Parametric results for: IDT71V6S75BGI under SRAMs

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Manufacturer Part Number: idt71v6
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IDT71V67603S150BQI
Integrated Device Technology Inc
Check for Price No No Transferred 9.4372 Mbit 36 256KX36 3.3 V 3.8 ns 150 MHz CACHE SRAM PIPELINED ARCHITECTURE COMMON 1 256000 262.144 k SYNCHRONOUS 3-STATE PARALLEL 70 mA 3.14 V 325 µA 3.465 V 3.135 V CMOS INDUSTRIAL R-PBGA-B165 Not Qualified e0 3 85 °C -40 °C 225 30 165 PLASTIC/EPOXY TBGA BGA165,11X15,40 RECTANGULAR GRID ARRAY, THIN PROFILE YES TIN LEAD BALL 1 mm BOTTOM 1.2 mm 15 mm 13 mm INTEGRATED DEVICE TECHNOLOGY INC BGA TBGA, BGA165,11X15,40 165 not_compliant 3A991.B.2.A 8542.32.00.41 1997-09-16
IDT71V67803S150BG8
Integrated Device Technology Inc
Check for Price No No Transferred 9.4372 Mbit 18 512KX18 3.3 V 3.8 ns 150 MHz CACHE SRAM PIPELINED ARCHITECTURE COMMON 1 512000 524.288 k SYNCHRONOUS 3-STATE PARALLEL 50 mA 3.14 V 305 µA 3.465 V 3.135 V CMOS COMMERCIAL R-PBGA-B119 Not Qualified e0 3 70 °C 225 20 119 PLASTIC/EPOXY BGA BGA119,7X17,50 RECTANGULAR GRID ARRAY YES Tin/Lead (Sn63Pb37) BALL 1.27 mm BOTTOM 2.36 mm 22 mm 14 mm INTEGRATED DEVICE TECHNOLOGY INC BGA BGA, BGA119,7X17,50 119 not_compliant 3A991.B.2.A 8542.32.00.41 1997-09-16
IDT71V67603S166BQG
Integrated Device Technology Inc
Check for Price Yes Yes Transferred 9.4372 Mbit 36 256KX36 3.3 V 3.5 ns CACHE SRAM PIPELINED ARCHITECTURE 1 256000 262.144 k SYNCHRONOUS PARALLEL 3.465 V 3.135 V CMOS COMMERCIAL R-PBGA-B165 Not Qualified e1 3 70 °C 165 PLASTIC/EPOXY TBGA RECTANGULAR GRID ARRAY, THIN PROFILE YES TIN SILVER COPPER BALL 1 mm BOTTOM 1.2 mm 15 mm 13 mm INTEGRATED DEVICE TECHNOLOGY INC BGA TBGA, 165 compliant 3A991.B.2.A 8542.32.00.41
IDT71V65903S85B
Integrated Device Technology Inc
Check for Price Transferred 9.4372 Mbit 18 512KX18 3.3 V 8.5 ns ZBT SRAM FLOW-THROUGH ARCHITECTURE 1 512000 524.288 k SYNCHRONOUS PARALLEL 3.465 V 3.135 V CMOS COMMERCIAL R-PBGA-B119 Not Qualified e0 70 °C 119 PLASTIC/EPOXY BGA RECTANGULAR GRID ARRAY YES TIN LEAD BALL 1.27 mm BOTTOM 2.36 mm 22 mm 14 mm INTEGRATED DEVICE TECHNOLOGY INC BGA 14 X 22 MM, PLASTIC, MS-026AA, BGA-119 119 compliant 3A991.B.2.A 8542.32.00.41
IDT71V65602S100BGI
Integrated Device Technology Inc
Check for Price No No Obsolete 9.4372 Mbit 36 256KX36 3.3 V 5 ns 100 MHz ZBT SRAM PIPELINED ARCHITECTURE COMMON 1 256000 262.144 k SYNCHRONOUS 3-STATE PARALLEL 60 mA 3.14 V 270 µA 3.465 V 3.135 V CMOS INDUSTRIAL R-PBGA-B119 Not Qualified e0 3 85 °C -40 °C 225 20 119 PLASTIC/EPOXY BGA BGA119,7X17,50 RECTANGULAR GRID ARRAY YES Tin/Lead (Sn63Pb37) BALL 1.27 mm BOTTOM 2.36 mm 22 mm 14 mm INTEGRATED DEVICE TECHNOLOGY INC BGA 14 X 22 MM, PLASTIC, BGA-119 119 not_compliant 3A991.B.2.A 8542.32.00.41
