Findchips: Parametric Search Results for IDT72V235L10TF


Select Parts		Part Number

		IDT72V235L10TFG8 Integrated Device Technology Inc
		IDT72V235L10TFG Integrated Device Technology Inc
		IDT72V235L10TF8 Integrated Device Technology Inc
		IDT72V235L10TF9 Integrated Device Technology Inc
		IDT72V235L10TF Integrated Device Technology Inc

				Most Relevant							Technical													Compliance			Operating Conditions				Physical											Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Memory Density	Memory Width	Organization	Supply Voltage-Nom (Vsup)	Access Time-Max	Clock Frequency-Max (fCLK)	Cycle Time	Memory IC Type	Additional Feature	Number of Functions	Number of Words Code	Number of Words	Operating Mode	Output Enable	Parallel/Serial	Standby Current-Max	Supply Voltage-Max (Vsup)	Supply Voltage-Min (Vsup)	Technology	Temperature Grade	JESD-30 Code	Qualification Status	JESD-609 Code	Moisture Sensitivity Level	Operating Temperature-Max	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Length	Width	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Reach Compliance Code	ECCN Code	HTS Code	Date Of Intro

Check for Price

Yes

Transferred

36.864 kbit

2KX18

3.3 V

6.5 ns

10 ns

EASILY EXPANDABLE IN DEPTH AND WIDTH

2000

2.048 k

SYNCHRONOUS

YES

PARALLEL

3.6 V

3 V

CMOS

COMMERCIAL

S-PQFP-G64

Not Qualified

70 °C

PLASTIC/EPOXY

LFQFP

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

YES

MATTE TIN

GULL WING

500 µm

QUAD

1.6 mm

10 mm

INTEGRATED DEVICE TECHNOLOGY INC

QFP

LFQFP,

compliant

EAR99

8542.32.00.71

1998-08-01

Check for Price

Yes

Transferred

36.864 kbit

2KX18

3.3 V

6.5 ns

10 ns

EASILY EXPANDABLE IN DEPTH AND WIDTH

2000

2.048 k

SYNCHRONOUS

YES

PARALLEL

3.6 V

3 V

CMOS

COMMERCIAL

S-PQFP-G64

Not Qualified

70 °C

260

PLASTIC/EPOXY

QFP

SQUARE

FLATPACK

YES

Matte Tin (Sn)

