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GS882Z18CD-300I
GSI Technology
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Check for Price | No | No | Active | 9.4372 Mbit | 18 | 512KX18 | 2.5 V | 5 ns | ZBT SRAM | FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 3.3V SUPPLY | 1 | 512000 | 524.288 k | SYNCHRONOUS | PARALLEL | 2.7 V | 2.3 V | CMOS | INDUSTRIAL | R-PBGA-B165 | Not Qualified | e0 | 85 °C | -40 °C | 165 | PLASTIC/EPOXY | LBGA | RECTANGULAR | GRID ARRAY, LOW PROFILE | YES | TIN LEAD | BALL | 1 mm | BOTTOM | 1.4 mm | 15 mm | 13 mm | GSI TECHNOLOGY | BGA | LBGA, | 165 | compliant | 3A991.B.2.B | 8542.32.00.41 | ||
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GS882Z18CD-300IT
GSI Technology
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Check for Price | No | No | Active | 9.4372 Mbit | 18 | 512KX18 | 2.5 V | 5 ns | ZBT SRAM | FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 3.3V SUPPLY | 1 | 512000 | 524.288 k | SYNCHRONOUS | PARALLEL | 2.7 V | 2.3 V | CMOS | INDUSTRIAL | R-PBGA-B165 | Not Qualified | e0 | 85 °C | -40 °C | 165 | PLASTIC/EPOXY | LBGA | RECTANGULAR | GRID ARRAY, LOW PROFILE | YES | TIN LEAD | BALL | 1 mm | BOTTOM | 1.4 mm | 15 mm | 13 mm | GSI TECHNOLOGY | BGA | LBGA, | 165 | compliant | 3A991.B.2.A | 8542.32.00.41 |