Findchips: Parametric Search Results for IDT71V3559S80PF


Select Parts		Part Number

		IDT71V3559S80PF8 Integrated Device Technology Inc
		IDT71V3559S80PF9 Integrated Device Technology Inc
		IDT71V3559S80PFG8 Integrated Device Technology Inc
		IDT71V3559S80PFG Integrated Device Technology Inc
		IDT71V3559S80PFGI Integrated Device Technology Inc
		IDT71V3559S80PFI8 Integrated Device Technology Inc
		IDT71V3559S80PF Integrated Device Technology Inc
		IDT71V3559S80PFI Integrated Device Technology Inc
		IDT71V3559S80PFI9 Integrated Device Technology Inc

				Most Relevant						Technical																Compliance			Operating Conditions					Physical											Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Memory Density	Memory Width	Organization	Supply Voltage-Nom (Vsup)	Access Time-Max	Clock Frequency-Max (fCLK)	Memory IC Type	Additional Feature	I/O Type	Number of Functions	Number of Words Code	Number of Words	Operating Mode	Output Characteristics	Parallel/Serial	Standby Current-Max	Standby Voltage-Min	Supply Current-Max	Supply Voltage-Max (Vsup)	Supply Voltage-Min (Vsup)	Technology	Temperature Grade	JESD-30 Code	Qualification Status	JESD-609 Code	Moisture Sensitivity Level	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Length	Width	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Reach Compliance Code	ECCN Code	HTS Code	Date Of Intro

Check for Price

Obsolete

4.7186 Mbit

256KX18

3.3 V

8 ns

95 MHz

ZBT SRAM

FLOW-THROUGH ARCHITECTURE

COMMON

256000

262.144 k

SYNCHRONOUS

3-STATE

PARALLEL

40 mA

3.14 V

250 µA

3.465 V

3.135 V

CMOS

COMMERCIAL

R-PQFP-G100

Not Qualified

70 °C

225

100

PLASTIC/EPOXY

LQFP

QFP100,.63X.87

RECTANGULAR

FLATPACK, LOW PROFILE

YES

Tin/Lead (Sn85Pb15)

GULL WING

650 µm

QUAD

1.6 mm

20 mm

14 mm

INTEGRATED DEVICE TECHNOLOGY INC

QFP

14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100

100

not_compliant

3A991.B.2.A

8542.32.00.41

Check for Price

Obsolete

4.7186 Mbit

256KX18

3.3 V

8 ns

ZBT SRAM

FLOW-THROUGH ARCHITECTURE

256000

262.144 k

SYNCHRONOUS

PARALLEL

3.465 V

3.135 V

CMOS

COMMERCIAL

R-PQFP-G100

Not Qualified

70 °C

NOT SPECIFIED

100

PLASTIC/EPOXY

LQFP

RECTANGULAR

FLATPACK, LOW PROFILE

YES

Tin/Lead (Sn/Pb)

GULL WING

650 µm

QUAD

1.6 mm

20 mm

14 mm

INTEGRATED DEVICE TECHNOLOGY INC

QFP

LQFP,

100

compliant

3A991.B.2.A

8542.32.00.41

Check for Price

Yes

Transferred

4.7186 Mbit

256KX18

3.3 V

8 ns

CACHE SRAM

FLOW-THROUGH ARCHITECTURE

256000

262.144 k

SYNCHRONOUS

PARALLEL

3.465 V

3.135 V

CMOS

COMMERCIAL

R-PQFP-G100

Not Qualified

70 °C

NOT SPECIFIED

100

PLASTIC/EPOXY

LQFP

RECTANGULAR

FLATPACK, LOW PROFILE

YES

Matte Tin (Sn)

