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IDT72251L15J
Integrated Device Technology Inc
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Check for Price | No | No | Obsolete | 73.728 kbit | 9 | 8KX9 | 5 V | 10 ns | 66.7 MHz | 15 ns | OTHER FIFO | 1 | 8000 | 8.192 k | SYNCHRONOUS | YES | PARALLEL | 80 mA | 80 µA | 5.5 V | 4.5 V | CMOS | COMMERCIAL | R-PQCC-J32 | Not Qualified | e0 | 1 | 70 °C | 225 | 20 | 32 | PLASTIC/EPOXY | QCCJ | LDCC32,.5X.6 | RECTANGULAR | CHIP CARRIER | YES | Tin/Lead (Sn85Pb15) | J BEND | 1.27 mm | QUAD | 3.556 mm | 13.9954 mm | 11.4554 mm | INTEGRATED DEVICE TECHNOLOGY INC | QFJ | PLASTIC, LCC-32 | 32 | not_compliant | EAR99 | 8542.32.00.71 | ||||
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IDT72251L15J8
Integrated Device Technology Inc
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Check for Price | No | No | Obsolete | 73.728 kbit | 9 | 8KX9 | 5 V | 10 ns | 66.7 MHz | 15 ns | OTHER FIFO | 1 | 8000 | 8.192 k | SYNCHRONOUS | YES | PARALLEL | 80 mA | 80 µA | 5.5 V | 4.5 V | CMOS | COMMERCIAL | R-PQCC-J32 | Not Qualified | e0 | 1 | 70 °C | 225 | 20 | 32 | PLASTIC/EPOXY | QCCJ | LDCC32,.5X.6 | RECTANGULAR | CHIP CARRIER | YES | Tin/Lead (Sn85Pb15) | J BEND | 1.27 mm | QUAD | 3.556 mm | 13.9954 mm | 11.4554 mm | INTEGRATED DEVICE TECHNOLOGY INC | QFJ | PLASTIC, LCC-32 | 32 | not_compliant | EAR99 | 8542.32.00.71 | ||||
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IDT72251L15JGI8
Integrated Device Technology Inc
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Check for Price | Yes | Yes | Transferred | 73.728 kbit | 9 | 8KX9 | 5 V | 10 ns | 15 ns | 1 | 8000 | 8.192 k | SYNCHRONOUS | YES | PARALLEL | 5.5 V | 4.5 V | CMOS | INDUSTRIAL | R-PQCC-J32 | Not Qualified | e3 | 85 °C | -40 °C | 32 | PLASTIC/EPOXY | QCCJ | RECTANGULAR | CHIP CARRIER | YES | MATTE TIN | J BEND | 1.27 mm | QUAD | 3.55 mm | 13.97 mm | 11.43 mm | INTEGRATED DEVICE TECHNOLOGY INC | QFJ | QCCJ, | 32 | compliant | EAR99 | 8542.32.00.71 | |||||||||||
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IDT72251L15JI8
Integrated Device Technology Inc
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Check for Price | No | No | Obsolete | 73.728 kbit | 9 | 8KX9 | 5 V | 10 ns | 66.7 MHz | 15 ns | OTHER FIFO | 1 | 8000 | 8.192 k | SYNCHRONOUS | YES | PARALLEL | 5 mA | 50 µA | 5.5 V | 4.5 V | CMOS | INDUSTRIAL | R-PQCC-J32 | Not Qualified | e0 | 1 | 85 °C | -40 °C | 225 | 20 | 32 | PLASTIC/EPOXY | QCCJ | LDCC32,.5X.6 | RECTANGULAR | CHIP CARRIER | YES | Tin/Lead (Sn85Pb15) | J BEND | 1.27 mm | QUAD | 3.556 mm | 13.9954 mm | 11.4554 mm | INTEGRATED DEVICE TECHNOLOGY INC | QFJ | PLASTIC, LCC-32 | 32 | not_compliant | EAR99 | 8542.32.00.71 | |||
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IDT72251L15JSCDS-W
Integrated Device Technology Inc
