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Manufacturer Part Number: idt71v3557s
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IDT71V3557SA85BQG
 Integrated Device Technology Inc 		Check for Price Yes Obsolete 4.7186 Mbit 36 128KX36 3.3 V 8.5 ns 90 MHz CACHE SRAM FLOW-THROUGH ARCHITECTURE COMMON 1 128000 131.072 k SYNCHRONOUS 3-STATE PARALLEL 40 mA 3.14 V 225 µA 3.465 V 3.135 V CMOS COMMERCIAL R-PBGA-B165 Not Qualified e1 3 70 °C 260 30 165 PLASTIC/EPOXY TBGA BGA165,11X15,40 RECTANGULAR GRID ARRAY, THIN PROFILE YES Tin/Silver/Copper (Sn/Ag/Cu) BALL 1 mm BOTTOM 1.2 mm 15 mm 13 mm INTEGRATED DEVICE TECHNOLOGY INC BGA 13 X 15 MM, ROHS COMPLIANT, FBGA-165 165 unknown 3A991.B.2.A 8542.32.00.41
IDT71V3557S85BG8
 Integrated Device Technology Inc 		Check for Price No No Transferred 4.7186 Mbit 36 128KX36 3.3 V 8.5 ns 90 MHz ZBT SRAM FLOW-THROUGH ARCHITECTURE COMMON 1 128000 131.072 k SYNCHRONOUS 3-STATE PARALLEL 40 mA 3.14 V 225 µA 3.465 V 3.135 V CMOS COMMERCIAL R-PBGA-B119 Not Qualified e0 3 70 °C 225 20 119 PLASTIC/EPOXY BGA BGA119,7X17,50 RECTANGULAR GRID ARRAY YES Tin/Lead (Sn63Pb37) BALL 1.27 mm BOTTOM 2.36 mm 22 mm 14 mm INTEGRATED DEVICE TECHNOLOGY INC BGA BGA, BGA119,7X17,50 119 not_compliant 3A991.B.2.A 8542.32.00.41 1998-08-01
IDT71V3557SA80BGI
 Integrated Device Technology Inc 		Check for Price No Obsolete 4.7186 Mbit 36 128KX36 3.3 V 8 ns 95 MHz ZBT SRAM FLOW-THROUGH ARCHITECTURE COMMON 1 128000 131.072 k SYNCHRONOUS 3-STATE PARALLEL 45 mA 3.14 V 260 µA 3.465 V 3.135 V CMOS INDUSTRIAL R-PBGA-B119 Not Qualified e0 3 85 °C -40 °C 225 20 119 PLASTIC/EPOXY BGA BGA119,7X17,50 RECTANGULAR GRID ARRAY YES TIN LEAD BALL 1.27 mm BOTTOM 2.36 mm 22 mm 14 mm INTEGRATED DEVICE TECHNOLOGY INC BGA 14 X 22 MM, PLASTIC, BGA-119 119 not_compliant 3A991.B.2.A 8542.32.00.41
IDT71V3557S80PFG
 Integrated Device Technology Inc 		Check for Price Yes Yes Transferred 4.7186 Mbit 36 128KX36 3.3 V 8 ns 95 MHz CACHE SRAM FLOW-THROUGH ARCHITECTURE COMMON 1 128000 131.072 k SYNCHRONOUS 3-STATE PARALLEL 40 mA 3.14 V 250 µA 3.465 V 3.135 V CMOS COMMERCIAL R-PQFP-G100 Not Qualified e3 3 70 °C 260 30 100 PLASTIC/EPOXY LQFP QFP100,.63X.87 RECTANGULAR FLATPACK, LOW PROFILE YES Matte Tin (Sn) - annealed GULL WING 650 µm QUAD 1.6 mm 20 mm 14 mm INTEGRATED DEVICE TECHNOLOGY INC QFP LQFP, QFP100,.63X.87 100 compliant 3A991.B.2.A 8542.32.00.41 1998-08-01
IDT71V3557S85PFG
 Integrated Device Technology Inc 		Check for Price Yes Yes Transferred 4.7186 Mbit 36 128KX36 3.3 V 8.5 ns 90 MHz CACHE SRAM FLOW-THROUGH ARCHITECTURE COMMON 1 128000 131.072 k SYNCHRONOUS 3-STATE PARALLEL 40 mA 3.14 V 225 µA 3.465 V 3.135 V CMOS COMMERCIAL R-PQFP-G100 Not Qualified e3 3 70 °C 260 30 100 PLASTIC/EPOXY LQFP QFP100,.63X.87 RECTANGULAR FLATPACK, LOW PROFILE YES Matte Tin (Sn) - annealed GULL WING 650 µm QUAD 1.6 mm 20 mm 14 mm INTEGRATED DEVICE TECHNOLOGY INC QFP LQFP, QFP100,.63X.87 100 compliant 3A991.B.2.A 8542.32.00.41 1998-08-01
