Filter Your Search
1 - 10 of 21 results
|
JAN1N5521C-1
Microsemi Corporation
|
$13.8414 | No | No | Transferred | 20 mA | 500 mW | 4.3 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 2 % | Not Qualified | O-LALF-W2 | e0 | MIL-19500 | DO-204AH | 1 | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROSEMI CORP | DO-7 | HERMETIC SEALED, GLASS, DO-35, 2 PIN | 2 | unknown | EAR99 | 8541.10.00.50 | ||||||||
|
JAN1N5521C-1
Microchip Technology Inc
|
$14.5619 | No | Active | 20 mA | 500 mW | 4.3 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 2 % | Qualified | O-LALF-W2 | e0 | MIL-19500 | DO-204AH | 1 | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS, DO-35, 2 PIN | compliant | |||||||||||||
|
JAN1N5521CUR-1
Microsemi Corporation
|
$31.2887 | No | No | Transferred | 20 mA | 500 mW | 4.3 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | AVALANCHE | METALLURGICALLY BONDED | 18 Ω | 2 % | Not Qualified | R-LELF-R2 | e0 | MIL-19500 | DO-213AA | 200 °C | -65 °C | ISOLATED | 2 | GLASS | RECTANGULAR | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROSEMI CORP | DO-213AA | HERMETIC SEALED, GLASS, MLL34, MELF-2 | 2 | unknown | EAR99 | 8541.10.00.50 | ||||||||
|
JAN1N5521CUR-1
Microchip Technology Inc
|
$38.1345 | No | Active | 20 mA | 500 mW | 4.3 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | AVALANCHE | METALLURGICALLY BONDED | 18 Ω | 2 % | Qualified | R-LELF-R2 | e0 | MIL-19500 | DO-213AA | 200 °C | -65 °C | ISOLATED | 2 | GLASS | RECTANGULAR | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS, MLL34, MELF-2 | compliant | |||||||||||||
|
JAN1N5521CUR-1
Cobham Semiconductor Solutions
|
Check for Price | Transferred | 20 mA | 500 mW | 4.3 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | METALLURGICALLY BONDED | 2 % | Not Qualified | O-LELF-R2 | MIL-19500/437E | DO-213AA | ISOLATED | 2 | GLASS | ROUND | LONG FORM | WRAP AROUND | END | AEROFLEX/METELICS INC | DO-213AA | DO-213AA, 2 PIN | 2 | unknown | EAR99 | 8541.10.00.50 | |||||||||||||||
|
JAN1N5521C-1
VPT Components
|
Check for Price | No | Active | 20 mA | 500 mW | 4.3 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 2 % | Qualified | O-LALF-W2 | MIL-19500 | DO-35 | 175 °C | -65 °C | NOT SPECIFIED | NOT SPECIFIED | ISOLATED | 2 | GLASS | ROUND | LONG FORM | WIRE | AXIAL | VPT COMPONENTS | compliant | EAR99 | 8541.10.00.50 | |||||||||||||
|
JAN1N5521CUR-1
Defense Logistics Agency
|
Check for Price | Active | 20 mA | 500 mW | 4.3 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | METALLURGICALLY BONDED | 2 % | Qualified | O-LELF-R2 | MIL-19500/437E | DO-213AA | ISOLATED | 2 | GLASS | ROUND | LONG FORM | WRAP AROUND | END | DEFENSE LOGISTICS AGENCY | DO-213AA, 2 PIN | unknown | |||||||||||||||||||
|
JAN1N5521C-1TR
Microsemi Corporation
|
Check for Price | Obsolete | 20 mA | 500 mW | 4.3 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 2 % | Not Qualified | O-LALF-W2 | e0 | MIL-19500 | DO-204AH | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROSEMI CORP | DO-35 | O-LALF-W2 | 2 | compliant | EAR99 | 8541.10.00.50 | |||||||||||
|
JAN1N5521CUR-1
MACOM
|
Check for Price | Transferred | 1.1 V | 20 mA | 3 µA | 500 mW | 4.3 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | METALLURGICALLY BONDED | 18 Ω | 1.5 V | 2 % | Qualified | O-LELF-R2 | MIL-19500 | DO-213AA | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | WRAP AROUND | END | M/A-COM TECHNOLOGY SOLUTIONS INC | SOD-80, MELF-2 | compliant | EAR99 | 8541.10.00.50 | |||||||||||
|
JAN1N5521CUR
Microsemi Corporation
|
Check for Price | No | No | Obsolete | 20 mA | 4.3 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | AVALANCHE | METALLURGICALLY BONDED | 2 % | Not Qualified | R-LELF-R2 | e0 | DO-213AA | 175 °C | -65 °C | ISOLATED | 2 | GLASS | RECTANGULAR | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROSEMI CORP | DO-213AA | R-LELF-R2 | 2 | compliant | EAR99 | 8541.10.00.50 |