Filter Your Search
1 - 10 of 173 results
|
IDT70T3519S166DR
Integrated Device Technology Inc
|
Check for Price | No | No | Obsolete | 9.4372 Mbit | 36 | 256KX36 | 2.5 V | 12 ns | 166 MHz | MULTI-PORT SRAM | FLOW-THROUGH OR PIPELINED ARCHITECTURE | COMMON | 1 | 2 | 256000 | 262.144 k | SYNCHRONOUS | 3-STATE | PARALLEL | 15 mA | 2.4 V | 450 µA | 2.6 V | 2.4 V | CMOS | COMMERCIAL | S-PQFP-G208 | Not Qualified | e0 | 3 | 70 °C | NOT SPECIFIED | NOT SPECIFIED | 208 | PLASTIC/EPOXY | FQFP | QFP208,1.2SQ,20 | SQUARE | FLATPACK, FINE PITCH | YES | Tin/Lead (Sn/Pb) | GULL WING | 500 µm | QUAD | 4.1 mm | 28 mm | 28 mm | INTEGRATED DEVICE TECHNOLOGY INC | QFP | FQFP, QFP208,1.2SQ,20 | 208 | not_compliant | 3A991.B.2.A | 8542.32.00.41 | |||
|
IDT70T3519S133BCI8
Integrated Device Technology Inc
|
Check for Price | No | No | Transferred | 9.4372 Mbit | 36 | 256KX36 | 2.5 V | 15 ns | 133 MHz | MULTI-PORT SRAM | FLOW-THROUGH OR PIPELINED ARCHITECTURE | COMMON | 1 | 2 | 256000 | 262.144 k | SYNCHRONOUS | 3-STATE | PARALLEL | 20 mA | 2.4 V | 450 µA | 2.6 V | 2.4 V | CMOS | INDUSTRIAL | S-PBGA-B256 | Not Qualified | e0 | 3 | 85 °C | -40 °C | 225 | 20 | 256 | PLASTIC/EPOXY | LBGA | BGA256,16X16,40 | SQUARE | GRID ARRAY, LOW PROFILE | YES | Tin/Lead (Sn63Pb37) | BALL | 1 mm | BOTTOM | 1.5 mm | 17 mm | 17 mm | INTEGRATED DEVICE TECHNOLOGY INC | BGA | LBGA, BGA256,16X16,40 | 256 | not_compliant | 3A991.B.2.A | 8542.32.00.41 | ||
|
IDT70T3589S200BCG
Integrated Device Technology Inc
|
Check for Price | Yes | Yes | Transferred | 2.3593 Mbit | 36 | 64KX36 | 2.5 V | 10 ns | 200 MHz | MULTI-PORT SRAM | PIPELINED OR FLOW-THROUGH ARCHITECTURE | COMMON | 1 | 2 | 64000 | 65.536 k | SYNCHRONOUS | 3-STATE | PARALLEL | 15 mA | 2.4 V | 525 µA | 2.6 V | 2.4 V | CMOS | COMMERCIAL | S-PBGA-B256 | Not Qualified | e1 | 3 | 70 °C | 260 | 30 | 256 | PLASTIC/EPOXY | LBGA | BGA256,16X16,40 | SQUARE | GRID ARRAY, LOW PROFILE | YES | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 1 mm | BOTTOM | 1.7 mm | 17 mm | 17 mm | INTEGRATED DEVICE TECHNOLOGY INC | BGA | LBGA, BGA256,16X16,40 | 256 | compliant | 3A991.B.2.A | 8542.32.00.41 | |||
|
IDT70T3539MS133BCGI8
Integrated Device Technology Inc
|
Check for Price | Yes | Yes | Transferred | 18.8744 Mbit | 36 | 512KX36 | 2.5 V | 15 ns | 133 MHz | MULTI-PORT SRAM | FLOW-THROUGH OR PIPELINED ARCHITECTURE | COMMON | 1 | 2 | 512000 | 524.288 k | SYNCHRONOUS | 3-STATE | PARALLEL | 25 mA | 2.4 V | 900 µA | 2.6 V | 2.4 V | CMOS | INDUSTRIAL | S-PBGA-B256 | Not Qualified | e1 | 3 | 85 °C | -40 °C | 260 | 30 | 256 | PLASTIC/EPOXY | LBGA | BGA256,16X16,40 | SQUARE | GRID ARRAY, LOW PROFILE | YES | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 1 mm | BOTTOM | 1.5 mm | 17 mm | 17 mm | INTEGRATED DEVICE TECHNOLOGY INC | BGA | LBGA, BGA256,16X16,40 | 256 | compliant | 3A991.B.2.A | 8542.32.00.41 | ||
|
IDT70T3599S133BFI
Integrated Device Technology Inc
|
Check for Price | No | No | Transferred | 4.7186 Mbit | 36 | 128KX36 | 2.5 V | 15 ns | 133 MHz | MULTI-PORT SRAM | FLOW-THROUGH OR PIPELINED ARCHITECTURE | COMMON | 1 | 2 | 128000 | 131.072 k | SYNCHRONOUS | 3-STATE | PARALLEL | 20 mA | 2.4 V | 450 µA | 2.6 V | 2.4 V | CMOS | INDUSTRIAL | S-PBGA-B208 | Not Qualified | e0 | 3 | 85 °C | -40 °C | 225 | 20 | 208 | PLASTIC/EPOXY | TFBGA | BGA208,17X17,32 | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | Tin/Lead (Sn63Pb37) | BALL | 800 µm | BOTTOM | 1.2 mm | 15 mm | 15 mm | INTEGRATED DEVICE TECHNOLOGY INC | BGA | TFBGA, BGA208,17X17,32 | 208 | not_compliant | 3A991.B.2.A | 8542.32.00.41 | ||
