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JAN1N974B-1
Microchip Technology Inc
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$2.3111 | No | Active | 3.4 mA | 500 nA | 400 mW | 36 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 70 Ω | 1 kΩ | 27 V | 33.48 mV/°C | 5 % | Qualified | O-LALF-W2 | e0 | MIL-19500 | DO-204AH | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | DO-35, 2 PIN | compliant | |||||||
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JAN1N974B-1/TR
Microchip Technology Inc
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$2.4811 | No | Active | 3.4 mA | 500 nA | 400 mW | 36 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 70 Ω | 1 kΩ | 27 V | 33.48 mV/°C | 5 % | O-LALF-W2 | MIL-19500 | DO-204AH | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | DO-35, 2 PIN | compliant | ||||||||||
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JAN1N974BUR-1
Microchip Technology Inc
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$4.5828 | No | Active | 3.4 mA | 500 mW | 36 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | METALLURGICALLY BONDED | 5 % | Qualified | O-LELF-R2 | e0 | MIL-19500/117 | DO-213AA | 1 | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS, LL34, MELF-2 | compliant | |||||||||||||
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JAN1N974BUR-1/TR
Microchip Technology Inc
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$4.7464 | Active | 3.4 mA | 500 mW | 36 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | METALLURGICALLY BONDED | 5 % | Qualified | O-LELF-R2 | e0 | MIL-19500/117 | DO-213AA | 1 | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | unknown | EAR99 | 8541.10.00.50 | |||||||||||||
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JAN1N974BUR-1
MACOM
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Check for Price | Transferred | 3.4 mA | 500 mW | 36 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | 5 % | Qualified | O-LELF-R2 | MIL-19500/117 | DO-213AA | ISOLATED | 2 | GLASS | ROUND | LONG FORM | WRAP AROUND | END | M/A-COM TECHNOLOGY SOLUTIONS INC | compliant | EAR99 | 8541.10.00.50 | |||||||||||||||||
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JAN1N974B-1/TR
Microsemi Corporation
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Check for Price | Transferred | ZENER DIODE | MICROSEMI CORP | unknown | ||||||||||||||||||||||||||||||||||||||||
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JAN1N974B
Cobham PLC
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Check for Price | Transferred | 3.4 mA | 500 mW | 36 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | 5 % | Not Qualified | O-LALF-W2 | e0 | MIL-19500/117 | DO-35 | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | COBHAM PLC | HERMETIC SEALED, GLASS PACKAGE-2 | unknown | EAR99 | 8541.10.00.50 | ||||||||||||||
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JAN1N974BUR-1
Microsemi Corporation
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Check for Price | No | No | Transferred | 3.4 mA | 500 mW | 36 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | METALLURGICALLY BONDED | 5 % | Not Qualified | O-LELF-R2 | e0 | MIL-19500/117 | DO-213AA | 1 | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROSEMI CORP | HERMETIC SEALED, GLASS, LL34, MELF-2 | unknown | EAR99 | 8541.10.00.50 | Microsemi Corporation | |||||||||
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JAN1N974BUR-1
Defense Logistics Agency
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Check for Price | Active | 3.4 mA | 500 mW | 36 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | METALLURGICALLY BONDED | 5 % | Qualified | O-LELF-R2 | MIL-19500 | DO-213AA | ISOLATED | 2 | GLASS | ROUND | LONG FORM | WRAP AROUND | END | DEFENSE LOGISTICS AGENCY | MELF-2 | unknown | |||||||||||||||||
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JAN1N974B-1
Compensated Devices Inc
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Check for Price | Transferred | 3.4 mA | 500 nA | 500 mW | 36 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 1 kΩ | 5 % | Not Qualified | O-LALF-W2 | MIL-19500/117 | DO-35 | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | WIRE | AXIAL | COMPENSATED DEVICES INC | HERMETIC SEALED, GLASS PACKAGE-1 | unknown |