Findchips: Parametric Search Results for HN58X2564I


Select Parts		Part Number

		HN58X2564TI Renesas Electronics Corporation
		HN58X2564NI Renesas Electronics Corporation
		HN58X2564TIE Renesas Electronics Corporation
		HN58X2564TIAG Renesas Electronics Corporation
		HN58X2564FPI Renesas Electronics Corporation
		HN58X2564FPIE Renesas Electronics Corporation
		HN58X2564FPIAG Renesas Electronics Corporation

				Most Relevant					Technical																	Compliance			Operating Conditions					Physical											Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Memory Density	Memory Width	Organization	Supply Voltage-Nom (Vsup)	Clock Frequency-Max (fCLK)	Memory IC Type	Data Retention Time-Min	Endurance	Number of Functions	Number of Words Code	Number of Words	Operating Mode	Parallel/Serial	Serial Bus Type	Standby Current-Max	Supply Current-Max	Supply Voltage-Max (Vsup)	Supply Voltage-Min (Vsup)	Technology	Temperature Grade	Write Cycle Time-Max (tWC)	Write Protection	JESD-30 Code	Qualification Status	JESD-609 Code	Moisture Sensitivity Level	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Length	Width	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Reach Compliance Code	ECCN Code	HTS Code	Manufacturer Package Code	Samacsys Manufacturer

Check for Price

Transferred

65.536 kbit

8KX8

2.5 V

3 MHz

EEPROM

100000 Write/Erase Cycles

8000

8.192 k

SYNCHRONOUS

SERIAL

SPI

3 µA

3.5 µA

5.5 V

1.8 V

CMOS

INDUSTRIAL

8 ms

HARDWARE/SOFTWARE

R-PDSO-G8

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

TSSOP

TSSOP8,.25

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

YES

TIN LEAD

GULL WING

650 µm

DUAL

1.1 mm

4.4 mm

3 mm

RENESAS ELECTRONICS CORP

SOIC

PLASTIC, TSSOP-8

compliant

EAR99

8542.32.00.51

Check for Price

Obsolete

65.536 kbit

8KX8

2.5 V

3 MHz

EEPROM

100000 Write/Erase Cycles

8000

8.192 k

SYNCHRONOUS

SERIAL

SPI

3 µA

3.5 µA

5.5 V

1.8 V

CMOS

INDUSTRIAL

8 ms

HARDWARE/SOFTWARE

R-PDSO-N8

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

VSON

FL8,.15,25

RECTANGULAR

SMALL OUTLINE, VERY THIN PROFILE

YES

TIN LEAD

NO LEAD

650 µm

DUAL

800 µm

3.6 mm

3 mm

RENESAS TECHNOLOGY CORP

SON

VSON, FL8,.15,25

unknown

EAR99

8542.32.00.51

Check for Price

Obsolete

65.536 kbit

8KX8

2.5 V

3 MHz

EEPROM

8000

8.192 k

SYNCHRONOUS

SERIAL

SPI

5.5 V

1.8 V

CMOS

INDUSTRIAL

8 ms

R-PDSO-G8

Not Qualified

85 °C

-40 °C

NOT SPECIFIED

PLASTIC/EPOXY

TSSOP

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

YES

GULL WING

650 µm

DUAL

1.1 mm

4.4 mm

3 mm

RENESAS ELECTRONICS CORP

TSSOP(8)

TSSOP,

compliant

EAR99

8542.32.00.51

PTSP0008JC-B

Renesas Electronics

Check for Price

Yes

Transferred

65.536 kbit

8KX8

2.5 V

3 MHz

EEPROM

8000

8.192 k

SYNCHRONOUS

SERIAL

SPI

5.5 V

1.8 V

CMOS

INDUSTRIAL

8 ms

R-PDSO-G8

Not Qualified

85 °C

-40 °C

260

PLASTIC/EPOXY

TSSOP

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

YES

GULL WING

650 µm

DUAL

1.1 mm

4.4 mm

3 mm

RENESAS ELECTRONICS CORP

SOIC

TSSOP,

unknown

EAR99

8542.32.00.51

Check for Price

Transferred

65.536 kbit

8KX8

2.5 V

3 MHz

EEPROM

100000 Write/Erase Cycles

8000

8.192 k

SYNCHRONOUS

SERIAL

SPI

3 µA

3.5 µA

5.5 V

1.8 V

CMOS

INDUSTRIAL

8 ms

HARDWARE/SOFTWARE

R-PDSO-G8

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

SOP

SOP8,.25

RECTANGULAR

SMALL OUTLINE

YES

TIN LEAD

GULL WING

1.27 mm

DUAL

1.73 mm

4.89 mm

3.9 mm

RENESAS ELECTRONICS CORP

SOIC

0.150 INCH, PLASTIC, SOP-8

compliant

EAR99

8542.32.00.51

Check for Price

Not Recommended

65.536 kbit

8KX8

2.5 V

3 MHz

EEPROM

8000

8.192 k

SYNCHRONOUS

SERIAL

SPI

5.5 V

1.8 V

CMOS

INDUSTRIAL

8 ms

R-PDSO-G8

Not Qualified

85 °C

-40 °C

NOT SPECIFIED

PLASTIC/EPOXY

SOP

RECTANGULAR

SMALL OUTLINE

YES

GULL WING

1.27 mm

DUAL

1.73 mm

4.89 mm

3.9 mm

RENESAS ELECTRONICS CORP

SOP(8)

