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Manufacturer Part Number: idt71v65902
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IDT71V65902S85BGGI
 Integrated Device Technology Inc 		Check for Price Yes Yes Obsolete 9.4372 Mbit 18 512KX18 3.3 V 8.5 ns ZBT SRAM FLOW-THROUGH ARCHITECTURE 1 512000 524.288 k SYNCHRONOUS PARALLEL 3.465 V 3.135 V CMOS INDUSTRIAL R-PBGA-B119 Not Qualified e1 3 85 °C -40 °C 119 PLASTIC/EPOXY BGA RECTANGULAR GRID ARRAY YES TIN SILVER COPPER BALL 1.27 mm BOTTOM 2.36 mm 22 mm 14 mm INTEGRATED DEVICE TECHNOLOGY INC BGA 14 X 22 MM, PLASTIC, BGA-119 119 compliant 3A991.B.2.A 8542.32.00.41
IDT71V65902S75PFGI
 Integrated Device Technology Inc 		Check for Price Yes Yes Obsolete 9.4372 Mbit 18 512KX18 3.3 V 7.5 ns ZBT SRAM FLOW-THROUGH ARCHITECTURE 1 512000 524.288 k SYNCHRONOUS PARALLEL 3.465 V 3.135 V CMOS INDUSTRIAL R-PQFP-G100 Not Qualified e3 3 85 °C -40 °C NOT SPECIFIED NOT SPECIFIED 100 PLASTIC/EPOXY LQFP RECTANGULAR FLATPACK, LOW PROFILE YES Matte Tin (Sn) GULL WING 650 µm QUAD 1.6 mm 20 mm 14 mm INTEGRATED DEVICE TECHNOLOGY INC QFP 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100 100 compliant 3A991.B.2.A 8542.32.00.41
IDT71V65902S85BQI
 Integrated Device Technology Inc 		Check for Price No Obsolete 9.4372 Mbit 18 512KX18 3.3 V 8.5 ns 90 MHz ZBT SRAM FLOW-THROUGH ARCHITECTURE COMMON 1 512000 524.288 k SYNCHRONOUS 3-STATE PARALLEL 60 mA 3.14 V 245 µA 3.465 V 3.135 V CMOS INDUSTRIAL R-PBGA-B165 Not Qualified e0 3 85 °C -40 °C 225 30 165 PLASTIC/EPOXY TBGA BGA165,11X15,40 RECTANGULAR GRID ARRAY, THIN PROFILE YES TIN LEAD BALL 1 mm BOTTOM 1.2 mm 15 mm 13 mm INTEGRATED DEVICE TECHNOLOGY INC BGA 13 X 15 MM, FPBGA-165 165 not_compliant 3A991.B.2.A 8542.32.00.41
IDT71V65902S85BG8
 Integrated Device Technology Inc 		Check for Price No Obsolete 9.4372 Mbit 18 512KX18 3.3 V 8.5 ns 90 MHz ZBT SRAM FLOW-THROUGH ARCHITECTURE COMMON 1 512000 524.288 k SYNCHRONOUS 3-STATE PARALLEL 40 mA 3.14 V 225 µA 3.465 V 3.135 V CMOS COMMERCIAL R-PBGA-B119 Not Qualified e0 3 70 °C 225 20 119 PLASTIC/EPOXY BGA BGA119,7X17,50 RECTANGULAR GRID ARRAY YES TIN LEAD BALL 1.27 mm BOTTOM 2.36 mm 22 mm 14 mm INTEGRATED DEVICE TECHNOLOGY INC BGA 14 X 22 MM, PLASTIC, BGA-119 119 not_compliant 3A991.B.2.A 8542.32.00.41
IDT71V65902S85BG
 Integrated Device Technology Inc 		Check for Price No Obsolete 9.4372 Mbit 18 512KX18 3.3 V 8.5 ns 90 MHz ZBT SRAM FLOW-THROUGH ARCHITECTURE COMMON 1 512000 524.288 k SYNCHRONOUS 3-STATE PARALLEL 40 mA 3.14 V 225 µA 3.465 V 3.135 V CMOS COMMERCIAL R-PBGA-B119 Not Qualified e0 3 70 °C 225 20 119 PLASTIC/EPOXY BGA BGA119,7X17,50 RECTANGULAR GRID ARRAY YES TIN LEAD BALL 1.27 mm BOTTOM 2.36 mm 22 mm 14 mm INTEGRATED DEVICE TECHNOLOGY INC BGA 14 X 22 MM, PLASTIC, BGA-119 119 not_compliant 3A991.B.2.A 8542.32.00.41
