Parametric results for: JANTXV1N5523 under Zener Diodes
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JANTXV1N5523B-1
Microchip Technology Inc
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$7.0617 | No | Active | 5 mA | 500 mW | 5.1 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 5 % | Qualified | O-LALF-W2 | e0 | MIL-19500 | DO-204AH | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS, DO-35, 2 PIN | compliant | ||||||||||
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JANTXV1N5523B-1
MACOM
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$7.6709 | Transferred | 5 µA | 500 mW | 5.1 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 5 % | Qualified | O-PALF-W2 | e0 | MIL-19500/437 | DO-35 | ISOLATED | 2 | PLASTIC/EPOXY | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | M/A-COM TECHNOLOGY SOLUTIONS INC | HERMETIC SEALED PACKAGE-2 | compliant | EAR99 | 8541.10.00.50 | |||||||||||
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JANTXV1N5523BUR-1
Microchip Technology Inc
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$19.9389 | No | Active | 5 mA | 500 mW | 5.1 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | METALLURGICALLY BONDED | 5 % | Qualified | O-LELF-R2 | e0 | MIL-19500 | DO-213AA | 1 | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS, MLL34, MELF-2 | compliant | |||||||||
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JANTXV1N5523C-1
Microsemi Corporation
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$21.2589 | No | Transferred | 5 mA | 500 mW | 5.1 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 2 % | Not Qualified | O-LALF-W2 | e0 | MIL-19500 | DO-204AH | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROSEMI CORP | HERMETIC SEALED, GLASS, DO-35, 2 PIN | unknown | ||||||||||
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JANTXV1N5523BUR-1
Microsemi Corporation
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$22.5308 | No | No | Transferred | 5 mA | 500 mW | 5.1 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | METALLURGICALLY BONDED | 5 % | Not Qualified | O-LELF-R2 | e0 | MIL-19500 | DO-213AA | 1 | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROSEMI CORP | HERMETIC SEALED, GLASS, MLL34, MELF-2 | unknown | EAR99 | 8541.10.00.50 | DO-213AA | 2 | Microsemi Corporation | |||
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JANTXV1N5523C-1
Microchip Technology Inc
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$24.0768 | No | Active | 5 mA | 500 mW | 5.1 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 2 % | Qualified | O-LALF-W2 | e0 | MIL-19500 | DO-204AH | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS, DO-35, 2 PIN | compliant | ||||||||||
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JANTXV1N5523D-1
Microsemi Corporation
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$26.5827 | No | No | Transferred | 5 mA | 500 mW | 5.1 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 1 % | Not Qualified | O-LALF-W2 | e0 | MIL-19500 | DO-204AH | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROSEMI CORP | HERMETIC SEALED, GLASS, DO-35, 2 PIN | unknown | EAR99 | 8541.10.00.50 | DO-7 | 2 | Microsemi Corporation | ||||
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JANTXV1N5523D-1
Microchip Technology Inc
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$30.1008 | No | Active | 5 mA | 500 mW | 5.1 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 1 % | Qualified | O-LALF-W2 | e0 | MIL-19500 | DO-204AH | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS, DO-35, 2 PIN | compliant | ||||||||||
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JANTXV1N5523CUR-1
Microsemi Corporation
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$42.7800 | No | No | Transferred | 5 mA | 500 mW | 5.1 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | AVALANCHE | METALLURGICALLY BONDED | 26 Ω | 2 % | Not Qualified | R-LELF-R2 | e0 | MIL-19500 | DO-213AA | 200 °C | -65 °C | ISOLATED | 2 | GLASS | RECTANGULAR | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROSEMI CORP | HERMETIC SEALED, GLASS, MLL34, MELF-2 | unknown | EAR99 | 8541.10.00.50 | DO-213AA | 2 | ||||
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JANTXV1N5523CUR-1
Microchip Technology Inc
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$51.0059 | No | Active | 5 mA | 500 mW | 5.1 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | AVALANCHE | METALLURGICALLY BONDED | 26 Ω | 2 % | Qualified | R-LELF-R2 | e0 | MIL-19500 | DO-213AA | 200 °C | -65 °C | ISOLATED | 2 | GLASS | RECTANGULAR | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS, MLL34, MELF-2 | compliant |