IDT71V67602S133PFI
Integrated Device Technology Inc
Check for Price No Obsolete 9.4372 Mbit 36 256KX36 3.3 V 4.2 ns 133 MHz CACHE SRAM PIPELINED ARCHITECTURE COMMON 1 256000 262.144 k SYNCHRONOUS 3-STATE PARALLEL 70 mA 3.14 V 280 µA 3.465 V 3.135 V CMOS INDUSTRIAL R-PQFP-G100 Not Qualified e0 3 85 °C -40 °C 225 20 100 PLASTIC/EPOXY LQFP QFP100,.63X.87 RECTANGULAR FLATPACK, LOW PROFILE YES Tin/Lead (Sn85Pb15) GULL WING 650 µm QUAD 1.6 mm 20 mm 14 mm INTEGRATED DEVICE TECHNOLOGY INC QFP 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100 100 not_compliant 3A991.B.2.A 8542.32.00.41
IDT71V67603S150PFGI
Integrated Device Technology Inc
Check for Price Yes Yes Transferred 9.4372 Mbit 36 256KX36 3.3 V 3.8 ns CACHE SRAM PIPELINED ARCHITECTURE 1 256000 262.144 k SYNCHRONOUS PARALLEL 3.465 V 3.135 V CMOS INDUSTRIAL R-PQFP-G100 Not Qualified e3 3 85 °C -40 °C NOT SPECIFIED NOT SPECIFIED 100 PLASTIC/EPOXY LQFP RECTANGULAR FLATPACK, LOW PROFILE YES Matte Tin (Sn) GULL WING 650 µm QUAD 1.6 mm 20 mm 14 mm INTEGRATED DEVICE TECHNOLOGY INC QFP LQFP, 100 compliant 3A991.B.2.A 8542.32.00.41
IDT71V65802133BQI
Integrated Device Technology Inc
Check for Price No No Obsolete 9.4372 Mbit 18 512KX18 3.3 V 4.2 ns ZBT SRAM PIPELINED ARCHITECTURE 1 512000 524.288 k SYNCHRONOUS PARALLEL 3.465 V 3.135 V CMOS INDUSTRIAL R-PBGA-B165 Not Qualified e0 3 85 °C -40 °C 165 PLASTIC/EPOXY TBGA RECTANGULAR GRID ARRAY, THIN PROFILE YES TIN LEAD BALL 1 mm BOTTOM 1.2 mm 15 mm 13 mm INTEGRATED DEVICE TECHNOLOGY INC BGA TBGA, 165 compliant 3A991.B.2.A 8542.32.00.41
IDT71V65902S85BGGI
Integrated Device Technology Inc
Check for Price Yes Yes Obsolete 9.4372 Mbit 18 512KX18 3.3 V 8.5 ns ZBT SRAM FLOW-THROUGH ARCHITECTURE 1 512000 524.288 k SYNCHRONOUS PARALLEL 3.465 V 3.135 V CMOS INDUSTRIAL R-PBGA-B119 Not Qualified e1 3 85 °C -40 °C 119 PLASTIC/EPOXY BGA RECTANGULAR GRID ARRAY YES TIN SILVER COPPER BALL 1.27 mm BOTTOM 2.36 mm 22 mm 14 mm INTEGRATED DEVICE TECHNOLOGY INC BGA 14 X 22 MM, PLASTIC, BGA-119 119 compliant 3A991.B.2.A 8542.32.00.41
IDT71V65602133BGI
Integrated Device Technology Inc
Check for Price No No Obsolete 9.4372 Mbit 36 256KX36 3.3 V 4.2 ns ZBT SRAM PIPELINED ARCHITECTURE 1 256000 262.144 k SYNCHRONOUS PARALLEL 3.465 V 3.135 V CMOS INDUSTRIAL R-PBGA-B119 Not Qualified e0 3 85 °C -40 °C 119 PLASTIC/EPOXY BGA RECTANGULAR GRID ARRAY YES TIN LEAD BALL 1.27 mm BOTTOM 2.36 mm 22 mm 14 mm INTEGRATED DEVICE TECHNOLOGY INC BGA BGA, 119 compliant 3A991.B.2.A 8542.32.00.41