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JANTXV1N6487US
Compensated Devices Inc
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Check for Price | Transferred | 64 mA | 1.5 W | 3.9 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | METALLURGICALLY BONDED | 5 % | Not Qualified | O-LELF-R2 | MIL-19500/406F | ISOLATED | 2 | GLASS | ROUND | LONG FORM | WRAP AROUND | END | COMPENSATED DEVICES INC | HERMETIC SEALED, GLASS, D-5A, 2 PIN | unknown | |||||||||
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JANTXV1N6487US
Microsemi Corporation
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Check for Price | No | No | Transferred | 64 mA | 1.5 W | 3.9 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | METALLURGICALLY BONDED | 5 % | Not Qualified | O-LELF-R2 | e0 | MIL-19500 | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROSEMI CORP | HERMETIC SEALED, GLASS PACKAGE-2 | unknown | 2 | EAR99 | 8541.10.00.50 | ||
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JANTXV1N6487USC
Microsemi Corporation
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Check for Price | No | Obsolete | 64 mA | 1.5 W | 3.9 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | 2 % | Not Qualified | O-LELF-R2 | e0 | MIL-19500 | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROSEMI CORP | O-LELF-R2 | compliant | 2 | EAR99 | 8541.10.00.50 | ||||
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JANTXV1N6487US
Defense Logistics Agency
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Check for Price | Active | 64 mA | 1.5 W | 3.9 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | 5 % | Qualified | O-LELF-R2 | MIL-19500/406F | ISOLATED | 2 | GLASS | ROUND | LONG FORM | WRAP AROUND | END | DEFENSE LOGISTICS AGENCY | HERMETIC SEALED, GLASS, D-5A, 2 PIN | unknown | ||||||||||
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JANTXV1N6487USD
Microsemi Corporation
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Check for Price | No | Obsolete | 64 mA | 1.5 W | 3.9 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | 1 % | Not Qualified | O-LELF-R2 | e0 | MIL-19500 | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROSEMI CORP | O-LELF-R2 | compliant | 2 | EAR99 | 8541.10.00.50 | ||||
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JANTXV1N6487US
Microchip Technology Inc
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Check for Price | No | Active | 64 mA | 1.5 W | 3.9 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | METALLURGICALLY BONDED | 5 % | Qualified | O-LELF-R2 | e0 | MIL-19500 | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS PACKAGE-2 | compliant |