GULL WING

650 µm

QUAD

1.6 mm

20 mm

14 mm

INTEGRATED DEVICE TECHNOLOGY INC

QFP

LQFP,

100

compliant

3A991.B.2.A

8542.32.00.41

Check for Price

Yes

Transferred

4.7186 Mbit

256KX18

3.3 V

8 ns

95 MHz

CACHE SRAM

FLOW-THROUGH ARCHITECTURE

COMMON

256000

262.144 k

SYNCHRONOUS

3-STATE

PARALLEL

40 mA

3.14 V

250 µA

3.465 V

3.135 V

CMOS

COMMERCIAL

R-PQFP-G100

Not Qualified

70 °C

260

100

PLASTIC/EPOXY

LQFP

QFP100,.63X.87

RECTANGULAR

FLATPACK, LOW PROFILE

YES

Matte Tin (Sn) - annealed

GULL WING

650 µm

QUAD

1.6 mm

20 mm

14 mm

INTEGRATED DEVICE TECHNOLOGY INC

QFP

LQFP, QFP100,.63X.87

100

compliant

3A991.B.2.A

8542.32.00.41

1998-08-01

Check for Price

Yes

Transferred

4.7186 Mbit

256KX18

3.3 V

8 ns

95 MHz

CACHE SRAM

FLOW-THROUGH ARCHITECTURE

COMMON

256000

262.144 k

SYNCHRONOUS

3-STATE

PARALLEL

45 mA

3.14 V

260 µA

3.465 V

3.135 V

CMOS

INDUSTRIAL

R-PQFP-G100

Not Qualified

85 °C

-40 °C

260

100

PLASTIC/EPOXY

LQFP

QFP100,.63X.87

RECTANGULAR

FLATPACK, LOW PROFILE

YES

Matte Tin (Sn) - annealed

GULL WING

650 µm

QUAD

1.6 mm

20 mm

14 mm

INTEGRATED DEVICE TECHNOLOGY INC

QFP

LQFP, QFP100,.63X.87

100

compliant

3A991.B.2.A

8542.32.00.41

1998-08-01

Check for Price

Obsolete

4.7186 Mbit

256KX18

3.3 V

8 ns

95 MHz

ZBT SRAM

FLOW-THROUGH ARCHITECTURE

COMMON

256000

262.144 k

SYNCHRONOUS

3-STATE

PARALLEL

45 mA

3.14 V

260 µA

3.465 V

3.135 V

CMOS

INDUSTRIAL

R-PQFP-G100

Not Qualified

85 °C

-40 °C

225

100

PLASTIC/EPOXY

LQFP

QFP100,.63X.87

RECTANGULAR

FLATPACK, LOW PROFILE

YES

Tin/Lead (Sn85Pb15)

GULL WING

650 µm

QUAD

1.6 mm

20 mm

14 mm

INTEGRATED DEVICE TECHNOLOGY INC

QFP

14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100

100

not_compliant

3A991.B.2.A

8542.32.00.41

Check for Price

Obsolete

4.7186 Mbit

256KX18

3.3 V

8 ns

95 MHz

ZBT SRAM

FLOW-THROUGH ARCHITECTURE

COMMON

256000

262.144 k

SYNCHRONOUS

3-STATE

PARALLEL

40 mA

3.14 V

250 µA

3.465 V

3.135 V

CMOS

COMMERCIAL

R-PQFP-G100

Not Qualified

70 °C

225

100

PLASTIC/EPOXY

LQFP

QFP100,.63X.87

RECTANGULAR

FLATPACK, LOW PROFILE

YES

Tin/Lead (Sn85Pb15)

GULL WING

650 µm

QUAD

1.6 mm

20 mm

14 mm

INTEGRATED DEVICE TECHNOLOGY INC

QFP

14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100

100

not_compliant

3A991.B.2.A

8542.32.00.41

Check for Price

Obsolete

4.7186 Mbit

256KX18

3.3 V

8 ns

95 MHz

ZBT SRAM

FLOW-THROUGH ARCHITECTURE

COMMON

256000

262.144 k

SYNCHRONOUS

3-STATE

PARALLEL

45 mA

3.14 V

260 µA

3.465 V

3.135 V

CMOS

INDUSTRIAL

R-PQFP-G100

Not Qualified

85 °C

-40 °C

225

100

PLASTIC/EPOXY

LQFP

QFP100,.63X.87

RECTANGULAR

FLATPACK, LOW PROFILE

YES

Tin/Lead (Sn85Pb15)

GULL WING

650 µm

QUAD

1.6 mm

20 mm

14 mm

INTEGRATED DEVICE TECHNOLOGY INC

QFP

14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100

100

not_compliant

3A991.B.2.A

8542.32.00.41

Check for Price

Obsolete

4.7186 Mbit

256KX18

3.3 V

8 ns

ZBT SRAM

FLOW-THROUGH ARCHITECTURE

256000

262.144 k

SYNCHRONOUS

PARALLEL

3.465 V

3.135 V

CMOS

INDUSTRIAL

R-PQFP-G100

Not Qualified

85 °C

-40 °C

NOT SPECIFIED

100

PLASTIC/EPOXY

LQFP

RECTANGULAR

FLATPACK, LOW PROFILE

YES

Tin/Lead (Sn/Pb)

