Findchips: Parametric Search Results for GS88236CD-300


Select Parts		Part Number

		GS88236CD-300T GSI Technology
		GS88236CD-300I GSI Technology
		GS88236CD-300MT GSI Technology
		GS88236CD-300IT GSI Technology
		GS88236CD-300 GSI Technology
		GS88236CD-300M GSI Technology

				Most Relevant					Technical											Compliance			Operating Conditions				Physical										Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Memory Density	Memory Width	Organization	Supply Voltage-Nom (Vsup)	Access Time-Max	Memory IC Type	Additional Feature	Number of Functions	Number of Words Code	Number of Words	Operating Mode	Parallel/Serial	Supply Voltage-Max (Vsup)	Supply Voltage-Min (Vsup)	Technology	Temperature Grade	JESD-30 Code	Qualification Status	JESD-609 Code	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Length	Width	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Reach Compliance Code	ECCN Code	HTS Code

Check for Price

Active

9.4372 Mbit

256KX36

2.5 V

5 ns

CACHE SRAM

PIPELINED/FLOW-THROUGH ARCHITECTURE, IT ALSO OPERATES WITH 3 V TO 3.6 V SUPPLY

256000

262.144 k

SYNCHRONOUS

PARALLEL

2.7 V

2.3 V

CMOS

COMMERCIAL

R-PBGA-B165

Not Qualified

70 °C

165

PLASTIC/EPOXY

LBGA

RECTANGULAR

GRID ARRAY, LOW PROFILE

YES

TIN LEAD

BALL

1 mm

BOTTOM

1.4 mm

15 mm

13 mm

GSI TECHNOLOGY

BGA

LBGA,

165

compliant

3A991.B.2.A

8542.32.00.41

Check for Price

Active

9.4372 Mbit

256KX36

2.5 V

5 ns

CACHE SRAM

PIPELINED/FLOW-THROUGH ARCHITECTURE, IT ALSO OPERATES WITH 3 V TO 3.6 V SUPPLY

256000

262.144 k

SYNCHRONOUS

PARALLEL

2.7 V

2.3 V

CMOS

INDUSTRIAL

R-PBGA-B165

Not Qualified

85 °C

-40 °C

165

PLASTIC/EPOXY

LBGA

RECTANGULAR

GRID ARRAY, LOW PROFILE

YES

TIN LEAD

BALL

1 mm

BOTTOM

1.4 mm

15 mm

13 mm

GSI TECHNOLOGY

BGA

LBGA,

165

compliant

3A991.B.2.B

8542.32.00.41

Check for Price

Active

9.4372 Mbit

256KX36

2.5 V

5 ns

CACHE SRAM

FLOW-THROUGH OR PIPELINED ARCHITECTURE, IT CAN ALSO OPERATES AT AS 3.3 V SUPPLY

256000

262.144 k

SYNCHRONOUS

PARALLEL

2.7 V

2.3 V

CMOS

MILITARY

R-PBGA-B165

Not Qualified

125 °C

-55 °C

165

PLASTIC/EPOXY

LBGA

RECTANGULAR

GRID ARRAY, LOW PROFILE

YES

BALL

1 mm

BOTTOM

1.4 mm

15 mm

13 mm

GSI TECHNOLOGY

BGA

LBGA,

165

compliant

3A001.A.2.C

8542.32.00.41

Check for Price

Active

9.4372 Mbit

256KX36

2.5 V

5 ns

CACHE SRAM

PIPELINED/FLOW-THROUGH ARCHITECTURE, IT ALSO OPERATES WITH 3 V TO 3.6 V SUPPLY

256000

262.144 k

SYNCHRONOUS

PARALLEL

2.7 V

2.3 V

CMOS

INDUSTRIAL

R-PBGA-B165

Not Qualified

85 °C

-40 °C

165

PLASTIC/EPOXY

LBGA

RECTANGULAR

GRID ARRAY, LOW PROFILE

YES

TIN LEAD

BALL

1 mm

BOTTOM

1.4 mm

15 mm

13 mm

GSI TECHNOLOGY

BGA

LBGA,

165

compliant

3A991.B.2.A

8542.32.00.41

Check for Price

Active

9.4372 Mbit

256KX36

2.5 V

5 ns

CACHE SRAM

PIPELINED/FLOW-THROUGH ARCHITECTURE, IT ALSO OPERATES WITH 3 V TO 3.6 V SUPPLY

256000

262.144 k

SYNCHRONOUS

PARALLEL

2.7 V

2.3 V

CMOS

COMMERCIAL

R-PBGA-B165

Not Qualified

70 °C

165

PLASTIC/EPOXY

LBGA

RECTANGULAR

GRID ARRAY, LOW PROFILE

YES

TIN LEAD

BALL

1 mm

BOTTOM

1.4 mm

15 mm

13 mm

GSI TECHNOLOGY

BGA

LBGA,

165

compliant

3A991.B.2.B

8542.32.00.41

Check for Price

Active

9.4372 Mbit

256KX36

2.5 V

5 ns

CACHE SRAM

FLOW-THROUGH OR PIPELINED ARCHITECTURE, IT CAN ALSO OPERATES AT AS 3.3 V SUPPLY

