Findchips: Parametric Search Results for K1B3216BDD


Select Parts		Part Number

		K1B3216BDD-BI700 Samsung Semiconductor
		K1B3216BDD-BI70T Samsung Semiconductor
		K1B3216BDD-FI70T Samsung Semiconductor
		K1B3216BDD-FI70 Samsung Semiconductor
		K1B3216BDD-BI70 Samsung Semiconductor
		K1B3216BDD-FI700 Samsung Semiconductor

			Most Relevant					Technical								Compliance		Operating Conditions		Physical										Other
Composite Price	Rohs Code	Part Life Cycle Code	Memory Density	Memory Width	Organization	Supply Voltage-Nom (Vsup)	Access Time-Max	I/O Type	Number of Words Code	Number of Words	Output Characteristics	Standby Current-Max	Supply Current-Max	Technology	Temperature Grade	JESD-30 Code	Qualification Status	Operating Temperature-Max	Operating Temperature-Min	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Surface Mount	Terminal Form	Terminal Pitch	Terminal Position	Ihs Manufacturer	Package Description	Reach Compliance Code	ECCN Code	HTS Code

Check for Price

Yes

Obsolete

33.5544 Mbit

2MX16

1.8 V

70 ns

COMMON

2000000

2.0972 M

3-STATE

100 µA

35 µA

CMOS

INDUSTRIAL

R-PBGA-B54

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

FBGA

BGA54,6X9,30

RECTANGULAR

GRID ARRAY, FINE PITCH

YES

BALL

750 µm

BOTTOM

SAMSUNG SEMICONDUCTOR INC

FBGA, BGA54,6X9,30

unknown

EAR99

8542.32.00.71

Check for Price

Yes

Obsolete

33.5544 Mbit

2MX16

1.8 V

70 ns

COMMON

2000000

2.0972 M

3-STATE

100 µA

35 µA

CMOS

INDUSTRIAL

R-PBGA-B54

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

FBGA

BGA54,6X9,30

RECTANGULAR

GRID ARRAY, FINE PITCH

YES

BALL

750 µm

BOTTOM

SAMSUNG SEMICONDUCTOR INC

FBGA, BGA54,6X9,30

unknown

EAR99

8542.32.00.71

Check for Price

Obsolete

33.5544 Mbit

2MX16

1.8 V

70 ns

COMMON

2000000

2.0972 M

3-STATE

100 µA

35 µA

CMOS

INDUSTRIAL

R-PBGA-B54

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

FBGA

BGA54,6X9,30

RECTANGULAR

GRID ARRAY, FINE PITCH

YES

BALL

750 µm

BOTTOM

SAMSUNG SEMICONDUCTOR INC

FBGA, BGA54,6X9,30

unknown

EAR99

8542.32.00.71

Check for Price

Obsolete

33.5544 Mbit

2MX16

1.8 V

70 ns

COMMON

2000000

2.0972 M

3-STATE

100 µA

35 µA

CMOS

INDUSTRIAL

R-PBGA-B54

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

FBGA

BGA54,6X9,30

RECTANGULAR

GRID ARRAY, FINE PITCH

YES

BALL

750 µm

BOTTOM

SAMSUNG SEMICONDUCTOR INC

FBGA, BGA54,6X9,30

unknown

EAR99

8542.32.00.71

Check for Price

Yes

Obsolete

33.5544 Mbit

2MX16

1.8 V

70 ns

COMMON

2000000

2.0972 M

3-STATE

100 µA

35 µA

CMOS

INDUSTRIAL

R-PBGA-B54

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

FBGA

BGA54,6X9,30

RECTANGULAR

GRID ARRAY, FINE PITCH

YES

BALL

750 µm

BOTTOM

SAMSUNG SEMICONDUCTOR INC

FBGA, BGA54,6X9,30

unknown

EAR99

8542.32.00.71

Check for Price

Obsolete

