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JANTX1N6638U
Microchip Technology Inc
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$7.3888 | No | Active | 300 mA | 1.1 V | 4.5 ns | 500 nA | 750 mW | SILICON | RECTIFIER DIODE | SINGLE | YES | 125 V | 1 | METALLURGICALLY BONDED | 2.5 A | 1 | Qualified | O-XELF-R2 | e0 | MIL-19500/578E | 200 °C | -65 °C | ISOLATED | 2 | UNSPECIFIED | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | SURFACEMOUNT PACKAGE-2 | compliant | Microchip | |||||||||
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JANTX1N6638U/TR
Microchip Technology Inc
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$7.5402 | Active | 300 mA | 1.1 V | 4.5 ns | 500 nA | SILICON | 150 V | RECTIFIER DIODE | SINGLE | YES | 125 V | 1 | GENERAL PURPOSE | 2.5 A | 1 | 125 V | O-LELF-R2 | MIL-PRF-19500 | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | unknown | ||||||||||||||
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JANTX1N6638US
Cobham Semiconductor Solutions
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$7.9601 | Transferred | 300 mA | 4.5 ns | 750 mW | SILICON | RECTIFIER DIODE | SINGLE | YES | 125 V | 1 | HIGH RELIABILITY | Not Qualified | O-LELF-R2 | e0 | MIL-19500/578 | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | AEROFLEX/METELICS INC | HERMETIC SEALED GLASS PACKAGE-2 | unknown | 2 | EAR99 | 8541.10.00.70 | ||||||||||||||
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JANTX1N6638U
Cobham Semiconductor Solutions
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$7.9601 | Transferred | 300 mA | 4.5 ns | SILICON | RECTIFIER DIODE | SINGLE | NO | 125 V | 1 | Not Qualified | O-LALF-W2 | e0 | MIL-19500/578 | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | AEROFLEX/METELICS INC | HERMETIC SEALED GLASS PACKAGE-2 | unknown | 2 | EAR99 | 8541.10.00.70 | ||||||||||||||||
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JANTX1N6638US
Microchip Technology Inc
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$8.1200 | No | Active | 300 mA | 1.1 V | 4.5 ns | 500 nA | SILICON | RECTIFIER DIODE | SINGLE | YES | 125 V | 1 | METALLURGICALLY BONDED | 2.5 A | 1 | Qualified | O-XELF-R2 | e0 | MIL-19500/578E | 175 °C | -65 °C | ISOLATED | 2 | UNSPECIFIED | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | SURFACEMOUNT PACKAGE-2 | compliant | Microchip | ||||||||||
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JANTX1N6638US
MACOM
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$10.2157 | Transferred | 300 mA | 4.5 ns | 750 mW | SILICON | RECTIFIER DIODE | SINGLE | YES | 125 V | 1 | HIGH RELIABILITY | Qualified | O-LELF-R2 | e0 | MIL-19500/578 | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | M/A-COM TECHNOLOGY SOLUTIONS INC | HERMETIC SEALED GLASS PACKAGE-2 | compliant | EAR99 | 8541.10.00.70 | |||||||||||||||
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JANTX1N6638U
Microsemi Corporation
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$12.3981 | No | No | Transferred | 300 mA | 1.1 V | 4.5 ns | 500 nA | 750 mW | SILICON | RECTIFIER DIODE | SINGLE | YES | 125 V | 1 | METALLURGICALLY BONDED | 2.5 A | 1 | Not Qualified | O-XELF-R2 | e0 | MIL-19500/578E | 200 °C | -65 °C | ISOLATED | 2 | UNSPECIFIED | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROSEMI CORP | SURFACEMOUNT PACKAGE-2 | not_compliant | Microsemi Corporation | 2 | EAR99 | 8541.10.00.70 | |||||
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JANTX1N6638U
Defense Logistics Agency
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Check for Price | Active | 300 mA | 4.5 ns | SILICON | RECTIFIER DIODE | SINGLE | YES | 125 V | 1 | METALLURGICALLY BONDED | 1 | Qualified | O-XELF-R2 | MIL-19500/578E | ISOLATED | 2 | UNSPECIFIED | ROUND | LONG FORM | WRAP AROUND | END | DEFENSE LOGISTICS AGENCY | SURFACEMOUNT PACKAGE-2 | unknown | |||||||||||||||||||
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JANTX1N6638US
Defense Logistics Agency
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Check for Price | Active | 300 mA | 4.5 ns | SILICON | RECTIFIER DIODE | SINGLE | YES | 125 V | 1 | METALLURGICALLY BONDED | 1 | Qualified | O-XELF-R2 | MIL-19500/578E | ISOLATED | 2 | UNSPECIFIED | ROUND | LONG FORM | WRAP AROUND | END | DEFENSE LOGISTICS AGENCY | SURFACEMOUNT PACKAGE-2 | unknown | |||||||||||||||||||
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JANTX1N6638US
Compensated Devices Inc
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Check for Price | Transferred | 300 mA | 4.5 ns | SILICON | RECTIFIER DIODE | SINGLE | YES | 125 V | 1 | METALLURGICALLY BONDED | Not Qualified | O-XELF-R2 | MIL-19500/578E | ISOLATED | 2 | UNSPECIFIED | ROUND | LONG FORM | WRAP AROUND | END | COMPENSATED DEVICES INC | SURFACEMOUNT PACKAGE-2 | unknown |