Register or Sign In
Parametric » Memory » FIFOs

Parametric results for: IDT72V261LA10PF under FIFOs

Filter Your Search

1 - 6 of 6 results

|
6 hits
6 hits
6 hits
6 hits
6 hits
6 hits
6 hits
6 hits
6 hits
6 hits
6 hits
6 hits
6 hits
6 hits
6 hits
6 hits
6 hits
6 hits
6 hits
6 hits
6 hits
6 hits
6 hits
6 hits
6 hits
6 hits
6 hits
Manufacturer Part Number: idt72v261la10pf
Select parts from the table below to compare.
 Compare
Compare
IDT72V261LA10PF
 Integrated Device Technology Inc 		Check for Price No No Obsolete 147.456 kbit 9 16KX9 3.3 V 6.5 ns 100 MHz 10 ns OTHER FIFO RETRANSMIT; AUTO POWER DOWN 1 16000 16.384 k SYNCHRONOUS YES PARALLEL 15 mA 45 µA 3.6 V 3 V CMOS COMMERCIAL S-PQFP-G64 Not Qualified e0 3 70 °C 240 30 64 PLASTIC/EPOXY LQFP QFP64,.66SQ,32 SQUARE FLATPACK, LOW PROFILE YES TIN LEAD GULL WING 800 µm QUAD 1.6 mm 14 mm 14 mm INTEGRATED DEVICE TECHNOLOGY INC QFP PLASTIC, TQFP-64 64 not_compliant EAR99 8542.32.00.71
IDT72V261LA10PF8
 Integrated Device Technology Inc 		Check for Price No No Obsolete 147.456 kbit 9 16KX9 3.3 V 6.5 ns 100 MHz 10 ns OTHER FIFO RETRANSMIT; AUTO POWER DOWN 1 16000 16.384 k SYNCHRONOUS YES PARALLEL 15 mA 45 µA 3.6 V 3 V CMOS COMMERCIAL S-PQFP-G64 Not Qualified e0 3 70 °C 240 30 64 PLASTIC/EPOXY LQFP QFP64,.66SQ,32 SQUARE FLATPACK, LOW PROFILE YES TIN LEAD GULL WING 800 µm QUAD 1.6 mm 14 mm 14 mm INTEGRATED DEVICE TECHNOLOGY INC QFP PLASTIC, TQFP-64 64 not_compliant EAR99 8542.32.00.71
IDT72V261LA10PFG
 Renesas Electronics Corporation 		Check for Price Yes End Of Life 147.456 kbit 9 16KX9 3.3 V 6.5 ns 100 MHz 10 ns OTHER FIFO RETRANSMIT 1 16000 16.384 k SYNCHRONOUS YES PARALLEL 20 mA 55 µA 3.6 V 3 V CMOS COMMERCIAL S-PQFP-G64 Not Qualified e3 3 70 °C 260 30 64 PLASTIC/EPOXY LQFP QFP64,.66SQ,32 SQUARE FLATPACK, LOW PROFILE YES Matte Tin (Sn) - annealed GULL WING 800 µm QUAD 1.6 mm 14 mm 14 mm RENESAS ELECTRONICS CORP GREEN, PLASTIC, TQFP-64 compliant Renesas Electronics
IDT72V261LA10PFG8
 Integrated Device Technology Inc 		Check for Price Yes Yes Transferred 147.456 kbit 9 16KX9 3.3 V 6.5 ns 10 ns RETRANSMIT; AUTO POWER DOWN 1 16000 16.384 k SYNCHRONOUS YES PARALLEL 3.6 V 3 V CMOS COMMERCIAL S-PQFP-G64 Not Qualified e3 3 70 °C 260 40 64 PLASTIC/EPOXY LQFP SQUARE FLATPACK, LOW PROFILE YES MATTE TIN GULL WING 800 µm QUAD 1.6 mm 14 mm 14 mm INTEGRATED DEVICE TECHNOLOGY INC QFP LQFP, 64 compliant EAR99 8542.32.00.71
IDT72V261LA10PFG
 Integrated Device Technology Inc 		Check for Price Yes Yes Transferred 147.456 kbit 9 16KX9 3.3 V 6.5 ns 100 MHz 10 ns OTHER FIFO RETRANSMIT 1 16000 16.384 k SYNCHRONOUS YES PARALLEL 20 mA 55 µA 3.6 V 3 V CMOS COMMERCIAL S-PQFP-G64 Not Qualified e3 3 70 °C 260 30 64 PLASTIC/EPOXY LQFP QFP64,.66SQ,32 SQUARE FLATPACK, LOW PROFILE YES Matte Tin (Sn) - annealed GULL WING 800 µm QUAD 1.6 mm 14 mm 14 mm INTEGRATED DEVICE TECHNOLOGY INC QFP GREEN, PLASTIC, TQFP-64 64 compliant EAR99 8542.32.00.71
IDT72V261LA10PF9
 Integrated Device Technology Inc 		Check for Price No No Obsolete 147.456 kbit 9 16KX9 3.3 V 6.5 ns 10 ns RETRANSMIT; AUTO POWER DOWN 1 16000 16.384 k SYNCHRONOUS YES PARALLEL 3.6 V 3 V CMOS COMMERCIAL S-PQFP-G64 Not Qualified e0 3 70 °C NOT SPECIFIED NOT SPECIFIED 64 PLASTIC/EPOXY LQFP SQUARE FLATPACK, LOW PROFILE YES Tin/Lead (Sn/Pb) GULL WING 800 µm QUAD 1.6 mm 14 mm 14 mm INTEGRATED DEVICE TECHNOLOGY INC QFP TQFP-64 64 compliant EAR99 8542.32.00.71