256000

262.144 k

SYNCHRONOUS

PARALLEL

2.7 V

2.3 V

CMOS

MILITARY

R-PBGA-B165

Not Qualified

125 °C

-55 °C

NOT SPECIFIED

165

PLASTIC/EPOXY

LBGA

RECTANGULAR

GRID ARRAY, LOW PROFILE

YES

BALL

1 mm

BOTTOM

1.4 mm

15 mm

13 mm

GSI TECHNOLOGY

BGA

LBGA,

165

compliant

3A991.B.2.B

8542.32.00.41

Compare

GS88236CD-300T

GSI Technology

Check for Price

Active

9.4372 Mbit

256KX36

2.5 V

5 ns

CACHE SRAM

PIPELINED/FLOW-THROUGH ARCHITECTURE, IT ALSO OPERATES WITH 3 V TO 3.6 V SUPPLY

256000

262.144 k

SYNCHRONOUS

PARALLEL

2.7 V

2.3 V

CMOS

COMMERCIAL

R-PBGA-B165

Not Qualified

70 °C

165

PLASTIC/EPOXY

LBGA

RECTANGULAR

GRID ARRAY, LOW PROFILE

YES

TIN LEAD

BALL

1 mm

BOTTOM

1.4 mm

15 mm

13 mm

GSI TECHNOLOGY

BGA

LBGA,

165

compliant

3A991.B.2.A

8542.32.00.41

GS88236CD-300I

GSI Technology

Check for Price

Active

9.4372 Mbit

256KX36

2.5 V

5 ns

CACHE SRAM

PIPELINED/FLOW-THROUGH ARCHITECTURE, IT ALSO OPERATES WITH 3 V TO 3.6 V SUPPLY

256000

262.144 k

SYNCHRONOUS

PARALLEL

2.7 V

2.3 V

CMOS

INDUSTRIAL

R-PBGA-B165

Not Qualified

85 °C

-40 °C

165

PLASTIC/EPOXY

LBGA

RECTANGULAR

GRID ARRAY, LOW PROFILE

YES

TIN LEAD

BALL

1 mm

BOTTOM

1.4 mm

15 mm

13 mm

GSI TECHNOLOGY

BGA

LBGA,

165

compliant

3A991.B.2.B

8542.32.00.41

GS88236CD-300MT

GSI Technology

Check for Price

Active

9.4372 Mbit

256KX36

2.5 V

5 ns

CACHE SRAM

FLOW-THROUGH OR PIPELINED ARCHITECTURE, IT CAN ALSO OPERATES AT AS 3.3 V SUPPLY

256000

262.144 k

SYNCHRONOUS

PARALLEL

2.7 V

2.3 V

CMOS

MILITARY

R-PBGA-B165

Not Qualified

125 °C

-55 °C

165

PLASTIC/EPOXY

LBGA

RECTANGULAR

GRID ARRAY, LOW PROFILE

YES

BALL

1 mm

BOTTOM

1.4 mm

15 mm

13 mm

GSI TECHNOLOGY

BGA

LBGA,

165

compliant

3A001.A.2.C

8542.32.00.41

GS88236CD-300IT

GSI Technology

Check for Price

Active

9.4372 Mbit

256KX36

2.5 V

5 ns

CACHE SRAM

PIPELINED/FLOW-THROUGH ARCHITECTURE, IT ALSO OPERATES WITH 3 V TO 3.6 V SUPPLY

256000

262.144 k

SYNCHRONOUS

PARALLEL

2.7 V

2.3 V

CMOS

INDUSTRIAL

R-PBGA-B165

Not Qualified

85 °C

-40 °C

165

PLASTIC/EPOXY

LBGA

RECTANGULAR

GRID ARRAY, LOW PROFILE

YES

TIN LEAD

BALL

1 mm

BOTTOM

1.4 mm

15 mm

13 mm

GSI TECHNOLOGY

BGA

LBGA,

165

compliant

3A991.B.2.A

8542.32.00.41

GS88236CD-300

GSI Technology

Check for Price

Active

9.4372 Mbit

256KX36

2.5 V

5 ns

CACHE SRAM

PIPELINED/FLOW-THROUGH ARCHITECTURE, IT ALSO OPERATES WITH 3 V TO 3.6 V SUPPLY

256000

262.144 k

SYNCHRONOUS

PARALLEL

2.7 V

2.3 V

CMOS

COMMERCIAL

R-PBGA-B165

Not Qualified

70 °C

165

PLASTIC/EPOXY

LBGA

RECTANGULAR

GRID ARRAY, LOW PROFILE

YES

TIN LEAD

BALL

1 mm

BOTTOM

1.4 mm

15 mm

13 mm

GSI TECHNOLOGY

BGA

LBGA,

165

compliant

3A991.B.2.B

8542.32.00.41

GS88236CD-300M

GSI Technology

Check for Price

Active

9.4372 Mbit

256KX36

2.5 V

5 ns

CACHE SRAM

FLOW-THROUGH OR PIPELINED ARCHITECTURE, IT CAN ALSO OPERATES AT AS 3.3 V SUPPLY

256000

262.144 k

SYNCHRONOUS

PARALLEL

2.7 V

2.3 V

CMOS

MILITARY

R-PBGA-B165

Not Qualified

125 °C

-55 °C

NOT SPECIFIED

165

PLASTIC/EPOXY

LBGA

RECTANGULAR

GRID ARRAY, LOW PROFILE

YES

BALL

1 mm

BOTTOM

1.4 mm

15 mm

13 mm

GSI TECHNOLOGY

BGA

LBGA,

165

compliant

3A991.B.2.B

8542.32.00.41

Parametric results for: GS88236CD-300 under SRAMs