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Manufacturer Part Number: idt7200l25j
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IDT7200L25JG8
 Integrated Device Technology Inc 		Check for Price Yes Yes Obsolete 2.304 kbit 9 256X9 5 V 25 ns 28.5 MHz 35 ns OTHER FIFO 1 256 256 words ASYNCHRONOUS NO PARALLEL 5 mA 80 µA 5.5 V 4.5 V CMOS COMMERCIAL R-PQCC-J32 Not Qualified e3 1 70 °C 260 30 32 PLASTIC/EPOXY QCCJ LDCC32,.5X.6 RECTANGULAR CHIP CARRIER YES Matte Tin (Sn) - annealed J BEND 1.27 mm QUAD INTEGRATED DEVICE TECHNOLOGY INC LCC-32 unknown EAR99 8542.32.00.71
IDT7200L25JG
 Integrated Device Technology Inc 		Check for Price Yes Yes Transferred 2.304 kbit 9 256X9 5 V 25 ns 28.5 MHz 35 ns OTHER FIFO RETRANSMIT 1 256 256 words ASYNCHRONOUS NO PARALLEL 5 mA 80 µA 5.5 V 4.5 V CMOS COMMERCIAL R-PQCC-J32 Not Qualified e3 3 70 °C 260 30 32 PLASTIC/EPOXY QCCJ LDCC32,.5X.6 RECTANGULAR CHIP CARRIER YES Matte Tin (Sn) - annealed J BEND 1.27 mm QUAD 3.55 mm 13.97 mm 11.43 mm INTEGRATED DEVICE TECHNOLOGY INC QCCJ, LDCC32,.5X.6 compliant EAR99 8542.32.00.71 QFJ 32
IDT7200L25J8
 Integrated Device Technology Inc 		Check for Price No No Obsolete 2.304 kbit 9 256X9 5 V 25 ns 28.5 MHz 35 ns OTHER FIFO RETRANSMIT 1 256 256 words ASYNCHRONOUS 3-STATE NO PARALLEL 500 µA 125 µA 5.5 V 4.5 V CMOS COMMERCIAL R-PQCC-J32 Not Qualified e0 1 70 °C 225 20 32 PLASTIC/EPOXY QCCJ LDCC32,.5X.6 RECTANGULAR CHIP CARRIER YES Tin/Lead (Sn85Pb15) J BEND 1.27 mm QUAD 3.55 mm 13.97 mm 11.43 mm INTEGRATED DEVICE TECHNOLOGY INC PLASTIC, LCC-32 not_compliant EAR99 8542.32.00.71 QFJ 32
IDT7200L25JGI
 Integrated Device Technology Inc 		Check for Price Yes Yes Active 2.304 kbit 9 256X9 5 V 5 V 25 ns 28.5 MHz 35 ns OTHER FIFO RETRANSMIT 1 256 256 words ASYNCHRONOUS NO PARALLEL 5 mA 80 µA 5.5 V 4.5 V CMOS INDUSTRIAL R-PQCC-J32 Not Qualified e3 1 85 °C -40 °C 260 30 32 PLASTIC/EPOXY QCCJ LDCC32,.5X.6 RECTANGULAR CHIP CARRIER YES Matte Tin (Sn) - annealed J BEND 1.27 mm QUAD 3.55 mm 13.97 mm 11.43 mm INTEGRATED DEVICE TECHNOLOGY INC QCCJ, LDCC32,.5X.6 compliant QFJ 32
IDT7200L25JI8
 Integrated Device Technology Inc 		Check for Price No No Obsolete 2.304 kbit 9 256X9 5 V 25 ns 28.5 MHz 35 ns OTHER FIFO RETRANSMIT 1 256 256 words ASYNCHRONOUS NO PARALLEL 500 µA 125 µA 5.5 V 4.5 V CMOS INDUSTRIAL R-PQCC-J32 Not Qualified e0 1 85 °C -40 °C 225 20 32 PLASTIC/EPOXY QCCJ LDCC32,.5X.6 RECTANGULAR CHIP CARRIER YES Tin/Lead (Sn85Pb15) J BEND 1.27 mm QUAD 3.55 mm 13.97 mm 11.43 mm INTEGRATED DEVICE TECHNOLOGY INC PLASTIC, LCC-32 not_compliant EAR99 8542.32.00.71 QFJ 32
IDT7200L25JGI8
 Integrated Device Technology Inc 		Check for Price Yes Yes Obsolete 2.304 kbit 9 256X9 5 V 25 ns 28.5 MHz 35 ns OTHER FIFO 1 256 256 words ASYNCHRONOUS NO PARALLEL 5 mA 80 µA 5.5 V 4.5 V CMOS INDUSTRIAL R-PQCC-J32 Not Qualified e3 1 85 °C -40 °C 260 30 32 PLASTIC/EPOXY QCCJ LDCC32,.5X.6 RECTANGULAR CHIP CARRIER YES Matte Tin (Sn) - annealed J BEND 1.27 mm QUAD INTEGRATED DEVICE TECHNOLOGY INC LCC-32 unknown EAR99 8542.32.00.71
IDT7200L25J
 Integrated Device Technology Inc 		Check for Price No No Obsolete 2.304 kbit 9 256X9 5 V 25 ns 28.5 MHz 35 ns OTHER FIFO RETRANSMIT 1 256 256 words ASYNCHRONOUS 3-STATE NO PARALLEL 500 µA 125 µA 5.5 V 4.5 V CMOS COMMERCIAL R-PQCC-J32 Not Qualified e0 1 70 °C 225 20 32 PLASTIC/EPOXY QCCJ LDCC32,.5X.6 RECTANGULAR CHIP CARRIER YES Tin/Lead (Sn85Pb15) J BEND 1.27 mm QUAD 3.55 mm 13.97 mm 11.43 mm INTEGRATED DEVICE TECHNOLOGY INC PLASTIC, LCC-32 not_compliant EAR99 8542.32.00.71 QFJ 32
IDT7200L25JI
 Integrated Device Technology Inc 		Check for Price No No Obsolete 2.304 kbit 9 256X9 5 V 25 ns 28.5 MHz 35 ns OTHER FIFO RETRANSMIT 1 256 256 words ASYNCHRONOUS NO PARALLEL 500 µA 125 µA 5.5 V 4.5 V CMOS INDUSTRIAL R-PQCC-J32 Not Qualified e0 1 85 °C -40 °C 225 20 32 PLASTIC/EPOXY QCCJ LDCC32,.5X.6 RECTANGULAR CHIP CARRIER YES Tin/Lead (Sn85Pb15) J BEND 1.27 mm QUAD 3.55 mm 13.97 mm 11.43 mm INTEGRATED DEVICE TECHNOLOGY INC PLASTIC, LCC-32 not_compliant EAR99 8542.32.00.71 QFJ 32