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Manufacturer Part Number: idt70t3339s166bf
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IDT70T3339S166BFI
 Integrated Device Technology Inc 		Check for Price No No Transferred 9.4372 Mbit 18 512KX18 2.5 V 12 ns MULTI-PORT SRAM FLOW-THROUGH OR PIPELINED ARCHITECTURE 1 512000 524.288 k SYNCHRONOUS PARALLEL 2.6 V 2.4 V CMOS INDUSTRIAL S-PBGA-B208 Not Qualified e0 3 85 °C -40 °C 208 PLASTIC/EPOXY TFBGA SQUARE GRID ARRAY, THIN PROFILE, FINE PITCH YES TIN LEAD BALL 800 µm BOTTOM 1.2 mm 15 mm 15 mm INTEGRATED DEVICE TECHNOLOGY INC BGA TFBGA, 208 compliant 3A991.B.2.A 8542.32.00.41
IDT70T3339S166BF8
 Integrated Device Technology Inc 		Check for Price No No Transferred 9.4372 Mbit 18 512KX18 2.5 V 12 ns 166 MHz MULTI-PORT SRAM FLOW-THROUGH OR PIPELINED ARCHITECTURE COMMON 1 2 512000 524.288 k SYNCHRONOUS 3-STATE PARALLEL 15 mA 2.4 V 450 µA 2.6 V 2.4 V CMOS COMMERCIAL S-PBGA-B208 Not Qualified e0 3 70 °C 225 20 208 PLASTIC/EPOXY TFBGA BGA208,17X17,32 SQUARE GRID ARRAY, THIN PROFILE, FINE PITCH YES Tin/Lead (Sn63Pb37) BALL 800 µm BOTTOM 1.2 mm 15 mm 15 mm INTEGRATED DEVICE TECHNOLOGY INC BGA TFBGA, BGA208,17X17,32 208 not_compliant 3A991.B.2.A 8542.32.00.41
IDT70T3339S166BFGI
 Integrated Device Technology Inc 		Check for Price Yes Yes Transferred 9.4372 Mbit 18 512KX18 2.5 V 12 ns MULTI-PORT SRAM FLOW-THROUGH OR PIPELINED ARCHITECTURE 1 512000 524.288 k SYNCHRONOUS PARALLEL 2.6 V 2.4 V CMOS INDUSTRIAL S-PBGA-B208 Not Qualified e1 3 85 °C -40 °C 208 PLASTIC/EPOXY TFBGA SQUARE GRID ARRAY, THIN PROFILE, FINE PITCH YES TIN SILVER COPPER BALL 800 µm BOTTOM 1.2 mm 15 mm 15 mm INTEGRATED DEVICE TECHNOLOGY INC BGA TFBGA, 208 compliant 3A991.B.2.A 8542.32.00.41
IDT70T3339S166BFG8
 Integrated Device Technology Inc 		Check for Price Yes Yes Transferred 9.4372 Mbit 18 512KX18 2.5 V 12 ns 166 MHz MULTI-PORT SRAM FLOW-THROUGH OR PIPELINED ARCHITECTURE COMMON 1 2 512000 524.288 k SYNCHRONOUS 3-STATE PARALLEL 15 mA 2.4 V 450 µA 2.6 V 2.4 V CMOS COMMERCIAL S-PBGA-B208 Not Qualified e1 3 70 °C 260 30 208 PLASTIC/EPOXY TFBGA BGA208,17X17,32 SQUARE GRID ARRAY, THIN PROFILE, FINE PITCH YES Tin/Silver/Copper (Sn/Ag/Cu) BALL 800 µm BOTTOM 1.2 mm 15 mm 15 mm INTEGRATED DEVICE TECHNOLOGY INC BGA TFBGA, BGA208,17X17,32 208 compliant 3A991.B.2.A 8542.32.00.41
IDT70T3339S166BFG
 Integrated Device Technology Inc 		Check for Price Yes Yes Transferred 9.4372 Mbit 18 512KX18 2.5 V 3.6 ns 166 MHz MULTI-PORT SRAM FLOW-THROUGH OR PIPELINED ARCHITECTURE COMMON 1 2 512000 524.288 k SYNCHRONOUS 3-STATE PARALLEL 15 mA 2.4 V 450 µA 2.6 V 2.4 V CMOS COMMERCIAL S-CBGA-B208 Not Qualified e1 3 70 °C 260 30 208 CERAMIC, METAL-SEALED COFIRED LFBGA BGA208,17X17,32 SQUARE GRID ARRAY, LOW PROFILE, FINE PITCH YES Tin/Silver/Copper (Sn/Ag/Cu) BALL 800 µm BOTTOM 1.7 mm 15 mm 15 mm INTEGRATED DEVICE TECHNOLOGY INC BGA LFBGA, BGA208,17X17,32 208 compliant 3A991.B.2.A 8542.32.00.41
IDT70T3339S166BF
 Integrated Device Technology Inc 		Check for Price No No Transferred 9.4372 Mbit 18 512KX18 2.5 V 12 ns 166 MHz MULTI-PORT SRAM FLOW-THROUGH OR PIPELINED ARCHITECTURE COMMON 1 2 512000 524.288 k SYNCHRONOUS 3-STATE PARALLEL 15 mA 2.4 V 450 µA 2.6 V 2.4 V CMOS COMMERCIAL S-PBGA-B208 Not Qualified e0 3 70 °C 225 20 208 PLASTIC/EPOXY TFBGA BGA208,17X17,32 SQUARE GRID ARRAY, THIN PROFILE, FINE PITCH YES Tin/Lead (Sn63Pb37) BALL 800 µm BOTTOM 1.2 mm 15 mm 15 mm INTEGRATED DEVICE TECHNOLOGY INC BGA TFBGA, BGA208,17X17,32 208 not_compliant 3A991.B.2.A 8542.32.00.41