GULL WING

650 µm

QUAD

1.6 mm

20 mm

14 mm

INTEGRATED DEVICE TECHNOLOGY INC

QFP

LQFP,

100

compliant

3A991.B.2.A

8542.32.00.41

Compare

IDT71V3559S80PF8

Integrated Device Technology Inc

Check for Price

Obsolete

4.7186 Mbit

256KX18

3.3 V

8 ns

95 MHz

ZBT SRAM

FLOW-THROUGH ARCHITECTURE

COMMON

256000

262.144 k

SYNCHRONOUS

3-STATE

PARALLEL

40 mA

3.14 V

250 µA

3.465 V

3.135 V

CMOS

COMMERCIAL

R-PQFP-G100

Not Qualified

70 °C

225

100

PLASTIC/EPOXY

LQFP

QFP100,.63X.87

RECTANGULAR

FLATPACK, LOW PROFILE

YES

Tin/Lead (Sn85Pb15)

GULL WING

650 µm

QUAD

1.6 mm

20 mm

14 mm

INTEGRATED DEVICE TECHNOLOGY INC

QFP

14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100

100

not_compliant

3A991.B.2.A

8542.32.00.41

IDT71V3559S80PF9

Integrated Device Technology Inc

Check for Price

Obsolete

4.7186 Mbit

256KX18

3.3 V

8 ns

ZBT SRAM

FLOW-THROUGH ARCHITECTURE

256000

262.144 k

SYNCHRONOUS

PARALLEL

3.465 V

3.135 V

CMOS

COMMERCIAL

R-PQFP-G100

Not Qualified

70 °C

NOT SPECIFIED

100

PLASTIC/EPOXY

LQFP

RECTANGULAR

FLATPACK, LOW PROFILE

YES

Tin/Lead (Sn/Pb)

GULL WING

650 µm

QUAD

1.6 mm

20 mm

14 mm

INTEGRATED DEVICE TECHNOLOGY INC

QFP

LQFP,

100

compliant

3A991.B.2.A

8542.32.00.41

IDT71V3559S80PFG8

Integrated Device Technology Inc

Check for Price

Yes

Transferred

4.7186 Mbit

256KX18

3.3 V

8 ns

CACHE SRAM

FLOW-THROUGH ARCHITECTURE

256000

262.144 k

SYNCHRONOUS

PARALLEL

3.465 V

3.135 V

CMOS

COMMERCIAL

R-PQFP-G100

Not Qualified

70 °C

NOT SPECIFIED

100

PLASTIC/EPOXY

LQFP

RECTANGULAR

FLATPACK, LOW PROFILE

YES

Matte Tin (Sn)

