Parametric results for: IDT70T35 under SRAMs

Filter Your Search

1 - 10 of 173 results

|
-
-
-
-
-
-
-
-
-
Manufacturer Part Number: idt70t35
Select parts from the table below to compare.
Compare
Compare
IDT70T3519S166DR
Integrated Device Technology Inc
Check for Price No No Obsolete 9.4372 Mbit 36 256KX36 2.5 V 12 ns 166 MHz MULTI-PORT SRAM FLOW-THROUGH OR PIPELINED ARCHITECTURE COMMON 1 2 256000 262.144 k SYNCHRONOUS 3-STATE PARALLEL 15 mA 2.4 V 450 µA 2.6 V 2.4 V CMOS COMMERCIAL S-PQFP-G208 Not Qualified e0 3 70 °C NOT SPECIFIED NOT SPECIFIED 208 PLASTIC/EPOXY FQFP QFP208,1.2SQ,20 SQUARE FLATPACK, FINE PITCH YES Tin/Lead (Sn/Pb) GULL WING 500 µm QUAD 4.1 mm 28 mm 28 mm INTEGRATED DEVICE TECHNOLOGY INC QFP FQFP, QFP208,1.2SQ,20 208 not_compliant 3A991.B.2.A 8542.32.00.41
IDT70T3519S133BCI8
Integrated Device Technology Inc
Check for Price No No Transferred 9.4372 Mbit 36 256KX36 2.5 V 15 ns 133 MHz MULTI-PORT SRAM FLOW-THROUGH OR PIPELINED ARCHITECTURE COMMON 1 2 256000 262.144 k SYNCHRONOUS 3-STATE PARALLEL 20 mA 2.4 V 450 µA 2.6 V 2.4 V CMOS INDUSTRIAL S-PBGA-B256 Not Qualified e0 3 85 °C -40 °C 225 20 256 PLASTIC/EPOXY LBGA BGA256,16X16,40 SQUARE GRID ARRAY, LOW PROFILE YES Tin/Lead (Sn63Pb37) BALL 1 mm BOTTOM 1.5 mm 17 mm 17 mm INTEGRATED DEVICE TECHNOLOGY INC BGA LBGA, BGA256,16X16,40 256 not_compliant 3A991.B.2.A 8542.32.00.41
IDT70T3589S200BCG
Integrated Device Technology Inc
Check for Price Yes Yes Transferred 2.3593 Mbit 36 64KX36 2.5 V 10 ns 200 MHz MULTI-PORT SRAM PIPELINED OR FLOW-THROUGH ARCHITECTURE COMMON 1 2 64000 65.536 k SYNCHRONOUS 3-STATE PARALLEL 15 mA 2.4 V 525 µA 2.6 V 2.4 V CMOS COMMERCIAL S-PBGA-B256 Not Qualified e1 3 70 °C 260 30 256 PLASTIC/EPOXY LBGA BGA256,16X16,40 SQUARE GRID ARRAY, LOW PROFILE YES Tin/Silver/Copper (Sn/Ag/Cu) BALL 1 mm BOTTOM 1.7 mm 17 mm 17 mm INTEGRATED DEVICE TECHNOLOGY INC BGA LBGA, BGA256,16X16,40 256 compliant 3A991.B.2.A 8542.32.00.41
IDT70T3539MS133BCGI8
Integrated Device Technology Inc
Check for Price Yes Yes Transferred 18.8744 Mbit 36 512KX36 2.5 V 15 ns 133 MHz MULTI-PORT SRAM FLOW-THROUGH OR PIPELINED ARCHITECTURE COMMON 1 2 512000 524.288 k SYNCHRONOUS 3-STATE PARALLEL 25 mA 2.4 V 900 µA 2.6 V 2.4 V CMOS INDUSTRIAL S-PBGA-B256 Not Qualified e1 3 85 °C -40 °C 260 30 256 PLASTIC/EPOXY LBGA BGA256,16X16,40 SQUARE GRID ARRAY, LOW PROFILE YES Tin/Silver/Copper (Sn/Ag/Cu) BALL 1 mm BOTTOM 1.5 mm 17 mm 17 mm INTEGRATED DEVICE TECHNOLOGY INC BGA LBGA, BGA256,16X16,40 256 compliant 3A991.B.2.A 8542.32.00.41
IDT70T3599S133BFI
Integrated Device Technology Inc