33.5544 Mbit

2MX16

1.8 V

70 ns

COMMON

2000000

2.0972 M

3-STATE

100 µA

35 µA

CMOS

INDUSTRIAL

R-PBGA-B54

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

FBGA

BGA54,6X9,30

RECTANGULAR

GRID ARRAY, FINE PITCH

YES

BALL

750 µm

BOTTOM

SAMSUNG SEMICONDUCTOR INC

FBGA, BGA54,6X9,30

unknown

EAR99

8542.32.00.71

Compare

K1B3216BDD-BI700

Samsung Semiconductor

Check for Price

Yes

Obsolete

33.5544 Mbit

2MX16

1.8 V

70 ns

COMMON

2000000

2.0972 M

3-STATE

100 µA

35 µA

CMOS

INDUSTRIAL

R-PBGA-B54

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

FBGA

BGA54,6X9,30

RECTANGULAR

GRID ARRAY, FINE PITCH

YES

BALL

750 µm

BOTTOM

SAMSUNG SEMICONDUCTOR INC

FBGA, BGA54,6X9,30

unknown

EAR99

8542.32.00.71

K1B3216BDD-BI70T

Samsung Semiconductor

Check for Price

Yes

Obsolete

33.5544 Mbit

2MX16

1.8 V

70 ns

COMMON

2000000

2.0972 M

3-STATE

100 µA

35 µA

CMOS

INDUSTRIAL

R-PBGA-B54

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

FBGA

BGA54,6X9,30

RECTANGULAR

GRID ARRAY, FINE PITCH

YES

BALL

750 µm

BOTTOM

SAMSUNG SEMICONDUCTOR INC

FBGA, BGA54,6X9,30

unknown

EAR99

8542.32.00.71

K1B3216BDD-FI70T

Samsung Semiconductor

Check for Price

Obsolete

33.5544 Mbit

2MX16

1.8 V

70 ns

COMMON

2000000

2.0972 M

3-STATE

100 µA

35 µA

CMOS

INDUSTRIAL

R-PBGA-B54

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

FBGA

BGA54,6X9,30

RECTANGULAR

GRID ARRAY, FINE PITCH

YES

BALL

750 µm

BOTTOM

SAMSUNG SEMICONDUCTOR INC

FBGA, BGA54,6X9,30

unknown

EAR99

8542.32.00.71

K1B3216BDD-FI70

Samsung Semiconductor

Check for Price

Obsolete

33.5544 Mbit

2MX16

1.8 V

70 ns

COMMON

2000000

2.0972 M

3-STATE

100 µA

35 µA

CMOS

INDUSTRIAL

R-PBGA-B54

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

FBGA

BGA54,6X9,30

RECTANGULAR

GRID ARRAY, FINE PITCH

YES

BALL

750 µm

BOTTOM

SAMSUNG SEMICONDUCTOR INC

FBGA, BGA54,6X9,30

unknown

EAR99

8542.32.00.71

K1B3216BDD-BI70

Samsung Semiconductor

Check for Price

Yes

Obsolete

33.5544 Mbit

2MX16

1.8 V

70 ns

COMMON

2000000

2.0972 M

3-STATE

100 µA

35 µA

CMOS

INDUSTRIAL

R-PBGA-B54

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

FBGA

BGA54,6X9,30

RECTANGULAR

GRID ARRAY, FINE PITCH

YES

BALL

750 µm

BOTTOM

SAMSUNG SEMICONDUCTOR INC

FBGA, BGA54,6X9,30

unknown

EAR99

8542.32.00.71

K1B3216BDD-FI700

Samsung Semiconductor

Check for Price

Obsolete

33.5544 Mbit

2MX16

1.8 V

70 ns

COMMON

2000000

2.0972 M

3-STATE

100 µA

35 µA

CMOS

INDUSTRIAL

R-PBGA-B54

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

FBGA

BGA54,6X9,30

RECTANGULAR

GRID ARRAY, FINE PITCH

YES

BALL

750 µm

BOTTOM

SAMSUNG SEMICONDUCTOR INC

FBGA, BGA54,6X9,30

unknown

EAR99

8542.32.00.71

Parametric results for: K1B3216BDD under Other Memory ICs