GULL WING

500 µm

QUAD

1.6 mm

10 mm

INTEGRATED DEVICE TECHNOLOGY INC

QFP

QFP,

compliant

EAR99

8542.32.00.71

1998-08-01

Check for Price

Obsolete

36.864 kbit

2KX18

3.3 V

6.5 ns

100 MHz

10 ns

OTHER FIFO

EASILY EXPANDABLE IN DEPTH AND WIDTH

2000

2.048 k

SYNCHRONOUS

YES

PARALLEL

5 mA

3.6 V

3 V

CMOS

COMMERCIAL

S-PQFP-G64

Not Qualified

70 °C

240

PLASTIC/EPOXY

LFQFP

QFP64,.47SQ,20

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

YES

TIN LEAD

GULL WING

500 µm

QUAD

1.6 mm

10 mm

INTEGRATED DEVICE TECHNOLOGY INC

QFP

PLASTIC, STQFP-64

not_compliant

EAR99

8542.32.00.71

Check for Price

Obsolete

36.864 kbit

2KX18

3.3 V

6.5 ns

10 ns

EASILY EXPANDABLE IN DEPTH AND WIDTH

2000

2.048 k

SYNCHRONOUS

YES

PARALLEL

3.6 V

3 V

CMOS

COMMERCIAL

S-PQFP-G64

Not Qualified

70 °C

PLASTIC/EPOXY

LFQFP

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

YES

TIN LEAD

GULL WING

500 µm

QUAD

1.6 mm

10 mm

INTEGRATED DEVICE TECHNOLOGY INC

QFP

PLASTIC, STQFP-64

compliant

EAR99

8542.32.00.71

Check for Price

Obsolete

36.864 kbit

2KX18

3.3 V

6.5 ns

100 MHz

10 ns

OTHER FIFO

EASILY EXPANDABLE IN DEPTH AND WIDTH

2000

2.048 k

SYNCHRONOUS

YES

PARALLEL

5 mA

3.6 V

3 V

CMOS

COMMERCIAL

S-PQFP-G64

Not Qualified

70 °C

240

PLASTIC/EPOXY

LFQFP

QFP64,.47SQ,20

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

YES

TIN LEAD

GULL WING

500 µm

QUAD

1.6 mm

10 mm

INTEGRATED DEVICE TECHNOLOGY INC

QFP

PLASTIC, STQFP-64

not_compliant

EAR99

8542.32.00.71

Compare

IDT72V235L10TFG8

Integrated Device Technology Inc

Check for Price

Yes

Transferred

36.864 kbit

2KX18

3.3 V

6.5 ns

10 ns

EASILY EXPANDABLE IN DEPTH AND WIDTH

2000

2.048 k

SYNCHRONOUS

YES

PARALLEL

3.6 V

3 V

CMOS

COMMERCIAL

S-PQFP-G64

Not Qualified

70 °C

PLASTIC/EPOXY

LFQFP

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

YES

MATTE TIN

GULL WING

500 µm

QUAD

1.6 mm

10 mm

INTEGRATED DEVICE TECHNOLOGY INC

QFP

LFQFP,

compliant

EAR99

8542.32.00.71

1998-08-01

IDT72V235L10TFG

Integrated Device Technology Inc

Check for Price

Yes

Transferred

36.864 kbit

2KX18

3.3 V

6.5 ns

10 ns

EASILY EXPANDABLE IN DEPTH AND WIDTH

2000

2.048 k

SYNCHRONOUS

YES

PARALLEL

3.6 V

3 V

CMOS

COMMERCIAL

S-PQFP-G64

Not Qualified

70 °C

260

PLASTIC/EPOXY

QFP

SQUARE

FLATPACK

YES

Matte Tin (Sn)

GULL WING

500 µm

QUAD

1.6 mm

10 mm

INTEGRATED DEVICE TECHNOLOGY INC

QFP

QFP,

compliant

EAR99

8542.32.00.71

1998-08-01

IDT72V235L10TF8

Integrated Device Technology Inc

Check for Price

Obsolete

36.864 kbit

2KX18

3.3 V

6.5 ns

100 MHz

10 ns

OTHER FIFO

EASILY EXPANDABLE IN DEPTH AND WIDTH

2000

2.048 k

SYNCHRONOUS

YES

PARALLEL

5 mA

3.6 V

3 V

CMOS

COMMERCIAL

S-PQFP-G64

Not Qualified

70 °C

240

PLASTIC/EPOXY

LFQFP

QFP64,.47SQ,20

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

YES

TIN LEAD

GULL WING

500 µm

QUAD

1.6 mm

10 mm

INTEGRATED DEVICE TECHNOLOGY INC

QFP

PLASTIC, STQFP-64

not_compliant

EAR99

8542.32.00.71

IDT72V235L10TF9

Integrated Device Technology Inc

Check for Price

Obsolete

36.864 kbit

2KX18

3.3 V

6.5 ns

10 ns

EASILY EXPANDABLE IN DEPTH AND WIDTH

2000

2.048 k

SYNCHRONOUS

YES

PARALLEL

3.6 V

3 V

CMOS

COMMERCIAL

S-PQFP-G64

Not Qualified

70 °C

PLASTIC/EPOXY

LFQFP

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

YES

TIN LEAD

GULL WING

500 µm

QUAD

1.6 mm

10 mm

INTEGRATED DEVICE TECHNOLOGY INC

QFP

PLASTIC, STQFP-64

compliant

EAR99

8542.32.00.71

IDT72V235L10TF

Integrated Device Technology Inc

Check for Price

Obsolete

36.864 kbit

2KX18

3.3 V

6.5 ns

100 MHz

10 ns

OTHER FIFO

EASILY EXPANDABLE IN DEPTH AND WIDTH

2000

2.048 k

SYNCHRONOUS

YES

PARALLEL

5 mA

3.6 V

3 V

CMOS

COMMERCIAL

S-PQFP-G64

Not Qualified

70 °C

240

PLASTIC/EPOXY

LFQFP

QFP64,.47SQ,20

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

YES

TIN LEAD

GULL WING

500 µm

QUAD

1.6 mm

10 mm

INTEGRATED DEVICE TECHNOLOGY INC

QFP

PLASTIC, STQFP-64

not_compliant

EAR99

8542.32.00.71

Parametric results for: IDT72V235L10TF under FIFOs