SOP,

compliant

EAR99

8542.32.00.51

PRSP0008DF-B

Renesas Electronics

Check for Price

Yes

Obsolete

65.536 kbit

8KX8

2.5 V

3 MHz

EEPROM

8000

8.192 k

SYNCHRONOUS

SERIAL

SPI

5.5 V

1.8 V

CMOS

INDUSTRIAL

8 ms

R-PDSO-G8

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

SOP

RECTANGULAR

SMALL OUTLINE

YES

GULL WING

1.27 mm

DUAL

1.73 mm

4.89 mm

3.9 mm

RENESAS ELECTRONICS CORP

SOIC

SOP,

unknown

EAR99

8542.32.00.51

Compare

HN58X2564TI

Renesas Electronics Corporation

Check for Price

Transferred

65.536 kbit

8KX8

2.5 V

3 MHz

EEPROM

100000 Write/Erase Cycles

8000

8.192 k

SYNCHRONOUS

SERIAL

SPI

3 µA

3.5 µA

5.5 V

1.8 V

CMOS

INDUSTRIAL

8 ms

HARDWARE/SOFTWARE

R-PDSO-G8

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

TSSOP

TSSOP8,.25

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

YES

TIN LEAD

GULL WING

650 µm

DUAL

1.1 mm

4.4 mm

3 mm

RENESAS ELECTRONICS CORP

SOIC

PLASTIC, TSSOP-8

compliant

EAR99

8542.32.00.51

HN58X2564NI

Renesas Electronics Corporation

Check for Price

Obsolete

65.536 kbit

8KX8

2.5 V

3 MHz

EEPROM

100000 Write/Erase Cycles

8000

8.192 k

SYNCHRONOUS

SERIAL

SPI

3 µA

3.5 µA

5.5 V

1.8 V

CMOS

INDUSTRIAL

8 ms

HARDWARE/SOFTWARE

R-PDSO-N8

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

VSON

FL8,.15,25

RECTANGULAR

SMALL OUTLINE, VERY THIN PROFILE

YES

TIN LEAD

NO LEAD

650 µm

DUAL

800 µm

3.6 mm

3 mm

RENESAS TECHNOLOGY CORP

SON

VSON, FL8,.15,25

unknown

EAR99

8542.32.00.51

HN58X2564TIE

Renesas Electronics Corporation

Check for Price

Obsolete

65.536 kbit

8KX8

2.5 V

3 MHz

EEPROM

8000

8.192 k

SYNCHRONOUS

SERIAL

SPI

5.5 V

1.8 V

CMOS

INDUSTRIAL

8 ms

R-PDSO-G8

Not Qualified

85 °C

-40 °C

NOT SPECIFIED

PLASTIC/EPOXY

TSSOP

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

YES

GULL WING

650 µm

DUAL

1.1 mm

4.4 mm

3 mm

RENESAS ELECTRONICS CORP

TSSOP(8)

TSSOP,

compliant

EAR99

8542.32.00.51

PTSP0008JC-B

Renesas Electronics

HN58X2564TIAG

Renesas Electronics Corporation

Check for Price

Yes

Transferred

65.536 kbit

8KX8

2.5 V

3 MHz

EEPROM

8000

8.192 k

SYNCHRONOUS

SERIAL

SPI

5.5 V

1.8 V

CMOS

INDUSTRIAL

8 ms

R-PDSO-G8

Not Qualified

85 °C

-40 °C

260

PLASTIC/EPOXY

TSSOP

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

YES

GULL WING

650 µm

DUAL

1.1 mm

4.4 mm

3 mm

RENESAS ELECTRONICS CORP

SOIC

TSSOP,

unknown

EAR99

8542.32.00.51

HN58X2564FPI

Renesas Electronics Corporation

Check for Price

Transferred

65.536 kbit

8KX8

2.5 V

3 MHz

EEPROM

100000 Write/Erase Cycles

8000

8.192 k

SYNCHRONOUS

SERIAL

SPI

3 µA

3.5 µA

5.5 V

1.8 V

CMOS

INDUSTRIAL

8 ms

HARDWARE/SOFTWARE

R-PDSO-G8

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

SOP

SOP8,.25

RECTANGULAR

SMALL OUTLINE

YES

TIN LEAD

GULL WING

1.27 mm

DUAL

1.73 mm

4.89 mm

3.9 mm

RENESAS ELECTRONICS CORP

SOIC

0.150 INCH, PLASTIC, SOP-8

compliant

EAR99

8542.32.00.51

HN58X2564FPIE

Renesas Electronics Corporation

Check for Price

Not Recommended

65.536 kbit

8KX8

2.5 V

3 MHz

EEPROM

8000

8.192 k

SYNCHRONOUS

SERIAL

SPI

5.5 V

1.8 V

CMOS

INDUSTRIAL

8 ms

R-PDSO-G8

Not Qualified

85 °C

-40 °C

NOT SPECIFIED

PLASTIC/EPOXY

SOP

RECTANGULAR

SMALL OUTLINE

YES

GULL WING

1.27 mm

DUAL

1.73 mm

4.89 mm

3.9 mm

RENESAS ELECTRONICS CORP

SOP(8)

SOP,

compliant

EAR99

8542.32.00.51

PRSP0008DF-B

Renesas Electronics

HN58X2564FPIAG

Renesas Electronics Corporation

Check for Price

Yes

Obsolete

65.536 kbit

8KX8

2.5 V

3 MHz

EEPROM

8000

8.192 k

SYNCHRONOUS

SERIAL

SPI

5.5 V

1.8 V

CMOS

INDUSTRIAL

8 ms

R-PDSO-G8

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

SOP

RECTANGULAR

SMALL OUTLINE

YES

GULL WING

1.27 mm

DUAL

1.73 mm

4.89 mm

3.9 mm

RENESAS ELECTRONICS CORP

SOIC

SOP,

unknown

EAR99

8542.32.00.51

Parametric results for: HN58X2564I under EEPROMs