Parametric results for: IDT71V3577S80PF under SRAMs

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Manufacturer Part Number: idt71v3577s80pf
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IDT71V3577S80PF9
Integrated Device Technology Inc
Check for Price No No Obsolete 4.7186 Mbit 36 128KX36 3.3 V 8 ns CACHE SRAM FLOW-THROUGH ARCHITECTURE 1 128000 131.072 k SYNCHRONOUS PARALLEL 3.465 V 3.135 V CMOS COMMERCIAL R-PQFP-G100 Not Qualified e0 3 70 °C NOT SPECIFIED NOT SPECIFIED 100 PLASTIC/EPOXY LQFP RECTANGULAR FLATPACK, LOW PROFILE YES Tin/Lead (Sn/Pb) GULL WING 650 µm QUAD 1.6 mm 20 mm 14 mm INTEGRATED DEVICE TECHNOLOGY INC QFP LQFP, 100 compliant 3A991.B.2.A 8542.32.00.41
IDT71V3577S80PF
Integrated Device Technology Inc
Check for Price No Obsolete 4.7186 Mbit 36 128KX36 3.3 V 8 ns 100 MHz CACHE SRAM FLOW-THROUGH ARCHITECTURE COMMON 1 128000 131.072 k SYNCHRONOUS 3-STATE PARALLEL 30 mA 3.14 V 200 µA 3.465 V 3.135 V CMOS COMMERCIAL R-PQFP-G100 Not Qualified e0 3 70 °C 225 20 100 PLASTIC/EPOXY LQFP QFP100,.63X.87 RECTANGULAR FLATPACK, LOW PROFILE YES Tin/Lead (Sn85Pb15) GULL WING 650 µm QUAD 1.6 mm 20 mm 14 mm INTEGRATED DEVICE TECHNOLOGY INC QFP 14 X 20 MM, PLASTIC, TQFP-100 100 not_compliant 3A991.B.2.A 8542.32.00.41
IDT71V3577S80PF8
Integrated Device Technology Inc
Check for Price No Obsolete 4.7186 Mbit 36 128KX36 3.3 V 8 ns 100 MHz CACHE SRAM FLOW-THROUGH ARCHITECTURE COMMON 1 128000 131.072 k SYNCHRONOUS 3-STATE PARALLEL 30 mA 3.14 V 200 µA 3.465 V 3.135 V CMOS COMMERCIAL R-PQFP-G100 Not Qualified e0 3 70 °C 225 20 100 PLASTIC/EPOXY LQFP QFP100,.63X.87 RECTANGULAR FLATPACK, LOW PROFILE YES Tin/Lead (Sn85Pb15) GULL WING 650 µm QUAD 1.6 mm 20 mm 14 mm INTEGRATED DEVICE TECHNOLOGY INC QFP 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100 100 not_compliant 3A991.B.2.A 8542.32.00.41
IDT71V3577S80PFG8
Integrated Device Technology Inc
Check for Price Yes Yes Transferred 4.7186 Mbit 36 128KX36 3.3 V 8 ns CACHE SRAM FLOW-THROUGH ARCHITECTURE 1 128000 131.072 k SYNCHRONOUS PARALLEL 3.465 V 3.135 V CMOS COMMERCIAL R-PQFP-G100 Not Qualified e3 3 70 °C NOT SPECIFIED NOT SPECIFIED 100 PLASTIC/EPOXY LQFP RECTANGULAR FLATPACK, LOW PROFILE YES Matte Tin (Sn) GULL WING 650 µm QUAD 1.6 mm 20 mm 14 mm INTEGRATED DEVICE TECHNOLOGY INC QFP LQFP, 100 compliant 3A991.B.2.A 8542.32.00.41
IDT71V3577S80PFI9
Integrated Device Technology Inc
Check for Price No No Obsolete 4.7186 Mbit 36 128KX36 3.3 V 8 ns CACHE SRAM FLOW-THROUGH ARCHITECTURE 1 128000 131.072 k SYNCHRONOUS PARALLEL 3.465 V 3.135 V CMOS INDUSTRIAL R-PQFP-G100 Not Qualified e0 3 85 °C -40 °C NOT SPECIFIED NOT SPECIFIED 100 PLASTIC/EPOXY LQFP RECTANGULAR FLATPACK, LOW PROFILE YES Tin/Lead (Sn/Pb) GULL WING 650 µm QUAD 1.6 mm 20 mm 14 mm INTEGRATED DEVICE TECHNOLOGY INC QFP LQFP, 100 compliant 3A991.B.2.A 8542.32.00.41
