MULTIPLEXER | 2 | 1 | 30 dB | SEPARATE OUTPUT | 3.6 V | 3 V | BREAK-BEFORE-MAKE | INDUSTRIAL | R-XQCC-N16 | Not Qualified | e4 | 1 | 85 °C | -40 °C | 260 | 30 | 16 | UNSPECIFIED | HVQCCN | LCC16,.1X.14,20 | RECTANGULAR | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Nickel/Palladium/Gold (Ni/Pd/Au) | NO LEAD | 500 µm | QUAD | 3.5 mm | 800 µm | 2.5 mm | MLP | 2.50 X 3.50 MM, LEAD FREE, MO-241AB, DQFN-16 | 16 | 8542.31.00.01 | 16LD,DQFN,JEDEC MO-241,2.5 X 3.5MM | EAR99 | ||||||
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FSUSB23MUX
Fairchild Semiconductor Corporation
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Check for Price | Obsolete | 3.3 V | YES | 10 Ω | 300 mΩ | 13 ns | 11 ns | DIFFERENTIAL MULTIPLEXER | 2 | 1 | 30 dB | 3.6 V | 3 V | INDUSTRIAL | S-PDSO-G10 | Not Qualified | 85 °C | -40 °C | 10 | PLASTIC/EPOXY | TSSOP | SQUARE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | GULL WING | 500 µm | DUAL | 3 mm | 1.1 mm | 3 mm | TSSOP | 3 MM, LEAD FREE, MO-187BA, MSOP-10 | 10 | 8542.39.00.60 | ||||||||||||||||||
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FSUSB23L10X
onsemi
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Check for Price | Yes | Obsolete | 3.3 V | YES | 10 Ω | 300 mΩ | 13 ns | 11 ns | DIFFERENTIAL MULTIPLEXER | CMOS | NO/NC | 2 | 2 | 30 dB | COMMON OUTPUT | 3.6 V | 3 V | BREAK-BEFORE-MAKE | INDUSTRIAL | R-XBCC-N16 | 85 °C | -40 °C | 16 | UNSPECIFIED | VQCCN | RECTANGULAR | CHIP CARRIER, VERY THIN PROFILE | NO LEAD | 500 µm | BOTTOM | 2.1 mm | 550 µm | 1.6 mm | MICRO PACK-10 | 8542.39.00.60 | MAC10A |