Findchips: Parametric Search Results for GS8180QV18D-167


Select Parts		Part Number

		GS8180QV18D-167 GSI Technology
		GS8180QV18D-167T GSI Technology
		GS8180QV18D-167IT GSI Technology
		GS8180QV18D-167I GSI Technology

			Most Relevant					Technical											Compliance			Operating Conditions		Physical										Dimensions			Other
Composite Price	Rohs Code	Part Life Cycle Code	Memory Density	Memory Width	Organization	Supply Voltage-Nom (Vsup)	Access Time-Max	Memory IC Type	Additional Feature	Number of Functions	Number of Words Code	Number of Words	Operating Mode	Parallel/Serial	Supply Voltage-Max (Vsup)	Supply Voltage-Min (Vsup)	Technology	Temperature Grade	JESD-30 Code	Qualification Status	JESD-609 Code	Operating Temperature-Max	Operating Temperature-Min	Number of Terminals	Package Body Material	Package Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Length	Width	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Reach Compliance Code	ECCN Code	HTS Code

Check for Price

Obsolete

18.8744 Mbit

1MX18

2.5 V

2.5 ns

STANDARD SRAM

PIPELINED ARCHITECTURE

1000000

1.0486 M

SYNCHRONOUS

PARALLEL

2.6 V

2.4 V

CMOS

COMMERCIAL

R-PBGA-B165

Not Qualified

70 °C

165

PLASTIC/EPOXY

LBGA

RECTANGULAR

GRID ARRAY, LOW PROFILE

YES

TIN LEAD

BALL

1 mm

BOTTOM

1.4 mm

15 mm

13 mm

GSI TECHNOLOGY

BGA

13 X 15 MM, 1 MM PITCH, FPBGA-165

165

not_compliant

3A991.B.2.A

8542.32.00.41

Check for Price

Obsolete

18.8744 Mbit

1MX18

2.5 V

2.5 ns

STANDARD SRAM

PIPELINED ARCHITECTURE

1000000

1.0486 M

SYNCHRONOUS

PARALLEL

2.6 V

2.4 V

CMOS

COMMERCIAL

R-PBGA-B165

Not Qualified

70 °C

165

PLASTIC/EPOXY

LBGA

RECTANGULAR

GRID ARRAY, LOW PROFILE

YES

TIN LEAD

BALL

1 mm

BOTTOM

1.4 mm

15 mm

13 mm

GSI TECHNOLOGY

BGA

13 X 15 MM, 1 MM PITCH, FPBGA-165

165

not_compliant

3A991.B.2.A

8542.32.00.41

Check for Price

Obsolete

18.8744 Mbit

1MX18

2.5 V

2.5 ns

STANDARD SRAM

PIPELINED ARCHITECTURE

1000000

1.0486 M

SYNCHRONOUS

PARALLEL

2.6 V

2.4 V

CMOS

INDUSTRIAL

R-PBGA-B165

Not Qualified

85 °C

-40 °C

165

PLASTIC/EPOXY

LBGA

RECTANGULAR

GRID ARRAY, LOW PROFILE

YES

TIN LEAD

BALL

1 mm

BOTTOM

1.4 mm

15 mm

13 mm

GSI TECHNOLOGY

BGA

13 X 15 MM, 1 MM PITCH, FPBGA-165

165

not_compliant

3A991.B.2.A

8542.32.00.41

Check for Price

Obsolete

18.8744 Mbit

1MX18

2.5 V

2.5 ns

STANDARD SRAM

PIPELINED ARCHITECTURE

1000000

1.0486 M

SYNCHRONOUS

PARALLEL

2.6 V

2.4 V

CMOS

INDUSTRIAL

R-PBGA-B165

Not Qualified

85 °C

-40 °C

165

PLASTIC/EPOXY

LBGA

RECTANGULAR

GRID ARRAY, LOW PROFILE

YES

TIN LEAD

BALL

1 mm

BOTTOM

1.4 mm

15 mm

13 mm

GSI TECHNOLOGY

BGA

13 X 15 MM, 1 MM PITCH, FPBGA-165

165

not_compliant

3A991.B.2.A

8542.32.00.41

Compare

GS8180QV18D-167

GSI Technology

Check for Price

Obsolete

18.8744 Mbit

1MX18

2.5 V

2.5 ns

STANDARD SRAM

PIPELINED ARCHITECTURE

1000000

1.0486 M

SYNCHRONOUS

PARALLEL

2.6 V

2.4 V

CMOS

COMMERCIAL

R-PBGA-B165

Not Qualified

70 °C

165

PLASTIC/EPOXY

LBGA

RECTANGULAR

GRID ARRAY, LOW PROFILE

YES

TIN LEAD

BALL

1 mm

BOTTOM

1.4 mm

15 mm

13 mm

GSI TECHNOLOGY

BGA

13 X 15 MM, 1 MM PITCH, FPBGA-165

165

not_compliant

3A991.B.2.A

8542.32.00.41

GS8180QV18D-167T

GSI Technology

Check for Price

Obsolete

18.8744 Mbit

1MX18

2.5 V

2.5 ns

STANDARD SRAM

PIPELINED ARCHITECTURE

1000000

1.0486 M

SYNCHRONOUS

PARALLEL

2.6 V

2.4 V

CMOS

COMMERCIAL

R-PBGA-B165

Not Qualified

70 °C

165

PLASTIC/EPOXY

LBGA

RECTANGULAR

GRID ARRAY, LOW PROFILE

YES

TIN LEAD

BALL

1 mm

BOTTOM

1.4 mm

15 mm

13 mm

GSI TECHNOLOGY

BGA

13 X 15 MM, 1 MM PITCH, FPBGA-165

165

not_compliant

3A991.B.2.A

8542.32.00.41

GS8180QV18D-167IT

GSI Technology

Check for Price

Obsolete

18.8744 Mbit

1MX18

2.5 V

2.5 ns

STANDARD SRAM

PIPELINED ARCHITECTURE

1000000

1.0486 M

SYNCHRONOUS

PARALLEL

2.6 V

2.4 V

CMOS

INDUSTRIAL

R-PBGA-B165

Not Qualified

85 °C

-40 °C

165

PLASTIC/EPOXY

LBGA

RECTANGULAR

GRID ARRAY, LOW PROFILE

YES

TIN LEAD

BALL

1 mm

BOTTOM

1.4 mm

15 mm

13 mm

GSI TECHNOLOGY

BGA

13 X 15 MM, 1 MM PITCH, FPBGA-165

165

not_compliant

3A991.B.2.A

8542.32.00.41

GS8180QV18D-167I

GSI Technology

Check for Price

Obsolete

18.8744 Mbit

1MX18

2.5 V

2.5 ns

STANDARD SRAM

PIPELINED ARCHITECTURE

1000000

1.0486 M

SYNCHRONOUS

PARALLEL

2.6 V

2.4 V

CMOS

INDUSTRIAL

R-PBGA-B165

Not Qualified

85 °C

-40 °C

165

PLASTIC/EPOXY

LBGA

RECTANGULAR

GRID ARRAY, LOW PROFILE

YES

TIN LEAD

BALL

1 mm

BOTTOM

1.4 mm

15 mm

13 mm

GSI TECHNOLOGY

BGA

13 X 15 MM, 1 MM PITCH, FPBGA-165

165

not_compliant

3A991.B.2.A

8542.32.00.41

Parametric results for: GS8180QV18D-167 under SRAMs