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Manufacturer Part Number: idt71v3558sa133bq
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IDT71V3558SA133BQI
 Integrated Device Technology Inc 		Check for Price No No Obsolete 4.7186 Mbit 18 256KX18 3.3 V 4.2 ns 133 MHz ZBT SRAM COMMON 1 256000 262.144 k SYNCHRONOUS 3-STATE PARALLEL 45 mA 3.14 V 310 µA 3.465 V 3.135 V CMOS INDUSTRIAL R-PBGA-B165 Not Qualified e0 3 85 °C -40 °C 225 30 165 PLASTIC/EPOXY TBGA BGA165,11X15,40 RECTANGULAR GRID ARRAY, THIN PROFILE YES TIN LEAD BALL 1 mm BOTTOM 1.2 mm 15 mm 13 mm INTEGRATED DEVICE TECHNOLOGY INC BGA 13 X 15 MM, FINE PITCH, BGA-165 165 not_compliant 3A991.B.2.A 8542.32.00.41
IDT71V3558SA133BQG
 Integrated Device Technology Inc 		Check for Price Yes Yes Transferred 4.7186 Mbit 18 256KX18 3.3 V 4.2 ns 133 MHz ZBT SRAM COMMON 1 256000 262.144 k SYNCHRONOUS 3-STATE PARALLEL 40 mA 3.14 V 300 µA 3.465 V 3.135 V CMOS COMMERCIAL R-PBGA-B165 Not Qualified e1 3 70 °C 260 30 165 PLASTIC/EPOXY TBGA BGA165,11X15,40 RECTANGULAR GRID ARRAY, THIN PROFILE YES Tin/Silver/Copper (Sn/Ag/Cu) BALL 1 mm BOTTOM 1.2 mm 15 mm 13 mm INTEGRATED DEVICE TECHNOLOGY INC BGA TBGA, BGA165,11X15,40 165 compliant 3A991.B.2.A 8542.32.00.41 1998-08-01
IDT71V3558SA133BQGI8
 Integrated Device Technology Inc 		Check for Price Yes Yes Transferred 4.7186 Mbit 18 256KX18 3.3 V 4.2 ns 133 MHz ZBT SRAM COMMON 256000 262.144 k SYNCHRONOUS 3-STATE PARALLEL 45 mA 3.14 V 310 µA CMOS INDUSTRIAL R-PBGA-B165 Not Qualified e1 3 85 °C -40 °C 260 30 165 PLASTIC/EPOXY BGA BGA165,11X15,40 RECTANGULAR GRID ARRAY YES Tin/Silver/Copper (Sn/Ag/Cu) BALL 1 mm BOTTOM INTEGRATED DEVICE TECHNOLOGY INC BGA, BGA165,11X15,40 compliant 3A991.B.2.A 8542.32.00.41 1998-08-01
IDT71V3558SA133BQ8
 Integrated Device Technology Inc 		Check for Price No Obsolete 4.7186 Mbit 18 256KX18 3.3 V 4.2 ns 133 MHz ZBT SRAM COMMON 256000 262.144 k SYNCHRONOUS 3-STATE PARALLEL 40 mA 3.14 V 300 µA CMOS COMMERCIAL R-PBGA-B165 Not Qualified e0 3 70 °C 225 30 165 PLASTIC/EPOXY BGA BGA165,11X15,40 RECTANGULAR GRID ARRAY YES TIN LEAD BALL 1 mm BOTTOM INTEGRATED DEVICE TECHNOLOGY INC not_compliant 3A991.B.2.A 8542.32.00.41
IDT71V3558SA133BQI8
 Integrated Device Technology Inc 		Check for Price No Obsolete 4.7186 Mbit 18 256KX18 3.3 V 4.2 ns 133 MHz ZBT SRAM COMMON 256000 262.144 k SYNCHRONOUS 3-STATE PARALLEL 45 mA 3.14 V 310 µA CMOS INDUSTRIAL R-PBGA-B165 Not Qualified e0 3 85 °C -40 °C 225 30 165 PLASTIC/EPOXY BGA BGA165,11X15,40 RECTANGULAR GRID ARRAY YES TIN LEAD BALL 1 mm BOTTOM INTEGRATED DEVICE TECHNOLOGY INC not_compliant 3A991.B.2.A 8542.32.00.41
IDT71V3558SA133BQGI
 Integrated Device Technology Inc 		Check for Price Yes Yes Transferred 4.7186 Mbit 18 256KX18 3.3 V 4.2 ns 133 MHz ZBT SRAM COMMON 1 256000 262.144 k SYNCHRONOUS 3-STATE PARALLEL 45 mA 3.14 V 310 µA 3.465 V 3.135 V CMOS INDUSTRIAL R-PBGA-B165 Not Qualified e1 3 85 °C -40 °C 260 30 165 PLASTIC/EPOXY TBGA BGA165,11X15,40 RECTANGULAR GRID ARRAY, THIN PROFILE YES Tin/Silver/Copper (Sn/Ag/Cu) BALL 1 mm BOTTOM 1.2 mm 15 mm 13 mm INTEGRATED DEVICE TECHNOLOGY INC BGA TBGA, BGA165,11X15,40 165 compliant 3A991.B.2.A 8542.32.00.41 1998-08-01
IDT71V3558SA133BQ
 Integrated Device Technology Inc 		Check for Price No Obsolete 4.7186 Mbit 18 256KX18 3.3 V 4.2 ns 133 MHz ZBT SRAM COMMON 1 256000 262.144 k SYNCHRONOUS 3-STATE PARALLEL 40 mA 3.14 V 300 µA 3.465 V 3.135 V CMOS COMMERCIAL R-PBGA-B165 Not Qualified e0 3 70 °C 225 30 165 PLASTIC/EPOXY TBGA BGA165,11X15,40 RECTANGULAR GRID ARRAY, THIN PROFILE YES TIN LEAD BALL 1 mm BOTTOM 1.2 mm 15 mm 13 mm INTEGRATED DEVICE TECHNOLOGY INC BGA 13 X 15 MM, FINE PITCH, BGA-165 165 not_compliant 3A991.B.2.A 8542.32.00.41
IDT71V3558SA133BQG8
 Integrated Device Technology Inc 		Check for Price Yes Yes Transferred 4.7186 Mbit 18 256KX18 3.3 V 4.2 ns 133 MHz ZBT SRAM COMMON 256000 262.144 k SYNCHRONOUS 3-STATE PARALLEL 40 mA 3.14 V 300 µA CMOS COMMERCIAL R-PBGA-B165 Not Qualified e1 3 70 °C 260 30 165 PLASTIC/EPOXY BGA BGA165,11X15,40 RECTANGULAR GRID ARRAY YES Tin/Silver/Copper (Sn/Ag/Cu) BALL 1 mm BOTTOM INTEGRATED DEVICE TECHNOLOGY INC BGA, BGA165,11X15,40 compliant 3A991.B.2.A 8542.32.00.41 1998-08-01