Findchips: Parametric Search Results for GS832272C-166I


Select Parts		Part Number

		GS832272C-166I GSI Technology
		GS832272C-166IVT GSI Technology
		GS832272C-166IV GSI Technology
		GS832272C-166IT GSI Technology

				Most Relevant						Technical																Compliance		Operating Conditions					Physical										Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Memory Density	Memory Width	Organization	Supply Voltage-Nom (Vsup)	Access Time-Max	Clock Frequency-Max (fCLK)	Memory IC Type	Additional Feature	I/O Type	Number of Functions	Number of Words Code	Number of Words	Operating Mode	Output Characteristics	Parallel/Serial	Standby Current-Max	Standby Voltage-Min	Supply Current-Max	Supply Voltage-Max (Vsup)	Supply Voltage-Min (Vsup)	Technology	Temperature Grade	JESD-30 Code	Qualification Status	Moisture Sensitivity Level	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Surface Mount	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Length	Width	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Reach Compliance Code	ECCN Code	HTS Code

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Active

37.7487 Mbit

512KX72

2.5 V

8 ns

166 MHz

CACHE SRAM

FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 3.3V SUPPLY

COMMON

512000

524.288 k

SYNCHRONOUS

3-STATE

PARALLEL

80 mA

2.38 V

300 µA

2.7 V

2.3 V

CMOS

INDUSTRIAL

R-PBGA-B209

Not Qualified

85 °C

-40 °C

220

209

PLASTIC/EPOXY

LBGA

BGA209,11X19,40

RECTANGULAR

GRID ARRAY, LOW PROFILE

YES

BALL

1 mm

BOTTOM

1.7 mm

22 mm

14 mm

GSI TECHNOLOGY

BGA

LBGA, BGA209,11X19,40

209

compliant

3A991.B.2.B

8542.32.00.41

Check for Price

Active

37.7487 Mbit

512KX72

1.8 V

8 ns

CACHE SRAM

FLOW-THROUGH OR PIELINED ARCHITECTURE; ALSO OPERATES AT 2.5V SUPPLY

512000

524.288 k

SYNCHRONOUS

PARALLEL

2 V

1.7 V

CMOS

INDUSTRIAL

R-PBGA-B209

Not Qualified

85 °C

-40 °C

NOT SPECIFIED

209

PLASTIC/EPOXY

LBGA

RECTANGULAR

GRID ARRAY, LOW PROFILE

YES

BALL

1 mm

BOTTOM

1.7 mm

22 mm

14 mm

GSI TECHNOLOGY

BGA

LBGA,

209

compliant

3A991.B.2.A

8542.32.00.41

Check for Price

Active

37.7487 Mbit

512KX72

1.8 V

8 ns

CACHE SRAM

FLOW-THROUGH OR PIELINED ARCHITECTURE; ALSO OPERATES AT 2.5V SUPPLY

512000

524.288 k

SYNCHRONOUS

PARALLEL

2 V

1.7 V

CMOS

INDUSTRIAL

R-PBGA-B209

Not Qualified

85 °C

-40 °C

NOT SPECIFIED

209

PLASTIC/EPOXY

LBGA

RECTANGULAR

GRID ARRAY, LOW PROFILE

YES

BALL

1 mm

BOTTOM

1.7 mm

22 mm

14 mm

GSI TECHNOLOGY

BGA

LBGA,

209

compliant

3A991.B.2.B

8542.32.00.41

Check for Price

Active

37.7487 Mbit

512KX72

2.5 V

8 ns

166 MHz

CACHE SRAM

FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 3.3V SUPPLY

COMMON

512000

524.288 k

SYNCHRONOUS

3-STATE

PARALLEL

80 mA

2.38 V

300 µA

2.7 V

2.3 V

CMOS

INDUSTRIAL

R-PBGA-B209

Not Qualified

85 °C

-40 °C

220

209

PLASTIC/EPOXY

LBGA

BGA209,11X19,40

RECTANGULAR

GRID ARRAY, LOW PROFILE

YES

BALL

1 mm

BOTTOM

1.7 mm

22 mm

14 mm

GSI TECHNOLOGY

BGA

LBGA, BGA209,11X19,40

209

compliant

3A991.B.2.A

8542.32.00.41

Compare

GS832272C-166I

GSI Technology

Check for Price

Active

37.7487 Mbit

512KX72

2.5 V

8 ns

166 MHz

CACHE SRAM

FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 3.3V SUPPLY

COMMON

512000

524.288 k

SYNCHRONOUS

3-STATE

PARALLEL

80 mA

2.38 V

300 µA

2.7 V

2.3 V

CMOS

INDUSTRIAL

R-PBGA-B209

Not Qualified

85 °C

-40 °C

220

209

PLASTIC/EPOXY

LBGA

BGA209,11X19,40

RECTANGULAR

GRID ARRAY, LOW PROFILE

YES

BALL

1 mm

BOTTOM

1.7 mm

22 mm

14 mm

GSI TECHNOLOGY

BGA

LBGA, BGA209,11X19,40

209

compliant

3A991.B.2.B

8542.32.00.41

GS832272C-166IVT

GSI Technology

Check for Price

Active

37.7487 Mbit

512KX72

1.8 V

8 ns

CACHE SRAM

FLOW-THROUGH OR PIELINED ARCHITECTURE; ALSO OPERATES AT 2.5V SUPPLY

512000

524.288 k

SYNCHRONOUS

PARALLEL

2 V

1.7 V

CMOS

INDUSTRIAL

R-PBGA-B209

Not Qualified

85 °C

-40 °C

NOT SPECIFIED

209

PLASTIC/EPOXY

LBGA

RECTANGULAR

GRID ARRAY, LOW PROFILE

YES

BALL

1 mm

BOTTOM

1.7 mm

22 mm

14 mm

GSI TECHNOLOGY

BGA

LBGA,

209

compliant

3A991.B.2.A

8542.32.00.41

GS832272C-166IV

GSI Technology

Check for Price

Active

37.7487 Mbit

512KX72

1.8 V

8 ns

CACHE SRAM

FLOW-THROUGH OR PIELINED ARCHITECTURE; ALSO OPERATES AT 2.5V SUPPLY

512000

524.288 k

SYNCHRONOUS

PARALLEL

2 V

1.7 V

CMOS

INDUSTRIAL

R-PBGA-B209

Not Qualified

85 °C

-40 °C

NOT SPECIFIED

209

PLASTIC/EPOXY

LBGA

RECTANGULAR

GRID ARRAY, LOW PROFILE

YES

BALL

1 mm

BOTTOM

1.7 mm

22 mm

14 mm

GSI TECHNOLOGY

BGA

LBGA,

209

compliant

3A991.B.2.B

8542.32.00.41

GS832272C-166IT

GSI Technology

Check for Price

Active

37.7487 Mbit

512KX72

2.5 V

8 ns

166 MHz

CACHE SRAM

FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 3.3V SUPPLY

COMMON

512000

524.288 k

SYNCHRONOUS

3-STATE

PARALLEL

80 mA

2.38 V

300 µA

2.7 V

2.3 V

CMOS

INDUSTRIAL

R-PBGA-B209

Not Qualified

85 °C

-40 °C

220

209

PLASTIC/EPOXY

LBGA

BGA209,11X19,40

RECTANGULAR

GRID ARRAY, LOW PROFILE

YES

BALL

1 mm

BOTTOM

1.7 mm

22 mm

14 mm

GSI TECHNOLOGY

BGA

LBGA, BGA209,11X19,40

209

compliant

3A991.B.2.A

8542.32.00.41

Parametric results for: GS832272C-166I under SRAMs