IDT71V3577S80PFG
Integrated Device Technology Inc
Check for Price Yes Yes Transferred 4.7186 Mbit 36 128KX36 3.3 V 8 ns CACHE SRAM FLOW-THROUGH ARCHITECTURE 1 128000 131.072 k SYNCHRONOUS PARALLEL 3.465 V 3.135 V CMOS COMMERCIAL R-PQFP-G100 Not Qualified e3 3 70 °C NOT SPECIFIED NOT SPECIFIED 100 PLASTIC/EPOXY LQFP RECTANGULAR FLATPACK, LOW PROFILE YES Matte Tin (Sn) GULL WING 650 µm QUAD 1.6 mm 20 mm 14 mm INTEGRATED DEVICE TECHNOLOGY INC QFP LQFP, 100 compliant 3A991.B.2.A 8542.32.00.41
IDT71V3577S80PFI
Integrated Device Technology Inc
Check for Price No Obsolete 4.7186 Mbit 36 128KX36 3.3 V 8 ns 100 MHz CACHE SRAM FLOW-THROUGH ARCHITECTURE COMMON 1 128000 131.072 k SYNCHRONOUS 3-STATE PARALLEL 35 mA 3.14 V 210 µA 3.465 V 3.135 V CMOS INDUSTRIAL R-PQFP-G100 Not Qualified e0 3 85 °C -40 °C 225 20 100 PLASTIC/EPOXY LQFP QFP100,.63X.87 RECTANGULAR FLATPACK, LOW PROFILE YES Tin/Lead (Sn85Pb15) GULL WING 650 µm QUAD 1.6 mm 20 mm 14 mm INTEGRATED DEVICE TECHNOLOGY INC QFP 14 X 20 MM, PLASTIC, TQFP-100 100 not_compliant 3A991.B.2.A 8542.32.00.41
IDT71V3577S80PFGI
Integrated Device Technology Inc
Check for Price Yes Yes Transferred 4.7186 Mbit 36 128KX36 3.3 V 8 ns CACHE SRAM FLOW-THROUGH ARCHITECTURE 1 128000 131.072 k SYNCHRONOUS PARALLEL 3.465 V 3.135 V CMOS INDUSTRIAL R-PQFP-G100 Not Qualified e3 3 85 °C -40 °C NOT SPECIFIED NOT SPECIFIED 100 PLASTIC/EPOXY LQFP RECTANGULAR FLATPACK, LOW PROFILE YES Matte Tin (Sn) GULL WING 650 µm QUAD 1.6 mm 20 mm 14 mm INTEGRATED DEVICE TECHNOLOGY INC QFP LQFP, 100 compliant 3A991.B.2.A 8542.32.00.41
IDT71V3577S80PFI8
Integrated Device Technology Inc
Check for Price No Obsolete 4.7186 Mbit 36 128KX36 3.3 V 8 ns 100 MHz CACHE SRAM FLOW-THROUGH ARCHITECTURE COMMON 1 128000 131.072 k SYNCHRONOUS 3-STATE PARALLEL 35 mA 3.14 V 210 µA 3.465 V 3.135 V CMOS INDUSTRIAL R-PQFP-G100 Not Qualified e0 3 85 °C -40 °C 225 20 100 PLASTIC/EPOXY LQFP QFP100,.63X.87 RECTANGULAR FLATPACK, LOW PROFILE YES Tin/Lead (Sn85Pb15) GULL WING 650 µm QUAD 1.6 mm 20 mm 14 mm INTEGRATED DEVICE TECHNOLOGY INC QFP 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100 100 not_compliant 3A991.B.2.A 8542.32.00.41
IDT71V3577S80PFGI8
Integrated Device Technology Inc
Check for Price Yes Yes Transferred 4.7186 Mbit 36 128KX36 3.3 V 8 ns CACHE SRAM FLOW-THROUGH ARCHITECTURE 1 128000 131.072 k SYNCHRONOUS PARALLEL 3.465 V 3.135 V CMOS INDUSTRIAL R-PQFP-G100 Not Qualified e3 3 85 °C -40 °C NOT SPECIFIED NOT SPECIFIED 100 PLASTIC/EPOXY LQFP RECTANGULAR FLATPACK, LOW PROFILE YES Matte Tin (Sn) GULL WING 650 µm QUAD 1.6 mm 20 mm 14 mm INTEGRATED DEVICE TECHNOLOGY INC QFP LQFP, 100 compliant 3A991.B.2.A 8542.32.00.41