Findchips.com

Register or Sign In

Parametric » Memory » SRAMs

Parametric results for: GS8673ED36BGK-550 under SRAMs

Select parts from the table below to compare.

Compare


Select Parts		Part Number

		GS8673ED36BGK-550IS GSI Technology
		GS8673ED36BGK-550S GSI Technology
		GS8673ED36BGK-550I GSI Technology
		GS8673ED36BGK-550 GSI Technology

			Most Relevant				Technical											Compliance		Operating Conditions		Physical										Dimensions			Other
Composite Price	Rohs Code	Part Life Cycle Code	Memory Density	Memory Width	Organization	Supply Voltage-Nom (Vsup)	Memory IC Type	Additional Feature	Number of Functions	Number of Words Code	Number of Words	Operating Mode	Parallel/Serial	Supply Voltage-Max (Vsup)	Supply Voltage-Min (Vsup)	Technology	Temperature Grade	JESD-30 Code	JESD-609 Code	Moisture Sensitivity Level	Operating Temperature-Max	Number of Terminals	Package Body Material	Package Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Length	Width	Ihs Manufacturer	Package Description	Reach Compliance Code	ECCN Code	HTS Code

Check for Price

Yes

Active

75.4975 Mbit

36

2MX36

1.35 V

DDR SRAM

1

2000000

2.0972 M

SYNCHRONOUS

PARALLEL

1.4 V

1.3 V

CMOS

R-PBGA-B260

e1

3

260

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

YES

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

1 mm

BOTTOM

2.3 mm

22 mm

14 mm

GSI TECHNOLOGY

BGA,

compliant

3A991.B.2.B

8542.32.00.41

Check for Price

Yes

Active

75.4975 Mbit

36

2MX36

1.35 V

DDR SRAM

1

2000000

2.0972 M

SYNCHRONOUS

PARALLEL

1.4 V

1.3 V

CMOS

OTHER

R-PBGA-B260

e1

3

85 °C

260

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

YES

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

1 mm

BOTTOM

2.3 mm

22 mm

14 mm

GSI TECHNOLOGY

BGA,

compliant

3A991.B.2.B

8542.32.00.41

Check for Price

Yes

Active

75.4975 Mbit

36

2MX36

1.3 V

QDR III SRAM

IT ALSO OPERATES AT 1.35 V TYPICAL VOLTAGE

1

2000000

2.0972 M

SYNCHRONOUS

PARALLEL

1.4 V

1.25 V

CMOS

R-PBGA-B260

e1

3

260

PLASTIC/EPOXY

HBGA

RECTANGULAR

GRID ARRAY, HEAT SINK/SLUG

YES

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

1 mm

BOTTOM

2.3 mm

22 mm

14 mm

GSI TECHNOLOGY

HBGA,

compliant

3A991.B.2.B

8542.32.00.41

Check for Price

Yes

Active

75.4975 Mbit

36

2MX36

1.3 V

QDR III SRAM

IT ALSO OPERATES AT 1.35 V TYPICAL VOLTAGE

1

2000000

2.0972 M

SYNCHRONOUS

PARALLEL

1.4 V

1.25 V

CMOS

OTHER

R-PBGA-B260

e1

3

85 °C

260

PLASTIC/EPOXY

HBGA

RECTANGULAR

GRID ARRAY, HEAT SINK/SLUG

YES

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

1 mm

BOTTOM

2.3 mm

22 mm

14 mm

GSI TECHNOLOGY

HBGA,

compliant

3A991.B.2.B

8542.32.00.41

Compare

GS8673ED36BGK-550IS

GSI Technology

Check for Price

Yes

Active

75.4975 Mbit

36

2MX36

1.35 V

DDR SRAM

1

2000000

2.0972 M

SYNCHRONOUS

PARALLEL

1.4 V

1.3 V

CMOS

R-PBGA-B260

e1

3

260

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

YES

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

1 mm

BOTTOM

2.3 mm

22 mm

14 mm

GSI TECHNOLOGY

BGA,

compliant

3A991.B.2.B

8542.32.00.41

GS8673ED36BGK-550S

GSI Technology

Check for Price

Yes

Active

75.4975 Mbit

36

2MX36

1.35 V

DDR SRAM

1

2000000

2.0972 M

SYNCHRONOUS

PARALLEL

1.4 V

1.3 V

CMOS

OTHER

R-PBGA-B260

e1

3

85 °C

260

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

YES

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

1 mm

BOTTOM

2.3 mm

22 mm

14 mm

GSI TECHNOLOGY

BGA,

compliant

3A991.B.2.B

8542.32.00.41

GS8673ED36BGK-550I

GSI Technology

Check for Price

Yes

Active

75.4975 Mbit

36

2MX36

1.3 V

QDR III SRAM

IT ALSO OPERATES AT 1.35 V TYPICAL VOLTAGE

1

2000000

2.0972 M

SYNCHRONOUS

PARALLEL

1.4 V

1.25 V

CMOS

R-PBGA-B260

e1

3

260

PLASTIC/EPOXY

HBGA

RECTANGULAR

GRID ARRAY, HEAT SINK/SLUG

YES

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

1 mm

BOTTOM

2.3 mm

22 mm

14 mm

GSI TECHNOLOGY

HBGA,

compliant

3A991.B.2.B

8542.32.00.41

GS8673ED36BGK-550

GSI Technology

Check for Price

Yes

Active

75.4975 Mbit

36

2MX36

1.3 V

QDR III SRAM

IT ALSO OPERATES AT 1.35 V TYPICAL VOLTAGE

1

2000000

2.0972 M

SYNCHRONOUS

PARALLEL

1.4 V

1.25 V

CMOS

OTHER

R-PBGA-B260

e1

3

85 °C

260

PLASTIC/EPOXY

HBGA

RECTANGULAR

GRID ARRAY, HEAT SINK/SLUG

YES

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

1 mm

BOTTOM

2.3 mm

22 mm

14 mm

GSI TECHNOLOGY

HBGA,

compliant

3A991.B.2.B

8542.32.00.41