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IDT71V3556S100BQGI
Integrated Device Technology Inc
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Check for Price | Yes | Obsolete | 4.7186 Mbit | 36 | 128KX36 | 3.3 V | 5 ns | 100 MHz | ZBT SRAM | COMMON | 1 | 128000 | 131.072 k | SYNCHRONOUS | 3-STATE | PARALLEL | 45 mA | 3.14 V | 255 µA | 3.465 V | 3.135 V | CMOS | INDUSTRIAL | R-PBGA-B165 | Not Qualified | e1 | 3 | 85 °C | -40 °C | 260 | 30 | 165 | PLASTIC/EPOXY | TBGA | BGA165,11X15,40 | RECTANGULAR | GRID ARRAY, THIN PROFILE | YES | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 1 mm | BOTTOM | 1.2 mm | 15 mm | 13 mm | INTEGRATED DEVICE TECHNOLOGY INC | BGA | 13 X 15 MM, ROHS COMPLIANT, FBGA-165 | 165 | unknown | 3A991.B.2.A | 8542.32.00.41 | ||
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IDT71V3556S100BQG8
Integrated Device Technology Inc
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Check for Price | Yes | Obsolete | 4.7186 Mbit | 36 | 128KX36 | 3.3 V | 5 ns | 100 MHz | ZBT SRAM | COMMON | 128000 | 131.072 k | SYNCHRONOUS | 3-STATE | PARALLEL | 40 mA | 3.14 V | 250 µA | CMOS | COMMERCIAL | R-PBGA-B165 | Not Qualified | e1 | 3 | 70 °C | 260 | 30 | 165 | PLASTIC/EPOXY | BGA | BGA165,11X15,40 | RECTANGULAR | GRID ARRAY | YES | TIN SILVER COPPER | BALL | 1 mm | BOTTOM | INTEGRATED DEVICE TECHNOLOGY INC | unknown | 3A991.B.2.A | 8542.32.00.41 | ||||||||||||
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IDT71V3556S100BQGI8
Integrated Device Technology Inc
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Check for Price | Yes | Obsolete | 4.7186 Mbit | 36 | 128KX36 | 3.3 V | 5 ns | 100 MHz | ZBT SRAM | COMMON | 128000 | 131.072 k | SYNCHRONOUS | 3-STATE | PARALLEL | 45 mA | 3.14 V | 255 µA | CMOS | INDUSTRIAL | R-PBGA-B165 | Not Qualified | e1 | 3 | 85 °C | -40 °C | 260 | 30 | 165 | PLASTIC/EPOXY | BGA | BGA165,11X15,40 | RECTANGULAR | GRID ARRAY | YES | TIN SILVER COPPER | BALL | 1 mm | BOTTOM | INTEGRATED DEVICE TECHNOLOGY INC | unknown | 3A991.B.2.A | 8542.32.00.41 | |||||||||||
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IDT71V3556S100BQG
Integrated Device Technology Inc
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Check for Price | Yes | Obsolete | 4.7186 Mbit | 36 | 128KX36 | 3.3 V | 5 ns | 100 MHz | ZBT SRAM | COMMON | 1 | 128000 | 131.072 k | SYNCHRONOUS | 3-STATE | PARALLEL | 40 mA | 3.14 V | 250 µA | 3.465 V | 3.135 V | CMOS | COMMERCIAL | R-PBGA-B165 | Not Qualified | e1 | 3 | 70 °C | 260 | 30 | 165 | PLASTIC/EPOXY | TBGA | BGA165,11X15,40 | RECTANGULAR | GRID ARRAY, THIN PROFILE | YES | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 1 mm | BOTTOM | 1.2 mm | 15 mm | 13 mm | INTEGRATED DEVICE TECHNOLOGY INC | BGA | 13 X 15 MM, ROHS COMPLIANT, FBGA-165 | 165 | unknown | 3A991.B.2.A | 8542.32.00.41 |