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Check for Price | No | No | Obsolete | 73.728 kbit | 9 | 8KX9 | 5 V | 10 ns | 66.7 MHz | 15 ns | OTHER FIFO | 1 | 8000 | 8.192 k | SYNCHRONOUS | YES | PARALLEL | 5 mA | 50 µA | 5.5 V | 4.5 V | CMOS | COMMERCIAL | R-PQCC-J32 | Not Qualified | e0 | 1 | 70 °C | 225 | 20 | 32 | PLASTIC/EPOXY | QCCJ | LDCC32,.5X.6 | RECTANGULAR | CHIP CARRIER | YES | TIN LEAD | J BEND | 1.27 mm | QUAD | 3.556 mm | 13.9954 mm | 11.4554 mm | INTEGRATED DEVICE TECHNOLOGY INC | QFJ | QCCJ, LDCC32,.5X.6 | 32 | not_compliant | EAR99 | 8542.32.00.71 | ||||
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IDT72251L15JG
Integrated Device Technology Inc
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Check for Price | Yes | Yes | Transferred | 73.728 kbit | 9 | 8KX9 | 5 V | 10 ns | 66.7 MHz | 15 ns | OTHER FIFO | 1 | 8000 | 8.192 k | SYNCHRONOUS | YES | PARALLEL | 5 mA | 50 µA | 5.5 V | 4.5 V | CMOS | COMMERCIAL | R-PQCC-J32 | Not Qualified | e3 | 3 | 70 °C | 260 | 30 | 32 | PLASTIC/EPOXY | QCCJ | LDCC32,.5X.6 | RECTANGULAR | CHIP CARRIER | YES | Matte Tin (Sn) - annealed | J BEND | 1.27 mm | QUAD | 3.5 mm | 13.97 mm | 11.43 mm | INTEGRATED DEVICE TECHNOLOGY INC | QFJ | QCCJ, LDCC32,.5X.6 | 32 | compliant | EAR99 | 8542.32.00.71 | ||||
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IDT72251L15JGI
Integrated Device Technology Inc
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Check for Price | Yes | Yes | Transferred | 73.728 kbit | 9 | 8KX9 | 5 V | 10 ns | 66.7 MHz | 15 ns | OTHER FIFO | 1 | 8000 | 8.192 k | SYNCHRONOUS | YES | PARALLEL | 5 mA | 50 µA | 5.5 V | 4.5 V | CMOS | INDUSTRIAL | R-PQCC-J32 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 260 | 30 | 32 | PLASTIC/EPOXY | QCCJ | LDCC32,.5X.6 | RECTANGULAR | CHIP CARRIER | YES | Matte Tin (Sn) - annealed | J BEND | 1.27 mm | QUAD | 3.5 mm | 13.97 mm | 11.43 mm | INTEGRATED DEVICE TECHNOLOGY INC | QFJ | QCCJ, LDCC32,.5X.6 | 32 | compliant | EAR99 | 8542.32.00.71 | 1992-01-01 | ||
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IDT72251L15JG8
Integrated Device Technology Inc
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Check for Price | Yes | Yes | Transferred | 73.728 kbit | 9 | 8KX9 | 5 V | 10 ns | 15 ns | 1 | 8000 | 8.192 k | SYNCHRONOUS | YES | PARALLEL | 5.5 V | 4.5 V | CMOS | COMMERCIAL | R-PQCC-J32 | Not Qualified | e3 | 70 °C | 32 | PLASTIC/EPOXY | QCCJ | RECTANGULAR | CHIP CARRIER | YES | MATTE TIN | J BEND | 1.27 mm | QUAD | 3.55 mm | 13.97 mm | 11.43 mm | INTEGRATED DEVICE TECHNOLOGY INC | QFJ | QCCJ, | 32 | compliant | EAR99 | 8542.32.00.71 | ||||||||||||
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IDT72251L15JI
Integrated Device Technology Inc
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Check for Price | No | No | Obsolete | 73.728 kbit | 9 | 8KX9 | 5 V | 10 ns | 66.7 MHz | 15 ns | OTHER FIFO | 1 | 8000 | 8.192 k | SYNCHRONOUS | YES | PARALLEL | 5 mA | 50 µA | 5.5 V | 4.5 V | CMOS | INDUSTRIAL | R-PQCC-J32 | Not Qualified | e0 | 1 | 85 °C | -40 °C | 225 | 20 | 32 | PLASTIC/EPOXY | QCCJ | LDCC32,.5X.6 | RECTANGULAR | CHIP CARRIER | YES | Tin/Lead (Sn85Pb15) | J BEND | 1.27 mm | QUAD | 3.556 mm | 13.9954 mm | 11.4554 mm | INTEGRATED DEVICE TECHNOLOGY INC | QFJ | PLASTIC, LCC-32 | 32 | not_compliant | EAR99 | 8542.32.00.71 |