GULL WING

650 µm

QUAD

1.6 mm

20 mm

14 mm

INTEGRATED DEVICE TECHNOLOGY INC

QFP

LQFP,

100

compliant

3A991.B.2.A

8542.32.00.41

IDT71V3559S80PFG

Integrated Device Technology Inc

Check for Price

Yes

Transferred

4.7186 Mbit

256KX18

3.3 V

8 ns

95 MHz

CACHE SRAM

FLOW-THROUGH ARCHITECTURE

COMMON

256000

262.144 k

SYNCHRONOUS

3-STATE

PARALLEL

40 mA

3.14 V

250 µA

3.465 V

3.135 V

CMOS

COMMERCIAL

R-PQFP-G100

Not Qualified

70 °C

260

100

PLASTIC/EPOXY

LQFP

QFP100,.63X.87

RECTANGULAR

FLATPACK, LOW PROFILE

YES

Matte Tin (Sn) - annealed

GULL WING

650 µm

QUAD

1.6 mm

20 mm

14 mm

INTEGRATED DEVICE TECHNOLOGY INC

QFP

LQFP, QFP100,.63X.87

100

compliant

3A991.B.2.A

8542.32.00.41

1998-08-01

IDT71V3559S80PFGI

Integrated Device Technology Inc

Check for Price

Yes

Transferred

4.7186 Mbit

256KX18

3.3 V

8 ns

95 MHz

CACHE SRAM

FLOW-THROUGH ARCHITECTURE

COMMON

256000

262.144 k

SYNCHRONOUS

3-STATE

PARALLEL

45 mA

3.14 V

260 µA

3.465 V

3.135 V

CMOS

INDUSTRIAL

R-PQFP-G100

Not Qualified

85 °C

-40 °C

260

100

PLASTIC/EPOXY

LQFP

QFP100,.63X.87

RECTANGULAR

FLATPACK, LOW PROFILE

YES

Matte Tin (Sn) - annealed

GULL WING

650 µm

QUAD

1.6 mm

20 mm

14 mm

INTEGRATED DEVICE TECHNOLOGY INC

QFP

LQFP, QFP100,.63X.87

100

compliant

3A991.B.2.A

8542.32.00.41

1998-08-01

IDT71V3559S80PFI8

Integrated Device Technology Inc

Check for Price

Obsolete

4.7186 Mbit

256KX18

3.3 V

8 ns

95 MHz

ZBT SRAM

FLOW-THROUGH ARCHITECTURE

COMMON

256000

262.144 k

SYNCHRONOUS

3-STATE

PARALLEL

45 mA

3.14 V

260 µA

3.465 V

3.135 V

CMOS

INDUSTRIAL

R-PQFP-G100

Not Qualified

85 °C

-40 °C

225

100

PLASTIC/EPOXY

LQFP

QFP100,.63X.87

RECTANGULAR

FLATPACK, LOW PROFILE

YES

Tin/Lead (Sn85Pb15)

GULL WING

650 µm

QUAD

1.6 mm

20 mm

14 mm

INTEGRATED DEVICE TECHNOLOGY INC

QFP

14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100

100

not_compliant

3A991.B.2.A

8542.32.00.41

IDT71V3559S80PF

Integrated Device Technology Inc

Check for Price

Obsolete

4.7186 Mbit

256KX18

3.3 V

8 ns

95 MHz

ZBT SRAM

FLOW-THROUGH ARCHITECTURE

COMMON

256000

262.144 k

SYNCHRONOUS

3-STATE

PARALLEL

40 mA

3.14 V

250 µA

3.465 V

3.135 V

CMOS

COMMERCIAL

R-PQFP-G100

Not Qualified

70 °C

225

100

PLASTIC/EPOXY

LQFP

QFP100,.63X.87

RECTANGULAR

FLATPACK, LOW PROFILE

YES

Tin/Lead (Sn85Pb15)

GULL WING

650 µm

QUAD

1.6 mm

20 mm

14 mm

INTEGRATED DEVICE TECHNOLOGY INC

QFP

14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100

100

not_compliant

3A991.B.2.A

8542.32.00.41

IDT71V3559S80PFI

Integrated Device Technology Inc

Check for Price

Obsolete

4.7186 Mbit

256KX18

3.3 V

8 ns

95 MHz

ZBT SRAM

FLOW-THROUGH ARCHITECTURE

COMMON

256000

262.144 k

SYNCHRONOUS

3-STATE

PARALLEL

45 mA

3.14 V

260 µA

3.465 V

3.135 V

CMOS

INDUSTRIAL

R-PQFP-G100

Not Qualified

85 °C

-40 °C

225

100

PLASTIC/EPOXY

LQFP

QFP100,.63X.87

RECTANGULAR

FLATPACK, LOW PROFILE

YES

Tin/Lead (Sn85Pb15)

GULL WING

650 µm

QUAD

1.6 mm

20 mm

14 mm

INTEGRATED DEVICE TECHNOLOGY INC

QFP

14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100

100

not_compliant

3A991.B.2.A

8542.32.00.41

IDT71V3559S80PFI9

Integrated Device Technology Inc

Check for Price

Obsolete

4.7186 Mbit

256KX18

3.3 V

8 ns

ZBT SRAM

FLOW-THROUGH ARCHITECTURE

256000

262.144 k

SYNCHRONOUS

PARALLEL

3.465 V

3.135 V

CMOS

INDUSTRIAL

R-PQFP-G100

Not Qualified

85 °C

-40 °C

NOT SPECIFIED

100

PLASTIC/EPOXY

LQFP

RECTANGULAR

FLATPACK, LOW PROFILE

YES

Tin/Lead (Sn/Pb)

GULL WING

650 µm

QUAD

1.6 mm

20 mm

14 mm

INTEGRATED DEVICE TECHNOLOGY INC

QFP

LQFP,

100

compliant

3A991.B.2.A

8542.32.00.41

Parametric results for: IDT71V3559S80PF under SRAMs