Findchips: Parametric Search Results for IDT71V67703S75BQ


Select Parts		Part Number

		IDT71V67703S75BQI Integrated Device Technology Inc
		IDT71V67703S75BQG Integrated Device Technology Inc
		IDT71V67703S75BQGI Integrated Device Technology Inc
		IDT71V67703S75BQ Integrated Device Technology Inc

				Most Relevant						Technical																Compliance			Operating Conditions					Physical											Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Memory Density	Memory Width	Organization	Supply Voltage-Nom (Vsup)	Access Time-Max	Clock Frequency-Max (fCLK)	Memory IC Type	Additional Feature	I/O Type	Number of Functions	Number of Words Code	Number of Words	Operating Mode	Output Characteristics	Parallel/Serial	Standby Current-Max	Standby Voltage-Min	Supply Current-Max	Supply Voltage-Max (Vsup)	Supply Voltage-Min (Vsup)	Technology	Temperature Grade	JESD-30 Code	Qualification Status	JESD-609 Code	Moisture Sensitivity Level	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Length	Width	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Reach Compliance Code	ECCN Code	HTS Code

Check for Price

Transferred

9.4372 Mbit

256KX36

3.3 V

7.5 ns

117 MHz

CACHE SRAM

FLOW-THROUGH ARCHITECTURE

COMMON

256000

262.144 k

SYNCHRONOUS

3-STATE

PARALLEL

70 mA

3.14 V

285 µA

3.465 V

3.135 V

CMOS

INDUSTRIAL

R-PBGA-B165

Not Qualified

85 °C

-40 °C

225

165

PLASTIC/EPOXY

TBGA

BGA165,11X15,40

RECTANGULAR

GRID ARRAY, THIN PROFILE

YES

TIN LEAD

BALL

1 mm

BOTTOM

1.2 mm

15 mm

13 mm

INTEGRATED DEVICE TECHNOLOGY INC

BGA

TBGA, BGA165,11X15,40

165

not_compliant

3A991.B.2.A

8542.32.00.41

Check for Price

Yes

Transferred

9.4372 Mbit

256KX36

3.3 V

7.5 ns

CACHE SRAM

FLOW-THROUGH ARCHITECTURE

256000

262.144 k

SYNCHRONOUS

PARALLEL

3.465 V

3.135 V

CMOS

COMMERCIAL

R-PBGA-B165

Not Qualified

70 °C

165

PLASTIC/EPOXY

TBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE

YES

TIN SILVER COPPER

BALL

1 mm

BOTTOM

1.2 mm

15 mm

13 mm

INTEGRATED DEVICE TECHNOLOGY INC

BGA

TBGA,

165

compliant

3A991.B.2.A

8542.32.00.41

Check for Price

Yes

Transferred

9.4372 Mbit

256KX36

3.3 V

7.5 ns

CACHE SRAM

FLOW-THROUGH ARCHITECTURE

256000

262.144 k

SYNCHRONOUS

PARALLEL

3.465 V

3.135 V

CMOS

INDUSTRIAL

R-PBGA-B165

Not Qualified

85 °C

-40 °C

165

PLASTIC/EPOXY

TBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE

YES

TIN SILVER COPPER

BALL

1 mm

BOTTOM

1.2 mm

15 mm

13 mm

INTEGRATED DEVICE TECHNOLOGY INC

BGA

TBGA,

165

compliant

3A991.B.2.A

8542.32.00.41

Check for Price

Transferred

9.4372 Mbit

256KX36

3.3 V

7.5 ns

117 MHz

CACHE SRAM

FLOW-THROUGH ARCHITECTURE