Check for Price No No Transferred 4.7186 Mbit 36 128KX36 2.5 V 15 ns 133 MHz MULTI-PORT SRAM FLOW-THROUGH OR PIPELINED ARCHITECTURE COMMON 1 2 128000 131.072 k SYNCHRONOUS 3-STATE PARALLEL 20 mA 2.4 V 450 µA 2.6 V 2.4 V CMOS INDUSTRIAL S-PBGA-B208 Not Qualified e0 3 85 °C -40 °C 225 20 208 PLASTIC/EPOXY TFBGA BGA208,17X17,32 SQUARE GRID ARRAY, THIN PROFILE, FINE PITCH YES Tin/Lead (Sn63Pb37) BALL 800 µm BOTTOM 1.2 mm 15 mm 15 mm INTEGRATED DEVICE TECHNOLOGY INC BGA TFBGA, BGA208,17X17,32 208 not_compliant 3A991.B.2.A 8542.32.00.41
IDT70T35L20BFG
Integrated Device Technology Inc
Check for Price Yes Yes Obsolete 147.456 kbit 18 8KX18 2.5 V 20 ns MULTI-PORT SRAM 1 8000 8.192 k ASYNCHRONOUS PARALLEL 2.6 V 2.4 V CMOS COMMERCIAL S-PBGA-B100 Not Qualified e3 70 °C 100 PLASTIC/EPOXY LFBGA SQUARE GRID ARRAY, LOW PROFILE, FINE PITCH YES MATTE TIN BALL 800 µm BOTTOM 1.5 mm 10 mm 10 mm INTEGRATED DEVICE TECHNOLOGY INC BGA FPBGA-100 100 compliant EAR99 8542.32.00.41
IDT70T3509M133BPI
Integrated Device Technology Inc
Check for Price No No Transferred 37.7487 Mbit 36 1MX36 4.2 ns 133 MHz MULTI-PORT SRAM COMMON 2 1000000 1.0486 M SYNCHRONOUS 3-STATE PARALLEL 80 mA 2.4 V 1.37 mA CMOS INDUSTRIAL S-PBGA-B256 Not Qualified e0 85 °C -40 °C 256 PLASTIC/EPOXY BGA BGA256,16X16,40 SQUARE GRID ARRAY YES TIN LEAD BALL 1 mm BOTTOM INTEGRATED DEVICE TECHNOLOGY INC BGA, BGA256,16X16,40 not_compliant 3A991.B.2.A 8542.32.00.41
IDT70T3509M133BPGI
Integrated Device Technology Inc
Check for Price Yes Yes Transferred 37.7487 Mbit 36 1MX36 4.2 ns 133 MHz MULTI-PORT SRAM COMMON 2 1000000 1.0486 M SYNCHRONOUS 3-STATE PARALLEL 80 mA 2.4 V 1.37 mA CMOS INDUSTRIAL S-PBGA-B256 Not Qualified e1 3 85 °C -40 °C 256 PLASTIC/EPOXY BGA BGA256,16X16,40 SQUARE GRID ARRAY YES TIN SILVER COPPER BALL 1 mm BOTTOM INTEGRATED DEVICE TECHNOLOGY INC BGA, BGA256,16X16,40 compliant 3A991.B.2.A 8542.32.00.41
IDT70T35L25BFGI
Integrated Device Technology Inc
Check for Price Yes Yes Obsolete 147.456 kbit 18 8KX18 2.5 V 25 ns MULTI-PORT SRAM 1 8000 8.192 k ASYNCHRONOUS PARALLEL 2.6 V 2.4 V CMOS INDUSTRIAL S-PBGA-B100 Not Qualified e3 85 °C -40 °C 100 PLASTIC/EPOXY LFBGA SQUARE GRID ARRAY, LOW PROFILE, FINE PITCH YES MATTE TIN BALL 800 µm BOTTOM 1.5 mm 10 mm 10 mm INTEGRATED DEVICE TECHNOLOGY INC BGA FPBGA-100 100 compliant EAR99 8542.32.00.41
IDT70T3599S166DRGI
Integrated Device Technology Inc
Check for Price Yes Yes Transferred 4.7186 Mbit 36 128KX36 2.5 V 3.6 ns 166 MHz MULTI-PORT SRAM PIPELINED OR FLOW-THROUGH ARCHITECTURE COMMON 1 2 128000 131.072 k SYNCHRONOUS 3-STATE PARALLEL 20 mA 2.4 V 510 µA 2.6 V 2.4 V CMOS INDUSTRIAL S-PQFP-G208 Not Qualified e3 3 85 °C -40 °C NOT SPECIFIED NOT SPECIFIED 208 PLASTIC/EPOXY FQFP QFP208,1.2SQ,20 SQUARE FLATPACK, FINE PITCH YES Matte Tin (Sn) GULL WING 500 µm QUAD 4.1 mm 28 mm 28 mm INTEGRATED DEVICE TECHNOLOGY INC QFP FQFP, QFP208,1.2SQ,20 208 compliant 3A991.B.2.A 8542.32.00.41