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JANS1N3154-1
Defense Logistics Agency
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Check for Price | Active | 500 mW | 8.4 V | SILICON | ZENER DIODE | SINGLE | NO | 1 | ZENER | 5 % | Qualified | O-LALF-W2 | MIL-19500/158P | DO-35 | ISOLATED | 2 | GLASS | ROUND | LONG FORM | WIRE | AXIAL | DEFENSE LOGISTICS AGENCY | HERMETIC SEALED, GLASS, SIMILAR TO DO-7, 2 PIN | unknown | ||||||||||||||||
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JANS1N3154-1
Compensated Devices Inc
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Check for Price | Transferred | 500 mW | 8.4 V | SILICON | ZENER DIODE | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 0.84 mV/°C | 5 % | Not Qualified | O-LALF-W2 | MIL-19500/158P | DO-35 | ISOLATED | 2 | GLASS | ROUND | LONG FORM | WIRE | AXIAL | COMPENSATED DEVICES INC | HERMETIC SEALED, GLASS, SIMILAR TO DO-7, 2 PIN | unknown | ||||||||||||||
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JANS1N3154-1
Microsemi Corporation
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Check for Price | No | No | Transferred | 500 mW | 8.4 V | SILICON | ZENER DIODE | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 0.84 mV/°C | 5 % | Not Qualified | O-LALF-W2 | e0 | MIL-19500/158P | DO-35 | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROSEMI CORP | HERMETIC SEALED, GLASS, SIMILAR TO DO-7, 2 PIN | unknown | DO-7 | 2 | EAR99 | 8541.10.00.50 | ||||||
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JANS1N3154UR-1/TR
Microchip Technology Inc
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Check for Price | Active | 500 mW | 8.4 V | SILICON | ZENER DIODE | SINGLE | YES | 1 | ZENER | METALLURGICALLY BONDED | 0.84 mV/°C | 5 % | Qualified | O-LELF-R2 | e0 | MIL-19500/158P | DO-213AA | 1 | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | unknown | EAR99 | 8541.10.00.50 | ||||||||||
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JANS1N3154
Compensated Devices Inc
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Check for Price | Obsolete | 500 mW | 8.4 V | SILICON | ZENER DIODE | SINGLE | NO | 1 | ZENER | 5 % | Not Qualified | O-LALF-W2 | MIL-19500/158P | DO-35 | ISOLATED | 2 | GLASS | ROUND | LONG FORM | WIRE | AXIAL | COMPENSATED DEVICES INC | O-LALF-W2 | unknown | ||||||||||||||||
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JANS1N3154UR-1
Defense Logistics Agency
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Check for Price | Active | 500 mW | 8.4 V | SILICON | ZENER DIODE | SINGLE | YES | 1 | ZENER | 5 % | Qualified | O-LELF-R2 | MIL-19500/158P | DO-213AA | ISOLATED | 2 | GLASS | ROUND | LONG FORM | WRAP AROUND | END | DEFENSE LOGISTICS AGENCY | HERMETIC SEALED, GLASS PACKAGE-2 | unknown | ||||||||||||||||
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JANS1N3154-1
Microchip Technology Inc
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Check for Price | No | Active | 500 mW | 8.4 V | SILICON | ZENER DIODE | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 0.84 mV/°C | 5 % | Qualified | O-LALF-W2 | e0 | MIL-19500/158P | DO-35 | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS, SIMILAR TO DO-7, 2 PIN | compliant | |||||||||||
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JANS1N3154
Microsemi Corporation
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Check for Price | No | Obsolete | 10 mA | 500 mW | 8.4 V | SILICON | ZENER DIODE | SINGLE | NO | 1 | ZENER | 15 Ω | 5 % | Not Qualified | O-LALF-W2 | e0 | DO-35 | 175 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROSEMI CORP | O-LALF-W2 | not_compliant | DO-7 | 2 | EAR99 | 8541.10.00.50 | |||||||
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JANS1N3154UR-1
Compensated Devices Inc
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Check for Price | Transferred | 500 mW | 8.4 V | SILICON | ZENER DIODE | SINGLE | YES | 1 | ZENER | METALLURGICALLY BONDED | 0.84 mV/°C | 5 % | Not Qualified | O-LELF-R2 | MIL-19500/158P | DO-213AA | ISOLATED | 2 | GLASS | ROUND | LONG FORM | WRAP AROUND | END | COMPENSATED DEVICES INC | HERMETIC SEALED, GLASS PACKAGE-2 | unknown | ||||||||||||||
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JANS1N3154UR-1
Microchip Technology Inc
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Check for Price | No | Active | 500 mW | 8.4 V | SILICON | ZENER DIODE | SINGLE | YES | 1 | ZENER | METALLURGICALLY BONDED | 0.84 mV/°C | 5 % | Qualified | O-LELF-R2 | e0 | MIL-19500/158P | DO-213AA | 1 | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS PACKAGE-2 | compliant |