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Manufacturer Part Number: idt71v3558s100bq
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IDT71V3558S100BQGI8
 Integrated Device Technology Inc 		Check for Price Yes Yes Transferred 4.7186 Mbit 18 256KX18 3.3 V 5 ns 100 MHz ZBT SRAM COMMON 256000 262.144 k SYNCHRONOUS 3-STATE PARALLEL 45 mA 3.14 V 255 µA CMOS INDUSTRIAL R-PBGA-B165 Not Qualified e1 3 85 °C -40 °C 260 30 165 PLASTIC/EPOXY BGA BGA165,11X15,40 RECTANGULAR GRID ARRAY YES Tin/Silver/Copper (Sn/Ag/Cu) BALL 1 mm BOTTOM INTEGRATED DEVICE TECHNOLOGY INC BGA, BGA165,11X15,40 compliant 3A991.B.2.A 8542.32.00.41
IDT71V3558S100BQ8
 Integrated Device Technology Inc 		Check for Price No Obsolete 4.7186 Mbit 18 256KX18 3.3 V 5 ns 100 MHz ZBT SRAM COMMON 256000 262.144 k SYNCHRONOUS 3-STATE PARALLEL 40 mA 3.14 V 250 µA CMOS COMMERCIAL R-PBGA-B165 Not Qualified e0 3 70 °C 225 30 165 PLASTIC/EPOXY BGA BGA165,11X15,40 RECTANGULAR GRID ARRAY YES TIN LEAD BALL 1 mm BOTTOM INTEGRATED DEVICE TECHNOLOGY INC not_compliant 3A991.B.2.A 8542.32.00.41
IDT71V3558S100BQI
 Integrated Device Technology Inc 		Check for Price No Obsolete 4.7186 Mbit 18 256KX18 3.3 V 5 ns 100 MHz ZBT SRAM COMMON 1 256000 262.144 k SYNCHRONOUS 3-STATE PARALLEL 45 mA 3.14 V 255 µA 3.465 V 3.135 V CMOS INDUSTRIAL R-PBGA-B165 Not Qualified e0 3 85 °C -40 °C 225 30 165 PLASTIC/EPOXY TBGA BGA165,11X15,40 RECTANGULAR GRID ARRAY, THIN PROFILE YES TIN LEAD BALL 1 mm BOTTOM 1.2 mm 15 mm 13 mm INTEGRATED DEVICE TECHNOLOGY INC 13 X 15 MM, FINE PITCH, BGA-165 not_compliant 3A991.B.2.A 8542.32.00.41 BGA 165
IDT71V3558S100BQI8
 Integrated Device Technology Inc 		Check for Price No Obsolete 4.7186 Mbit 18 256KX18 3.3 V 5 ns 100 MHz ZBT SRAM COMMON 256000 262.144 k SYNCHRONOUS 3-STATE PARALLEL 45 mA 3.14 V 255 µA CMOS INDUSTRIAL R-PBGA-B165 Not Qualified e0 3 85 °C -40 °C 225 30 165 PLASTIC/EPOXY BGA BGA165,11X15,40 RECTANGULAR GRID ARRAY YES TIN LEAD BALL 1 mm BOTTOM INTEGRATED DEVICE TECHNOLOGY INC not_compliant 3A991.B.2.A 8542.32.00.41
IDT71V3558S100BQ
 Integrated Device Technology Inc 		Check for Price No Obsolete 4.7186 Mbit 18 256KX18 3.3 V 5 ns 100 MHz ZBT SRAM COMMON 1 256000 262.144 k SYNCHRONOUS 3-STATE PARALLEL 40 mA 3.14 V 250 µA 3.465 V 3.135 V CMOS COMMERCIAL R-PBGA-B165 Not Qualified e0 3 70 °C 225 30 165 PLASTIC/EPOXY TBGA BGA165,11X15,40 RECTANGULAR GRID ARRAY, THIN PROFILE YES TIN LEAD BALL 1 mm BOTTOM 1.2 mm 15 mm 13 mm INTEGRATED DEVICE TECHNOLOGY INC 13 X 15 MM, FINE PITCH, BGA-165 not_compliant 3A991.B.2.A 8542.32.00.41 BGA 165
IDT71V3558S100BQGI
 Integrated Device Technology Inc 		Check for Price Yes Yes Transferred 4.7186 Mbit 18 256KX18 3.3 V 5 ns 100 MHz ZBT SRAM COMMON 1 256000 262.144 k SYNCHRONOUS 3-STATE PARALLEL 45 mA 3.14 V 255 µA 3.465 V 3.135 V CMOS INDUSTRIAL R-PBGA-B165 Not Qualified e1 3 85 °C -40 °C 260 30 165 PLASTIC/EPOXY TBGA BGA165,11X15,40 RECTANGULAR GRID ARRAY, THIN PROFILE YES Tin/Silver/Copper (Sn/Ag/Cu) BALL 1 mm BOTTOM 1.2 mm 15 mm 13 mm INTEGRATED DEVICE TECHNOLOGY INC TBGA, BGA165,11X15,40 compliant 3A991.B.2.A 8542.32.00.41 BGA 165
IDT71V3558S100BQG8
 Integrated Device Technology Inc 		Check for Price Yes Yes Transferred 4.7186 Mbit 18 256KX18 3.3 V 5 ns 100 MHz ZBT SRAM COMMON 256000 262.144 k SYNCHRONOUS 3-STATE PARALLEL 40 mA 3.14 V 250 µA CMOS COMMERCIAL R-PBGA-B165 Not Qualified e1 3 70 °C 260 30 165 PLASTIC/EPOXY BGA BGA165,11X15,40 RECTANGULAR GRID ARRAY YES Tin/Silver/Copper (Sn/Ag/Cu) BALL 1 mm BOTTOM INTEGRATED DEVICE TECHNOLOGY INC BGA, BGA165,11X15,40 compliant 3A991.B.2.A 8542.32.00.41
IDT71V3558S100BQG
 Integrated Device Technology Inc 		Check for Price Yes Yes Transferred 4.7186 Mbit 18 256KX18 3.3 V 5 ns 100 MHz ZBT SRAM COMMON 1 256000 262.144 k SYNCHRONOUS 3-STATE PARALLEL 40 mA 3.14 V 250 µA 3.465 V 3.135 V CMOS COMMERCIAL R-PBGA-B165 Not Qualified e1 3 70 °C 260 30 165 PLASTIC/EPOXY TBGA BGA165,11X15,40 RECTANGULAR GRID ARRAY, THIN PROFILE YES Tin/Silver/Copper (Sn/Ag/Cu) BALL 1 mm BOTTOM 1.2 mm 15 mm 13 mm INTEGRATED DEVICE TECHNOLOGY INC TBGA, BGA165,11X15,40 compliant 3A991.B.2.A 8542.32.00.41 BGA 165