IDT71V3557S85PFGI
 Integrated Device Technology Inc 		Check for Price Yes Yes Transferred 4.7186 Mbit 36 128KX36 3.3 V 8.5 ns 90 MHz CACHE SRAM FLOW-THROUGH ARCHITECTURE COMMON 1 128000 131.072 k SYNCHRONOUS 3-STATE PARALLEL 45 mA 3.14 V 235 µA 3.465 V 3.135 V CMOS INDUSTRIAL R-PQFP-G100 Not Qualified e3 3 85 °C -40 °C 260 30 100 PLASTIC/EPOXY LQFP QFP100,.63X.87 RECTANGULAR FLATPACK, LOW PROFILE YES Matte Tin (Sn) - annealed GULL WING 650 µm QUAD 1.6 mm 20 mm 14 mm INTEGRATED DEVICE TECHNOLOGY INC QFP LQFP, QFP100,.63X.87 100 compliant 3A991.B.2.A 8542.32.00.41 1998-08-01
IDT71V3557SA80BQG
 Integrated Device Technology Inc 		Check for Price Yes Obsolete 4.7186 Mbit 36 128KX36 3.3 V 8 ns 95 MHz CACHE SRAM FLOW-THROUGH ARCHITECTURE COMMON 1 128000 131.072 k SYNCHRONOUS 3-STATE PARALLEL 40 mA 3.14 V 250 µA 3.465 V 3.135 V CMOS COMMERCIAL R-PBGA-B165 Not Qualified e1 3 70 °C 260 30 165 PLASTIC/EPOXY TBGA BGA165,11X15,40 RECTANGULAR GRID ARRAY, THIN PROFILE YES Tin/Silver/Copper (Sn/Ag/Cu) BALL 1 mm BOTTOM 1.2 mm 15 mm 13 mm INTEGRATED DEVICE TECHNOLOGY INC BGA 13 X 15 MM, ROHS COMPLIANT, FBGA-165 165 unknown 3A991.B.2.A 8542.32.00.41
IDT71V3557S80PFG8
 Integrated Device Technology Inc 		Check for Price Yes Yes Transferred 4.7186 Mbit 36 128KX36 3.3 V 8 ns CACHE SRAM FLOW-THROUGH ARCHITECTURE 1 128000 131.072 k SYNCHRONOUS PARALLEL 3.465 V 3.135 V CMOS COMMERCIAL R-PQFP-G100 Not Qualified e3 3 70 °C NOT SPECIFIED NOT SPECIFIED 100 PLASTIC/EPOXY LQFP RECTANGULAR FLATPACK, LOW PROFILE YES Matte Tin (Sn) GULL WING 650 µm QUAD 1.6 mm 20 mm 14 mm INTEGRATED DEVICE TECHNOLOGY INC QFP LQFP, 100 compliant 3A991.B.2.A 8542.32.00.41
IDT71V3557S85PF
 Integrated Device Technology Inc 		Check for Price No Obsolete 4.7186 Mbit 36 128KX36 3.3 V 8.5 ns 90 MHz ZBT SRAM FLOW-THROUGH ARCHITECTURE COMMON 1 128000 131.072 k SYNCHRONOUS 3-STATE PARALLEL 40 mA 3.14 V 225 µA 3.465 V 3.135 V CMOS COMMERCIAL R-PQFP-G100 Not Qualified e0 3 70 °C 225 20 100 PLASTIC/EPOXY LQFP QFP100,.63X.87 RECTANGULAR FLATPACK, LOW PROFILE YES Tin/Lead (Sn85Pb15) GULL WING 650 µm QUAD 1.6 mm 20 mm 14 mm INTEGRATED DEVICE TECHNOLOGY INC QFP 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100 100 not_compliant 3A991.B.2.A 8542.32.00.41
IDT71V3557S75BG8
 Integrated Device Technology Inc 		Check for Price No No Transferred 4.7186 Mbit 36 128KX36 3.3 V 7.5 ns 100 MHz ZBT SRAM FLOW-THROUGH ARCHITECTURE COMMON 1 128000 131.072 k SYNCHRONOUS 3-STATE PARALLEL 40 mA 3.14 V 275 µA 3.465 V 3.135 V CMOS COMMERCIAL R-PBGA-B119 Not Qualified e0 3 70 °C 225 20 119 PLASTIC/EPOXY BGA BGA119,7X17,50 RECTANGULAR GRID ARRAY YES Tin/Lead (Sn63Pb37) BALL 1.27 mm BOTTOM 2.36 mm 22 mm 14 mm INTEGRATED DEVICE TECHNOLOGY INC BGA BGA, BGA119,7X17,50 119 not_compliant 3A991.B.2.A 8542.32.00.41 1998-08-01
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