Findchips: Parametric Search Results for IDT70V658S10BF


Select Parts		Part Number

		IDT70V658S10BF8 Integrated Device Technology Inc
		IDT70V658S10BF Integrated Device Technology Inc
		IDT70V658S10BFG Integrated Device Technology Inc
		IDT70V658S10BFG8 Integrated Device Technology Inc

				Most Relevant					Technical																Compliance			Operating Conditions				Physical											Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Memory Density	Memory Width	Organization	Supply Voltage-Nom (Vsup)	Access Time-Max	Memory IC Type	I/O Type	Number of Functions	Number of Ports	Number of Words Code	Number of Words	Operating Mode	Output Characteristics	Parallel/Serial	Standby Current-Max	Standby Voltage-Min	Supply Current-Max	Supply Voltage-Max (Vsup)	Supply Voltage-Min (Vsup)	Technology	Temperature Grade	JESD-30 Code	Qualification Status	JESD-609 Code	Moisture Sensitivity Level	Operating Temperature-Max	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Length	Width	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Reach Compliance Code	ECCN Code	HTS Code

Check for Price

Transferred

2.3593 Mbit

64KX36

3.3 V

10 ns

MULTI-PORT SRAM

COMMON

64000

65.536 k

ASYNCHRONOUS

3-STATE

PARALLEL

15 mA

3.15 V

500 µA

3.45 V

3.15 V

CMOS

COMMERCIAL

S-PBGA-B208

Not Qualified

70 °C

225

208

PLASTIC/EPOXY

TFBGA

BGA208,17X17,32

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

Tin/Lead (Sn63Pb37)

BALL

800 µm

BOTTOM

1.2 mm

15 mm

INTEGRATED DEVICE TECHNOLOGY INC

BGA

TFBGA, BGA208,17X17,32

208

not_compliant

3A991.B.2.A

8542.32.00.41

Check for Price

Transferred

2.3593 Mbit

64KX36

3.3 V

10 ns

MULTI-PORT SRAM

COMMON

64000

65.536 k

ASYNCHRONOUS

3-STATE

PARALLEL

15 mA

3.15 V

500 µA

3.45 V

3.15 V

CMOS

COMMERCIAL

S-PBGA-B208

Not Qualified

70 °C

225

208

PLASTIC/EPOXY

TFBGA

BGA208,17X17,32

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

Tin/Lead (Sn63Pb37)

BALL

800 µm

BOTTOM

1.2 mm

15 mm

INTEGRATED DEVICE TECHNOLOGY INC

BGA

TFBGA, BGA208,17X17,32

208

not_compliant

3A991.B.2.A

8542.32.00.41

Check for Price

Yes

Transferred

2.3593 Mbit

64KX36

3.3 V

10 ns

MULTI-PORT SRAM

COMMON

64000

65.536 k

ASYNCHRONOUS

3-STATE

PARALLEL

15 mA

3.15 V

500 µA

3.45 V

3.15 V

CMOS

COMMERCIAL

S-PBGA-B208

Not Qualified

70 °C

260

208

PLASTIC/EPOXY

TFBGA

BGA208,17X17,32

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

800 µm

BOTTOM

1.2 mm

15 mm

INTEGRATED DEVICE TECHNOLOGY INC

BGA

TFBGA, BGA208,17X17,32

208

compliant

3A991.B.2.A

8542.32.00.41

Check for Price

Yes

Transferred

2.3593 Mbit

64KX36

3.3 V

10 ns

MULTI-PORT SRAM

COMMON

64000

65.536 k

ASYNCHRONOUS

3-STATE

PARALLEL

15 mA

3.15 V

500 µA

3.45 V

3.15 V

CMOS

COMMERCIAL

S-PBGA-B208

Not Qualified

70 °C

260

208

PLASTIC/EPOXY

TFBGA

BGA208,17X17,32

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

800 µm

BOTTOM

1.2 mm

15 mm

INTEGRATED DEVICE TECHNOLOGY INC

BGA

TFBGA, BGA208,17X17,32

208

compliant

3A991.B.2.A

8542.32.00.41

Compare

IDT70V658S10BF8

Integrated Device Technology Inc

Check for Price

Transferred

2.3593 Mbit

64KX36

3.3 V

10 ns

MULTI-PORT SRAM

COMMON

64000

65.536 k

ASYNCHRONOUS

3-STATE

PARALLEL

15 mA

3.15 V

500 µA

3.45 V

3.15 V

CMOS

COMMERCIAL

S-PBGA-B208

Not Qualified

70 °C

225

208

PLASTIC/EPOXY

TFBGA

BGA208,17X17,32

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

Tin/Lead (Sn63Pb37)

BALL

800 µm

BOTTOM

1.2 mm

15 mm

INTEGRATED DEVICE TECHNOLOGY INC

BGA

TFBGA, BGA208,17X17,32

208

not_compliant

3A991.B.2.A

8542.32.00.41

IDT70V658S10BF

Integrated Device Technology Inc

Check for Price

Transferred

2.3593 Mbit

64KX36

3.3 V

10 ns

MULTI-PORT SRAM

COMMON

64000

65.536 k

ASYNCHRONOUS

3-STATE

PARALLEL

15 mA

3.15 V

500 µA

3.45 V

3.15 V

CMOS

COMMERCIAL

S-PBGA-B208

Not Qualified

70 °C

225

208

PLASTIC/EPOXY

TFBGA

BGA208,17X17,32

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

Tin/Lead (Sn63Pb37)

BALL

800 µm

BOTTOM

1.2 mm

15 mm

INTEGRATED DEVICE TECHNOLOGY INC

BGA

TFBGA, BGA208,17X17,32

208

not_compliant

3A991.B.2.A

8542.32.00.41

IDT70V658S10BFG

Integrated Device Technology Inc

Check for Price

Yes

Transferred

2.3593 Mbit

64KX36

3.3 V

10 ns

MULTI-PORT SRAM

COMMON

64000

65.536 k

ASYNCHRONOUS

3-STATE

PARALLEL

15 mA

3.15 V

500 µA

3.45 V

3.15 V

CMOS

COMMERCIAL

S-PBGA-B208

Not Qualified

70 °C

260

208

PLASTIC/EPOXY

TFBGA

BGA208,17X17,32

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

800 µm

BOTTOM

1.2 mm

15 mm

INTEGRATED DEVICE TECHNOLOGY INC

BGA

TFBGA, BGA208,17X17,32

208

compliant

3A991.B.2.A

8542.32.00.41

IDT70V658S10BFG8

Integrated Device Technology Inc

Check for Price

Yes

Transferred

2.3593 Mbit

64KX36

3.3 V

10 ns

MULTI-PORT SRAM

COMMON

64000

65.536 k

ASYNCHRONOUS

3-STATE

PARALLEL

15 mA

3.15 V

500 µA

3.45 V

3.15 V

CMOS

COMMERCIAL

S-PBGA-B208

Not Qualified

70 °C

260

208

PLASTIC/EPOXY

TFBGA

BGA208,17X17,32

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

800 µm

BOTTOM

1.2 mm

15 mm

INTEGRATED DEVICE TECHNOLOGY INC

BGA

TFBGA, BGA208,17X17,32

208

compliant

3A991.B.2.A

8542.32.00.41

Parametric results for: IDT70V658S10BF under SRAMs