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JAN1N5806
Microchip Technology Inc
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$4.9560 | No | Active | 1 A | 25 ns | 3 W | SILICON | RECTIFIER DIODE | SINGLE | NO | 150 V | 1 | AVALANCHE | HIGH RELIABILITY | 1 | Qualified | O-LALF-W2 | e0 | MIL-19500 | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD OVER NICKEL | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | compliant | |||||||||||||||
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JAN1N5806US
Microchip Technology Inc
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$6.6802 | No | Active | 2.5 A | 25 ns | SILICON | RECTIFIER DIODE | SINGLE | YES | 150 V | 1 | ULTRA FAST RECOVERY POWER | 35 A | 1 | Qualified | O-LELF-R2 | e0 | MIL-19500/477F | ISOLATED | 2 | GLASS | ROUND | LONG FORM | Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | compliant | Microchip | |||||||||||||||||
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JAN1N5806US/TR
Microchip Technology Inc
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$6.8390 | Active | 2.5 A | 25 ns | SILICON | RECTIFIER DIODE | SINGLE | YES | 150 V | 1 | ULTRA FAST RECOVERY POWER | 35 A | 1 | Qualified | O-LELF-R2 | e0 | MIL-19500/477F | ISOLATED | 2 | GLASS | ROUND | LONG FORM | Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | unknown | EAR99 | 8541.10.00.80 | |||||||||||||||||
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JAN1N5806
Microsemi Corporation
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$8.2682 | No | No | Transferred | 1 A | 25 ns | 3 W | SILICON | RECTIFIER DIODE | SINGLE | NO | 150 V | 1 | AVALANCHE | HIGH RELIABILITY | 1 | Not Qualified | O-LALF-W2 | e0 | MIL-19500 | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD OVER NICKEL | WIRE | AXIAL | MICROSEMI CORP | not_compliant | Microsemi Corporation | EAR99 | 8541.10.00.80 | HERMETIC SEALED, GLASS, A PACKAGE-2 | ||||||||||
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JAN1N5806
Semtech Corporation
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$9.7826 | Transferred | 3.3 A | 875 mV | 25 ns | 1 µA | SILICON | RECTIFIER DIODE | SINGLE | NO | 150 V | 1 | SUPER FAST RECOVERY | 35 A | 1 | Qualified | O-LALF-W2 | MIL-19500/477 | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | WIRE | AXIAL | SEMTECH CORP | unknown | SEMTECH | EAR99 | 8541.10.00.80 | G111, 2 PIN | 2 | G111 | |||||||||||
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JAN1N5806US
Microsemi Corporation
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$11.6688 | No | Transferred | 2.5 A | 25 ns | SILICON | RECTIFIER DIODE | SINGLE | YES | 150 V | 1 | ULTRA FAST RECOVERY POWER | 35 A | 1 | Not Qualified | O-LELF-R2 | e0 | MIL-19500/477F | ISOLATED | 2 | GLASS | ROUND | LONG FORM | Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier | WRAP AROUND | END | MICROSEMI CORP | not_compliant | Microsemi Corporation | EAR99 | 8541.10.00.80 | |||||||||||||||
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JAN1N5806US
Semtech Corporation
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$14.1125 | Transferred | 2.5 A | 875 mV | 25 ns | SILICON | RECTIFIER DIODE | SINGLE | YES | 150 V | 1 | ULTRA FAST RECOVERY POWER | 35 A | 1 | Qualified | O-LELF-R2 | MIL-19500/477F | 175 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | WRAP AROUND | END | SEMTECH CORP | unknown | SEMTECH | EAR99 | 8541.10.00.80 | ||||||||||||||||
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JAN1N5806URS
Microchip Technology Inc
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$19.4281 | No | Active | 1 A | 25 ns | SILICON | RECTIFIER DIODE | SINGLE | YES | 150 V | 1 | HIGH RELIABILITY | 1 | Qualified | O-LELF-R2 | e0 | MIL-19500 | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | compliant | HERMETIC SEALED, GLASS, MELF-2 | ||||||||||||||||
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JAN1N5806URS
Microsemi Corporation
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$21.6902 | No | Transferred | 1 A | 25 ns | SILICON | RECTIFIER DIODE | SINGLE | YES | 150 V | 1 | HIGH RELIABILITY | 1 | Not Qualified | O-LELF-R2 | e0 | MIL-19500 | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier | WRAP AROUND | END | MICROSEMI CORP | compliant | Microsemi Corporation | EAR99 | 8541.10.00.80 | HERMETIC SEALED, GLASS, MELF-2 | 2 | MELF | |||||||||||
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JAN1N5806US
Sensitron Semiconductors
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Check for Price | No | No | Active | 2.5 A | 875 mV | 25 ns | SILICON | RECTIFIER DIODE | SINGLE | YES | 150 V | 1 | HIGH RELIABILITY | ULTRA FAST RECOVERY | 35 A | 1 | Qualified | O-LELF-R2 | e0 | MIL-19500 | 175 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | SENSITRON SEMICONDUCTOR | compliant | EAR99 | 8541.10.00.80 | MELF-2 | 2 | MELF | 1999-06-01 |