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IDT74ALVCH32244BF8
Renesas Electronics Corporation
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Check for Price | No | Obsolete | 3.3 V | 3.6 ns | 3 ns | 8 | 4 | YES | FBGA | 3-STATE | ALVC/VCX/A | BUS DRIVER | CMOS | ENABLE LOW | 24 mA | 2 | TRUE | 3.6 V | 2.7 V | INDUSTRIAL | R-PBGA-B96 | Not Qualified | e0 | 3 | 85 °C | -40 °C | 225 | 30 | 96 | PLASTIC/EPOXY | BGA96,6X16,32 | RECTANGULAR | GRID ARRAY, FINE PITCH | TR | TIN LEAD | BALL | 800 µm | BOTTOM | 1.5 mm | 5.5 mm | 13.5 mm | RENESAS ELECTRONICS CORP | FBGA, BGA96,6X16,32 | compliant | EAR99 | 8542.39.00.01 | ||||||
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IDT74ALVCH32244BF8
Integrated Device Technology Inc
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Check for Price | No | No | Transferred | 3.3 V | 3.6 ns | 3 ns | 8 | 4 | YES | FBGA | 3-STATE | ALVC/VCX/A | BUS DRIVER | CMOS | ENABLE LOW | 24 mA | 2 | TRUE | 3.6 V | 2.7 V | INDUSTRIAL | R-PBGA-B96 | Not Qualified | e0 | 3 | 85 °C | -40 °C | 225 | 30 | 96 | PLASTIC/EPOXY | BGA96,6X16,32 | RECTANGULAR | GRID ARRAY, FINE PITCH | TR | TIN LEAD | BALL | 800 µm | BOTTOM | 1.5 mm | 5.5 mm | 13.5 mm | INTEGRATED DEVICE TECHNOLOGY INC | LFBGA-96 | not_compliant | EAR99 | 8542.39.00.01 | BGA | 96 | 1998-12-01 | ||
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IDT74ALVCH32244BF
Renesas Electronics Corporation
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Check for Price | No | Obsolete | 3.3 V | 3.7 ns | 3 ns | 8 | 4 | YES | FBGA | 3-STATE | ALVC/VCX/A | BUS DRIVER | CMOS | ENABLE LOW | 24 mA | 2 | TRUE | 3.6 V | 2.7 V | INDUSTRIAL | R-PBGA-B96 | Not Qualified | e0 | 3 | 85 °C | -40 °C | 225 | 30 | 96 | PLASTIC/EPOXY | BGA96,6X16,32 | RECTANGULAR | GRID ARRAY, FINE PITCH | TIN LEAD | BALL | 800 µm | BOTTOM | 1.5 mm | 5.5 mm | 13.5 mm | RENESAS ELECTRONICS CORP | FBGA, BGA96,6X16,32 | compliant | EAR99 | 8542.39.00.01 | |||||||
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IDT74ALVCH32244BFG8
Integrated Device Technology Inc
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Check for Price | Yes | Yes | Transferred | 3.3 V | 3.7 ns | 8 | 4 | YES | LFBGA | 3-STATE | ALVC/VCX/A | BUS DRIVER | CMOS | 2 | TRUE | 3.6 V | 2.7 V | INDUSTRIAL | R-PBGA-B96 | Not Qualified | e1 | 3 | 85 °C | -40 °C | 96 | PLASTIC/EPOXY | RECTANGULAR | GRID ARRAY, LOW PROFILE, FINE PITCH | TIN SILVER COPPER | BALL | 800 µm | BOTTOM | 1.5 mm | 5.5 mm | 13.5 mm | INTEGRATED DEVICE TECHNOLOGY INC | LFBGA, | compliant | EAR99 | 8542.39.00.01 | BGA | 96 | ||||||||||
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IDT74ALVCH32244BF
Integrated Device Technology Inc
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Check for Price | No | No | Transferred | 3.3 V | 3.7 ns | 3 ns | 8 | 4 | YES | FBGA | 3-STATE | ALVC/VCX/A | BUS DRIVER | CMOS | ENABLE LOW | 24 mA | 2 | TRUE | 3.6 V | 2.7 V | INDUSTRIAL | R-PBGA-B96 | Not Qualified | e0 | 3 | 85 °C | -40 °C | 225 | 30 | 96 | PLASTIC/EPOXY | BGA96,6X16,32 | RECTANGULAR | GRID ARRAY, FINE PITCH | TIN LEAD | BALL | 800 µm | BOTTOM | 1.5 mm | 5.5 mm | 13.5 mm | INTEGRATED DEVICE TECHNOLOGY INC | LFBGA-96 | not_compliant | EAR99 | 8542.39.00.01 | BGA | 96 | 1998-12-01 | |||
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IDT74ALVCH32244BFG
Integrated Device Technology Inc
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Check for Price | Yes | Yes | Transferred | 3.3 V | 3.7 ns | 8 | 4 | YES | FBGA | 3-STATE | ALVC/VCX/A | BUS DRIVER | CMOS | 2 | TRUE | 3.6 V | 2.7 V | INDUSTRIAL | R-PBGA-B96 | Not Qualified | e1 | 3 | 85 °C | -40 °C | 96 | PLASTIC/EPOXY | RECTANGULAR | GRID ARRAY, FINE PITCH | TIN SILVER COPPER | BALL | 800 µm | BOTTOM | 1.5 mm | 5.5 mm | 13.5 mm | INTEGRATED DEVICE TECHNOLOGY INC | FBGA, | compliant | EAR99 | 8542.39.00.01 | BGA | 96 | 1999-03-19 |