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JAN1N6633D
Defense Logistics Agency
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Check for Price | Active | 350 mA | 5 W | 3.6 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | 1 % | Qualified | O-LALF-W2 | MIL-19500/356H | ISOLATED | 2 | GLASS | ROUND | LONG FORM | WIRE | AXIAL | DEFENSE LOGISTICS AGENCY | HERMETIC SEALED, GLASS PACKAGE-2 | unknown | |||||||||
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JAN1N6633D
Microsemi Corporation
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Check for Price | No | No | Transferred | 350 mA | 5 W | 3.6 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | 1 % | Not Qualified | O-LALF-W2 | e0 | MIL-19500/356H | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROSEMI CORP | HERMETIC SEALED, GLASS PACKAGE-2 | unknown | 2 | EAR99 | 8541.10.00.50 | ||
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JAN1N6633D
Microchip Technology Inc
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Check for Price | No | Active | 350 mA | 5 W | 3.6 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | 1 % | Qualified | O-LALF-W2 | e0 | MIL-19500/356H | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS PACKAGE-2 | compliant | ||||||
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JAN1N6633DUS
Microsemi Corporation
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Check for Price | No | Transferred | 350 mA | 5 W | 3.6 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | 1 % | Not Qualified | O-LELF-R2 | e0 | MIL-19500/356H | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROSEMI CORP | HERMETIC SEALED, GLASS PACKAGE-2 | unknown | ||||||
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JAN1N6633DUS
Compensated Devices Inc
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Check for Price | Obsolete | 350 mA | 5 W | 3.6 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | 1 % | Not Qualified | O-LELF-R2 | MIL-19500/356H | ISOLATED | 2 | GLASS | ROUND | LONG FORM | WRAP AROUND | END | COMPENSATED DEVICES INC | HERMETIC SEALED, GLASS PACKAGE-2 | unknown | |||||||||
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JAN1N6633DUS
Microchip Technology Inc
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Check for Price | No | Active | 350 mA | 5 W | 3.6 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | 1 % | Qualified | O-LELF-R2 | e0 | MIL-19500/356H | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS PACKAGE-2 | compliant | ||||||
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JAN1N6633D
Compensated Devices Inc
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Check for Price | Obsolete | 350 mA | 5 W | 3.6 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | 1 % | Not Qualified | O-LALF-W2 | MIL-19500/356H | ISOLATED | 2 | GLASS | ROUND | LONG FORM | WIRE | AXIAL | COMPENSATED DEVICES INC | HERMETIC SEALED, GLASS PACKAGE-2 | unknown | |||||||||
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JAN1N6633DUS
Defense Logistics Agency
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Check for Price | Active | 350 mA | 5 W | 3.6 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | 1 % | Qualified | O-LELF-R2 | MIL-19500/356H | ISOLATED | 2 | GLASS | ROUND | LONG FORM | WRAP AROUND | END | DEFENSE LOGISTICS AGENCY | HERMETIC SEALED, GLASS PACKAGE-2 | unknown |