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Manufacturer Part Number: idt7203l25j
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IDT7203L25JGI
 Integrated Device Technology Inc 		Check for Price Yes Yes Transferred 18.432 kbit 9 2KX9 5 V 25 ns 35 ns RETRANSMIT 1 2000 2.048 k ASYNCHRONOUS NO PARALLEL 5.5 V 4.5 V CMOS INDUSTRIAL R-PQCC-J32 Not Qualified e3 85 °C -40 °C 32 PLASTIC/EPOXY QCCJ RECTANGULAR CHIP CARRIER YES MATTE TIN J BEND 1.27 mm QUAD 3.556 mm 13.9954 mm 11.4554 mm INTEGRATED DEVICE TECHNOLOGY INC QFJ QCCJ, 32 compliant EAR99 8542.32.00.71
IDT7203L25J
 Integrated Device Technology Inc 		Check for Price No No Obsolete 18.432 kbit 9 2KX9 5 V 25 ns 28.5 MHz 35 ns OTHER FIFO RETRANSMIT 1 2000 2.048 k ASYNCHRONOUS 3-STATE NO PARALLEL 2 mA 120 µA 5.5 V 4.5 V CMOS COMMERCIAL R-PQCC-J32 Not Qualified e0 1 70 °C 225 20 32 PLASTIC/EPOXY QCCJ LDCC32,.5X.6 RECTANGULAR CHIP CARRIER YES Tin/Lead (Sn85Pb15) J BEND 1.27 mm QUAD 3.55 mm 13.97 mm 11.43 mm INTEGRATED DEVICE TECHNOLOGY INC QFJ PLASTIC, LCC-32 32 not_compliant EAR99 8542.32.00.71
IDT7203L25JI8
 Integrated Device Technology Inc 		Check for Price No No Obsolete 18.432 kbit 9 2KX9 5 V 25 ns 28.5 MHz 35 ns OTHER FIFO RETRANSMIT 1 2000 2.048 k ASYNCHRONOUS NO PARALLEL 2 mA 120 µA 5.5 V 4.5 V CMOS INDUSTRIAL R-PQCC-J32 Not Qualified e0 1 85 °C -40 °C 225 20 32 PLASTIC/EPOXY QCCJ LDCC32,.5X.6 RECTANGULAR CHIP CARRIER YES Tin/Lead (Sn85Pb15) J BEND 1.27 mm QUAD 3.55 mm 13.97 mm 11.43 mm INTEGRATED DEVICE TECHNOLOGY INC QFJ PLASTIC, LCC-32 32 not_compliant EAR99 8542.32.00.71
IDT7203L25J8
 Integrated Device Technology Inc 		Check for Price No No Obsolete 18.432 kbit 9 2KX9 5 V 25 ns 28.5 MHz 35 ns OTHER FIFO RETRANSMIT 1 2000 2.048 k ASYNCHRONOUS 3-STATE NO PARALLEL 2 mA 120 µA 5.5 V 4.5 V CMOS COMMERCIAL R-PQCC-J32 Not Qualified e0 1 70 °C 225 20 32 PLASTIC/EPOXY QCCJ LDCC32,.5X.6 RECTANGULAR CHIP CARRIER YES Tin/Lead (Sn85Pb15) J BEND 1.27 mm QUAD 3.55 mm 13.97 mm 11.43 mm INTEGRATED DEVICE TECHNOLOGY INC QFJ PLASTIC, LCC-32 32 not_compliant EAR99 8542.32.00.71
IDT7203L25JG8
 Integrated Device Technology Inc 		Check for Price Yes Yes Transferred 18.432 kbit 9 2KX9 5 V 25 ns 35 ns RETRANSMIT 1 2000 2.048 k ASYNCHRONOUS 3-STATE NO PARALLEL 5.5 V 4.5 V CMOS COMMERCIAL R-PQCC-J32 Not Qualified e3 70 °C 32 PLASTIC/EPOXY QCCJ RECTANGULAR CHIP CARRIER YES MATTE TIN J BEND 1.27 mm QUAD 3.55 mm 13.97 mm 11.43 mm INTEGRATED DEVICE TECHNOLOGY INC QFJ QCCJ, 32 compliant EAR99 8542.32.00.71
IDT7203L25JGI8
 Integrated Device Technology Inc 		Check for Price Yes Yes Transferred 18.432 kbit 9 2KX9 5 V 25 ns 35 ns RETRANSMIT 1 2000 2.048 k ASYNCHRONOUS NO PARALLEL 5.5 V 4.5 V CMOS INDUSTRIAL R-PQCC-J32 Not Qualified e3 85 °C -40 °C 32 PLASTIC/EPOXY QCCJ RECTANGULAR CHIP CARRIER YES MATTE TIN J BEND 1.27 mm QUAD 3.55 mm 13.97 mm 11.43 mm INTEGRATED DEVICE TECHNOLOGY INC QFJ QCCJ, 32 compliant EAR99 8542.32.00.71
IDT7203L25JI
 Integrated Device Technology Inc 		Check for Price No No Obsolete 18.432 kbit 9 2KX9 5 V 25 ns 28.5 MHz 35 ns OTHER FIFO RETRANSMIT 1 2000 2.048 k ASYNCHRONOUS NO PARALLEL 2 mA 120 µA 5.5 V 4.5 V CMOS INDUSTRIAL R-PQCC-J32 Not Qualified e0 1 85 °C -40 °C 225 20 32 PLASTIC/EPOXY QCCJ LDCC32,.5X.6 RECTANGULAR CHIP CARRIER YES Tin/Lead (Sn85Pb15) J BEND 1.27 mm QUAD 3.55 mm 13.97 mm 11.43 mm INTEGRATED DEVICE TECHNOLOGY INC QFJ PLASTIC, LCC-32 32 not_compliant EAR99 8542.32.00.71
IDT7203L25JG
 Integrated Device Technology Inc 		Check for Price Yes Yes Transferred 18.432 kbit 9 2KX9 5 V 25 ns 35 ns RETRANSMIT 1 2000 2.048 k ASYNCHRONOUS 3-STATE NO PARALLEL 5.5 V 4.5 V CMOS COMMERCIAL R-PQCC-J32 Not Qualified e3 3 70 °C 260 30 32 PLASTIC/EPOXY QCCJ RECTANGULAR CHIP CARRIER YES Matte Tin (Sn) - annealed J BEND 1.27 mm QUAD 3.556 mm 13.9954 mm 11.4554 mm INTEGRATED DEVICE TECHNOLOGY INC QFJ QCCJ, 32 compliant EAR99 8542.32.00.71