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GS8662Q36BD-300IT
GSI Technology
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Check for Price | No | No | Active | 75.4975 Mbit | 36 | 2MX36 | 1.8 V | 450 ps | 300 MHz | QDR SRAM | PIPELINED ARCHITECTURE | SEPARATE | 1 | 2000000 | 2.0972 M | SYNCHRONOUS | 3-STATE | PARALLEL | 1.7 V | 1.07 mA | 1.9 V | 1.7 V | CMOS | INDUSTRIAL | R-PBGA-B165 | Not Qualified | e0 | 85 °C | -40 °C | 165 | PLASTIC/EPOXY | LBGA | BGA165,11X15,40 | RECTANGULAR | GRID ARRAY, LOW PROFILE | YES | TIN LEAD | BALL | 1 mm | BOTTOM | 1.4 mm | 15 mm | 13 mm | GSI TECHNOLOGY | BGA | LBGA, BGA165,11X15,40 | 165 | compliant | 3A991.B.2.A | 8542.32.00.41 | |||||
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GS8662Q36BD-300I
GSI Technology
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Check for Price | No | No | Active | 75.4975 Mbit | 36 | 2MX36 | 1.8 V | 450 ps | 300 MHz | QDR SRAM | PIPELINED ARCHITECTURE | SEPARATE | 1 | 2000000 | 2.0972 M | SYNCHRONOUS | 3-STATE | PARALLEL | 1.7 V | 1.07 mA | 1.9 V | 1.7 V | CMOS | INDUSTRIAL | R-PBGA-B165 | Not Qualified | e0 | 85 °C | -40 °C | 165 | PLASTIC/EPOXY | LBGA | BGA165,11X15,40 | RECTANGULAR | GRID ARRAY, LOW PROFILE | YES | TIN LEAD | BALL | 1 mm | BOTTOM | 1.4 mm | 15 mm | 13 mm | GSI TECHNOLOGY | BGA | LBGA, BGA165,11X15,40 | 165 | compliant | 3A991.B.2.B | 8542.32.00.41 | |||||
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GS8662Q36BD-300M
GSI Technology
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Check for Price | No | Active | 75.4975 Mbit | 36 | 2MX36 | 1.8 V | 450 ps | QDR SRAM | 1 | 2000000 | 2.0972 M | SYNCHRONOUS | PARALLEL | 1.9 V | 1.7 V | CMOS | MILITARY | R-PBGA-B165 | e0 | 125 °C | -55 °C | NOT SPECIFIED | NOT SPECIFIED | 165 | PLASTIC/EPOXY | LBGA | RECTANGULAR | GRID ARRAY, LOW PROFILE | YES | Tin/Lead (Sn/Pb) | BALL | 1 mm | BOTTOM | 1.4 mm | 15 mm | 13 mm | GSI TECHNOLOGY | LBGA, | compliant | 3A991.B.2.B | 8542.32.00.41 | GSI TECHNOLOGY | |||||||||||||
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GS8662Q36BD-300T
GSI Technology
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Check for Price | No | No | Active | 75.4975 Mbit | 36 | 2MX36 | 1.8 V | 450 ps | 300 MHz | QDR SRAM | PIPELINED ARCHITECTURE | SEPARATE | 1 | 2000000 | 2.0972 M | SYNCHRONOUS | 3-STATE | PARALLEL | 1.7 V | 1.06 mA | 1.9 V | 1.7 V | CMOS | COMMERCIAL | R-PBGA-B165 | Not Qualified | e0 | 70 °C | 165 | PLASTIC/EPOXY | LBGA | BGA165,11X15,40 | RECTANGULAR | GRID ARRAY, LOW PROFILE | YES | TIN LEAD | BALL | 1 mm | BOTTOM | 1.4 mm | 15 mm | 13 mm | GSI TECHNOLOGY | BGA | LBGA, BGA165,11X15,40 | 165 | compliant | 3A991.B.2.A | 8542.32.00.41 | ||||||
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GS8662Q36BD-300
GSI Technology
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Check for Price | No | No | Active | 75.4975 Mbit | 36 | 2MX36 | 1.8 V | 450 ps | 300 MHz | QDR SRAM | PIPELINED ARCHITECTURE | SEPARATE | 1 | 2000000 | 2.0972 M | SYNCHRONOUS | 3-STATE | PARALLEL | 1.7 V | 1.06 mA | 1.9 V | 1.7 V | CMOS | COMMERCIAL | R-PBGA-B165 | Not Qualified | e0 | 70 °C | 165 | PLASTIC/EPOXY | LBGA | BGA165,11X15,40 | RECTANGULAR | GRID ARRAY, LOW PROFILE | YES | TIN LEAD | BALL | 1 mm | BOTTOM | 1.4 mm | 15 mm | 13 mm | GSI TECHNOLOGY | BGA | LBGA, BGA165,11X15,40 | 165 | compliant | 3A991.B.2.B | 8542.32.00.41 | ||||||
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GS8662Q36BD-300MT
GSI Technology
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Check for Price | Active | 75.4975 Mbit | 36 | 2MX36 | 1.8 V | 450 ps | QDR SRAM | 1 | 2000000 | 2.0972 M | SYNCHRONOUS | PARALLEL | 1.9 V | 1.7 V | CMOS | MILITARY | R-PBGA-B165 | 125 °C | -55 °C | 165 | PLASTIC/EPOXY | LBGA | RECTANGULAR | GRID ARRAY, LOW PROFILE | YES | BALL | 1 mm | BOTTOM | 1.4 mm | 15 mm | 13 mm | GSI TECHNOLOGY | LBGA, | compliant | 3A001.A.2.C | 8542.32.00.41 |