IDT71V65902S85PF
 Integrated Device Technology Inc 		Check for Price No Obsolete 9.4372 Mbit 18 512KX18 3.3 V 8.5 ns 90 MHz ZBT SRAM FLOW-THROUGH ARCHITECTURE COMMON 1 512000 524.288 k SYNCHRONOUS 3-STATE PARALLEL 40 mA 3.14 V 225 µA 3.465 V 3.135 V CMOS COMMERCIAL R-PQFP-G100 Not Qualified e0 3 70 °C 225 20 100 PLASTIC/EPOXY LQFP QFP100,.63X.87 RECTANGULAR FLATPACK, LOW PROFILE YES Tin/Lead (Sn85Pb15) GULL WING 650 µm QUAD 1.6 mm 20 mm 14 mm INTEGRATED DEVICE TECHNOLOGY INC QFP 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100 100 not_compliant 3A991.B.2.A 8542.32.00.41
IDT71V65902S80PFGI
 Integrated Device Technology Inc 		Check for Price Yes Yes Obsolete 9.4372 Mbit 18 512KX18 3.3 V 8 ns ZBT SRAM FLOW-THROUGH ARCHITECTURE 1 512000 524.288 k SYNCHRONOUS PARALLEL 3.465 V 3.135 V CMOS INDUSTRIAL R-PQFP-G100 Not Qualified e3 3 85 °C -40 °C NOT SPECIFIED NOT SPECIFIED 100 PLASTIC/EPOXY LQFP RECTANGULAR FLATPACK, LOW PROFILE YES Matte Tin (Sn) GULL WING 650 µm QUAD 1.6 mm 20 mm 14 mm INTEGRATED DEVICE TECHNOLOGY INC QFP 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100 100 compliant 3A991.B.2.A 8542.32.00.41
IDT71V65902S85PFG
 Integrated Device Technology Inc 		Check for Price Yes Yes Obsolete 9.4372 Mbit 18 512KX18 3.3 V 8.5 ns ZBT SRAM FLOW-THROUGH ARCHITECTURE 1 512000 524.288 k SYNCHRONOUS PARALLEL 3.465 V 3.135 V CMOS COMMERCIAL R-PQFP-G100 Not Qualified e3 3 70 °C NOT SPECIFIED NOT SPECIFIED 100 PLASTIC/EPOXY LQFP RECTANGULAR FLATPACK, LOW PROFILE YES Matte Tin (Sn) GULL WING 650 µm QUAD 1.6 mm 20 mm 14 mm INTEGRATED DEVICE TECHNOLOGY INC QFP 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100 100 compliant 3A991.B.2.A 8542.32.00.41
IDT71V65902S80PF
 Integrated Device Technology Inc 		Check for Price No Obsolete 9.4372 Mbit 18 512KX18 3.3 V 8 ns 95 MHz ZBT SRAM FLOW-THROUGH ARCHITECTURE COMMON 1 512000 524.288 k SYNCHRONOUS 3-STATE PARALLEL 40 mA 3.14 V 250 µA 3.465 V 3.135 V CMOS COMMERCIAL R-PQFP-G100 Not Qualified e0 3 70 °C 225 20 100 PLASTIC/EPOXY LQFP QFP100,.63X.87 RECTANGULAR FLATPACK, LOW PROFILE YES Tin/Lead (Sn85Pb15) GULL WING 650 µm QUAD 1.6 mm 20 mm 14 mm INTEGRATED DEVICE TECHNOLOGY INC QFP 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100 100 not_compliant 3A991.B.2.A 8542.32.00.41
IDT71V65902S80BQGI
 Integrated Device Technology Inc 		Check for Price Yes Yes Obsolete 9.4372 Mbit 18 512KX18 3.3 V 8 ns ZBT SRAM FLOW-THROUGH ARCHITECTURE 1 512000 524.288 k SYNCHRONOUS PARALLEL 3.465 V 3.135 V CMOS INDUSTRIAL R-PBGA-B165 Not Qualified e1 3 85 °C -40 °C 165 PLASTIC/EPOXY TBGA RECTANGULAR GRID ARRAY, THIN PROFILE YES TIN SILVER COPPER BALL 1 mm BOTTOM 1.2 mm 15 mm 13 mm INTEGRATED DEVICE TECHNOLOGY INC BGA 13 X 15 MM, FPBGA-165 165 compliant 3A991.B.2.A 8542.32.00.41
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