|
IDT70T35L20BFG
Integrated Device Technology Inc
|
Check for Price | Yes | Yes | Obsolete | 147.456 kbit | 18 | 8KX18 | 2.5 V | 20 ns | MULTI-PORT SRAM | 1 | 8000 | 8.192 k | ASYNCHRONOUS | PARALLEL | 2.6 V | 2.4 V | CMOS | COMMERCIAL | S-PBGA-B100 | Not Qualified | e3 | 70 °C | 100 | PLASTIC/EPOXY | LFBGA | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | YES | MATTE TIN | BALL | 800 µm | BOTTOM | 1.5 mm | 10 mm | 10 mm | INTEGRATED DEVICE TECHNOLOGY INC | BGA | FPBGA-100 | 100 | compliant | EAR99 | 8542.32.00.41 | |||||||||||||||
|
IDT70T3509M133BPI
Integrated Device Technology Inc
|
Check for Price | No | No | Transferred | 37.7487 Mbit | 36 | 1MX36 | 4.2 ns | 133 MHz | MULTI-PORT SRAM | COMMON | 2 | 1000000 | 1.0486 M | SYNCHRONOUS | 3-STATE | PARALLEL | 80 mA | 2.4 V | 1.37 mA | CMOS | INDUSTRIAL | S-PBGA-B256 | Not Qualified | e0 | 85 °C | -40 °C | 256 | PLASTIC/EPOXY | BGA | BGA256,16X16,40 | SQUARE | GRID ARRAY | YES | TIN LEAD | BALL | 1 mm | BOTTOM | INTEGRATED DEVICE TECHNOLOGY INC | BGA, BGA256,16X16,40 | not_compliant | 3A991.B.2.A | 8542.32.00.41 | |||||||||||||||
|
IDT70T3509M133BPGI
Integrated Device Technology Inc
|
Check for Price | Yes | Yes | Transferred | 37.7487 Mbit | 36 | 1MX36 | 4.2 ns | 133 MHz | MULTI-PORT SRAM | COMMON | 2 | 1000000 | 1.0486 M | SYNCHRONOUS | 3-STATE | PARALLEL | 80 mA | 2.4 V | 1.37 mA | CMOS | INDUSTRIAL | S-PBGA-B256 | Not Qualified | e1 | 3 | 85 °C | -40 °C | 256 | PLASTIC/EPOXY | BGA | BGA256,16X16,40 | SQUARE | GRID ARRAY | YES | TIN SILVER COPPER | BALL | 1 mm | BOTTOM | INTEGRATED DEVICE TECHNOLOGY INC | BGA, BGA256,16X16,40 | compliant | 3A991.B.2.A | 8542.32.00.41 | ||||||||||||||
|
IDT70T35L25BFGI
Integrated Device Technology Inc
|
Check for Price | Yes | Yes | Obsolete | 147.456 kbit | 18 | 8KX18 | 2.5 V | 25 ns | MULTI-PORT SRAM | 1 | 8000 | 8.192 k | ASYNCHRONOUS | PARALLEL | 2.6 V | 2.4 V | CMOS | INDUSTRIAL | S-PBGA-B100 | Not Qualified | e3 | 85 °C | -40 °C | 100 | PLASTIC/EPOXY | LFBGA | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | YES | MATTE TIN | BALL | 800 µm | BOTTOM | 1.5 mm | 10 mm | 10 mm | INTEGRATED DEVICE TECHNOLOGY INC | BGA | FPBGA-100 | 100 | compliant | EAR99 | 8542.32.00.41 | ||||||||||||||
|
IDT70T3599S166DRGI
Integrated Device Technology Inc
|
Check for Price | Yes | Yes | Transferred | 4.7186 Mbit | 36 | 128KX36 | 2.5 V | 3.6 ns | 166 MHz | MULTI-PORT SRAM | PIPELINED OR FLOW-THROUGH ARCHITECTURE | COMMON | 1 | 2 | 128000 | 131.072 k | SYNCHRONOUS | 3-STATE | PARALLEL | 20 mA | 2.4 V | 510 µA | 2.6 V | 2.4 V | CMOS | INDUSTRIAL | S-PQFP-G208 | Not Qualified | e3 | 3 | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 208 | PLASTIC/EPOXY | FQFP | QFP208,1.2SQ,20 | SQUARE | FLATPACK, FINE PITCH | YES | Matte Tin (Sn) | GULL WING | 500 µm | QUAD | 4.1 mm | 28 mm | 28 mm | INTEGRATED DEVICE TECHNOLOGY INC | QFP | FQFP, QFP208,1.2SQ,20 | 208 | compliant | 3A991.B.2.A | 8542.32.00.41 |