COMMON

256000

262.144 k

SYNCHRONOUS

3-STATE

PARALLEL

50 mA

3.14 V

265 µA

3.465 V

3.135 V

CMOS

COMMERCIAL

R-PBGA-B165

Not Qualified

70 °C

225

165

PLASTIC/EPOXY

TBGA

BGA165,11X15,40

RECTANGULAR

GRID ARRAY, THIN PROFILE

YES

TIN LEAD

BALL

1 mm

BOTTOM

1.2 mm

15 mm

13 mm

INTEGRATED DEVICE TECHNOLOGY INC

BGA

TBGA, BGA165,11X15,40

165

not_compliant

3A991.B.2.A

8542.32.00.41

Compare

IDT71V67703S75BQI

Integrated Device Technology Inc

Check for Price

Transferred

9.4372 Mbit

256KX36

3.3 V

7.5 ns

117 MHz

CACHE SRAM

FLOW-THROUGH ARCHITECTURE

COMMON

256000

262.144 k

SYNCHRONOUS

3-STATE

PARALLEL

70 mA

3.14 V

285 µA

3.465 V

3.135 V

CMOS

INDUSTRIAL

R-PBGA-B165

Not Qualified

85 °C

-40 °C

225

165

PLASTIC/EPOXY

TBGA

BGA165,11X15,40

RECTANGULAR

GRID ARRAY, THIN PROFILE

YES

TIN LEAD

BALL

1 mm

BOTTOM

1.2 mm

15 mm

13 mm

INTEGRATED DEVICE TECHNOLOGY INC

BGA

TBGA, BGA165,11X15,40

165

not_compliant

3A991.B.2.A

8542.32.00.41

IDT71V67703S75BQG

Integrated Device Technology Inc

Check for Price

Yes

Transferred

9.4372 Mbit

256KX36

3.3 V

7.5 ns

CACHE SRAM

FLOW-THROUGH ARCHITECTURE

256000

262.144 k

SYNCHRONOUS

PARALLEL

3.465 V

3.135 V

CMOS

COMMERCIAL

R-PBGA-B165

Not Qualified

70 °C

165

PLASTIC/EPOXY

TBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE

YES

TIN SILVER COPPER

BALL

1 mm

BOTTOM

1.2 mm

15 mm

13 mm

INTEGRATED DEVICE TECHNOLOGY INC

BGA

TBGA,

165

compliant

3A991.B.2.A

8542.32.00.41

IDT71V67703S75BQGI

Integrated Device Technology Inc

Check for Price

Yes

Transferred

9.4372 Mbit

256KX36

3.3 V

7.5 ns

CACHE SRAM

FLOW-THROUGH ARCHITECTURE

256000

262.144 k

SYNCHRONOUS

PARALLEL

3.465 V

3.135 V

CMOS

INDUSTRIAL

R-PBGA-B165

Not Qualified

85 °C

-40 °C

165

PLASTIC/EPOXY

TBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE

YES

TIN SILVER COPPER

BALL

1 mm

BOTTOM

1.2 mm

15 mm

13 mm

INTEGRATED DEVICE TECHNOLOGY INC

BGA

TBGA,

165

compliant

3A991.B.2.A

8542.32.00.41

IDT71V67703S75BQ

Integrated Device Technology Inc

Check for Price

Transferred

9.4372 Mbit

256KX36

3.3 V

7.5 ns

117 MHz

CACHE SRAM

FLOW-THROUGH ARCHITECTURE

COMMON

256000

262.144 k

SYNCHRONOUS

3-STATE

PARALLEL

50 mA

3.14 V

265 µA

3.465 V

3.135 V

CMOS

COMMERCIAL

R-PBGA-B165

Not Qualified

70 °C

225

165

PLASTIC/EPOXY

TBGA

BGA165,11X15,40

RECTANGULAR

GRID ARRAY, THIN PROFILE

YES

TIN LEAD

BALL

1 mm

BOTTOM

1.2 mm

15 mm

13 mm

INTEGRATED DEVICE TECHNOLOGY INC

BGA

TBGA, BGA165,11X15,40

165

not_compliant

3A991.B.2.A

8542.32.00.41

Parametric results for: IDT71V67703S75BQ under SRAMs