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Parametric results for: JANS1N6314 under Zener Diodes

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Manufacturer Part Number: jans1n6314
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JANS1N6314
 Microchip Technology Inc 		$118.0293 No Active 20 mA 500 mW 3.9 V SILICON ZENER DIODE UNIDIRECTIONAL SINGLE NO 1 ZENER 5 % Qualified O-LALF-W2 e0 MIL-19500/533 ISOLATED 2 GLASS ROUND LONG FORM TIN LEAD WIRE AXIAL MICROCHIP TECHNOLOGY INC compliant
JANS1N6314US
 Microchip Technology Inc 		$138.8531 No Active 20 mA 2 µA 500 mW 3.9 V SILICON ZENER DIODE UNIDIRECTIONAL SINGLE YES 1 ZENER HIGH RELIABILITY, METALLURGICALLY BONDED 23 Ω 1.7 kΩ 1 V 5 % Qualified O-LELF-R2 e0 MIL-19500 175 °C -65 °C ISOLATED 2 GLASS ROUND LONG FORM Tin/Lead (Sn/Pb) WRAP AROUND END MICROCHIP TECHNOLOGY INC compliant MELF-2
JANS1N6314US/TR
 Microchip Technology Inc 		$140.3484 Active 20 mA 2 µA 500 mW 3.9 V SILICON ZENER DIODE UNIDIRECTIONAL SINGLE YES 1 ZENER HIGH RELIABILITY, METALLURGICALLY BONDED 23 Ω 1.7 kΩ 1 V 5 % Qualified O-LELF-R2 e0 MIL-19500 175 °C -65 °C ISOLATED 2 GLASS ROUND LONG FORM Tin/Lead (Sn/Pb) WRAP AROUND END MICROCHIP TECHNOLOGY INC unknown EAR99 8541.10.00.50
JANS1N6314C
 Microsemi Corporation 		$251.5240 No No Transferred 20 mA 500 mW 3.9 V SILICON ZENER DIODE UNIDIRECTIONAL SINGLE NO 1 ZENER HIGH RELIABILITY, METALLURGICALLY BONDED 20 Ω 2 % Not Qualified O-LALF-W2 e0 MIL-19500 DO-35 175 °C -65 °C 2 GLASS ROUND LONG FORM TIN LEAD WIRE AXIAL MICROSEMI CORP unknown DO-35, 2 PIN EAR99 8541.10.00.50
JANS1N6314C
 Microchip Technology Inc 		$288.6887 No Active 20 mA 500 mW 3.9 V SILICON ZENER DIODE UNIDIRECTIONAL SINGLE NO 1 ZENER HIGH RELIABILITY, METALLURGICALLY BONDED 20 Ω 2 % Qualified O-LALF-W2 e0 MIL-19500 DO-35 175 °C -65 °C ISOLATED 2 GLASS ROUND LONG FORM TIN LEAD WIRE AXIAL MICROCHIP TECHNOLOGY INC compliant HERMETIC SEALED, GLASS, D PACKAGE-2
JANS1N6314CUS
 Microchip Technology Inc 		$293.6309 No Active 20 mA 2 µA 500 mW 3.9 V SILICON ZENER DIODE UNIDIRECTIONAL SINGLE YES 1 ZENER HIGH RELIABILITY, METALLURGICALLY BONDED 23 Ω 1.7 kΩ 1 V 2 % Qualified O-LELF-R2 e0 MIL-19500 175 °C -65 °C ISOLATED 2 GLASS ROUND LONG FORM Tin/Lead (Sn/Pb) WRAP AROUND END MICROCHIP TECHNOLOGY INC compliant MELF-2
JANS1N6314D
 Microsemi Corporation 		$314.4120 No No Transferred 20 mA 500 mW 3.9 V SILICON ZENER DIODE UNIDIRECTIONAL SINGLE NO 1 ZENER HIGH RELIABILITY, METALLURGICALLY BONDED 20 Ω 1 % Not Qualified O-LALF-W2 e0 MIL-19500 DO-35 175 °C -65 °C 2 GLASS ROUND LONG FORM TIN LEAD WIRE AXIAL MICROSEMI CORP unknown DO-35, 2 PIN EAR99 8541.10.00.50 Microsemi Corporation
JANS1N6314D
 Microchip Technology Inc 		$360.8546 No Active 20 mA 500 mW 3.9 V SILICON ZENER DIODE UNIDIRECTIONAL SINGLE NO 1 ZENER HIGH RELIABILITY, METALLURGICALLY BONDED 20 Ω 1 % Qualified O-LALF-W2 e0 MIL-19500 DO-35 175 °C -65 °C ISOLATED 2 GLASS ROUND LONG FORM TIN LEAD WIRE AXIAL MICROCHIP TECHNOLOGY INC compliant HERMETIC SEALED, GLASS, D PACKAGE-2
JANS1N6314CUS
 Microsemi Corporation 		$362.1520 No Transferred 20 mA 2 µA 500 mW 3.9 V SILICON ZENER DIODE UNIDIRECTIONAL SINGLE YES 1 ZENER HIGH RELIABILITY, METALLURGICALLY BONDED 23 Ω 1.7 kΩ 1 V 2 % Not Qualified O-LELF-R2 e0 MIL-19500 175 °C -65 °C 2 GLASS ROUND LONG FORM Tin/Lead (Sn/Pb) WRAP AROUND END MICROSEMI CORP unknown MELF-2 EAR99 8541.10.00.50
JANS1N6314DUS
 Microsemi Corporation 		$369.8800 No Transferred 20 mA 2 µA 500 mW 3.9 V SILICON ZENER DIODE UNIDIRECTIONAL SINGLE YES 1 ZENER HIGH RELIABILITY, METALLURGICALLY BONDED 23 Ω 1.7 kΩ 1 V 1 % Not Qualified O-LELF-R2 e0 MIL-19500 175 °C -65 °C 2 GLASS ROUND LONG FORM Tin/Lead (Sn/Pb) WRAP AROUND END MICROSEMI CORP unknown MELF-2 EAR99 8541.10.00.50 Microsemi Corporation MELF 2
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