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Manufacturer Part Number: k4s643233hf
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K4S643233H-FG60
 Samsung Semiconductor 		Check for Price No Active 67.1089 Mbit 32 2MX32 5.4 ns 166 MHz 4096 SYNCHRONOUS DRAM COMMON 1,2,4,8 2000000 2.0972 M 3-STATE 1,2,4,8,FP 500 µA 145 µA CMOS OTHER R-PBGA-B90 Not Qualified e0 85 °C -25 °C 90 PLASTIC/EPOXY FBGA BGA90,9X15,32 RECTANGULAR GRID ARRAY, FINE PITCH YES Tin/Lead (Sn/Pb) BALL 800 µm BOTTOM SAMSUNG SEMICONDUCTOR INC compliant EAR99 8542.32.00.02
K4S643233H-FN600
 Samsung Semiconductor 		Check for Price No Obsolete 67.1089 Mbit 32 2MX32 3 V 5.4 ns FOUR BANK PAGE BURST SYNCHRONOUS DRAM AUTO/SELF REFRESH 1 1 2000000 2.0972 M SYNCHRONOUS YES 3.6 V 2.7 V CMOS OTHER R-PBGA-B90 Not Qualified 85 °C -25 °C 240 30 90 PLASTIC/EPOXY LFBGA RECTANGULAR GRID ARRAY, LOW PROFILE, FINE PITCH YES BALL 800 µm BOTTOM 1.4 mm 13 mm 8 mm SAMSUNG SEMICONDUCTOR INC compliant EAR99 8542.32.00.02 BGA LFBGA, 90
K4S643233H-FE60
 Samsung Semiconductor 		Check for Price No Active 67.1089 Mbit 32 2MX32 5.4 ns 166 MHz 4096 SYNCHRONOUS DRAM COMMON 1,2,4,8 2000000 2.0972 M 3-STATE 1,2,4,8,FP 500 µA 145 µA CMOS OTHER R-PBGA-B90 Not Qualified e0 85 °C -25 °C 90 PLASTIC/EPOXY FBGA BGA90,9X15,32 RECTANGULAR GRID ARRAY, FINE PITCH YES Tin/Lead (Sn/Pb) BALL 800 µm BOTTOM SAMSUNG SEMICONDUCTOR INC compliant EAR99 8542.32.00.02
K4S643233H-FN1H0
 Samsung Semiconductor 		Check for Price No Obsolete 67.1089 Mbit 32 2MX32 3 V 7 ns FOUR BANK PAGE BURST SYNCHRONOUS DRAM AUTO/SELF REFRESH 1 1 2000000 2.0972 M SYNCHRONOUS YES 3.6 V 2.7 V CMOS OTHER R-PBGA-B90 Not Qualified 85 °C -25 °C 240 30 90 PLASTIC/EPOXY LFBGA RECTANGULAR GRID ARRAY, LOW PROFILE, FINE PITCH YES BALL 800 µm BOTTOM 1.4 mm 13 mm 8 mm SAMSUNG SEMICONDUCTOR INC compliant EAR99 8542.32.00.02 BGA LFBGA, 90
K4S643233H-FC750
 Samsung Semiconductor 		Check for Price No Obsolete 67.1089 Mbit 32 2MX32 3 V 6 ns FOUR BANK PAGE BURST SYNCHRONOUS DRAM AUTO/SELF REFRESH 1 1 2000000 2.0972 M SYNCHRONOUS YES 3.6 V 2.7 V CMOS OTHER R-PBGA-B90 Not Qualified 70 °C -25 °C 240 30 90 PLASTIC/EPOXY LFBGA RECTANGULAR GRID ARRAY, LOW PROFILE, FINE PITCH YES BALL 800 µm BOTTOM 1.4 mm 13 mm 8 mm SAMSUNG SEMICONDUCTOR INC compliant EAR99 8542.32.00.02 BGA LFBGA, 90
K4S643233H-FC1H
 Samsung Semiconductor 		Check for Price No Active 67.1089 Mbit 32 2MX32 7 ns 105 MHz 4096 SYNCHRONOUS DRAM COMMON 1,2,4,8 2000000 2.0972 M 3-STATE 1,2,4,8,FP 500 µA 120 µA CMOS OTHER R-PBGA-B90 Not Qualified e0 70 °C -25 °C 90 PLASTIC/EPOXY FBGA BGA90,9X15,32 RECTANGULAR GRID ARRAY, FINE PITCH YES Tin/Lead (Sn/Pb) BALL 800 µm BOTTOM SAMSUNG SEMICONDUCTOR INC compliant EAR99 8542.32.00.02
K4S643233H-FF75
 Samsung Semiconductor 		Check for Price No Active 67.1089 Mbit 32 2MX32 6 ns 133 MHz 4096 SYNCHRONOUS DRAM COMMON 1,2,4,8 2000000 2.0972 M 3-STATE 1,2,4,8,FP 500 µA 135 µA CMOS OTHER R-PBGA-B90 Not Qualified e0 70 °C -25 °C 90 PLASTIC/EPOXY FBGA BGA90,9X15,32 RECTANGULAR GRID ARRAY, FINE PITCH YES Tin/Lead (Sn/Pb) BALL 800 µm BOTTOM SAMSUNG SEMICONDUCTOR INC compliant EAR99 8542.32.00.02
K4S643233H-FL750
 Samsung Semiconductor 		Check for Price No Obsolete 67.1089 Mbit 32 2MX32 3 V 6 ns FOUR BANK PAGE BURST SYNCHRONOUS DRAM AUTO/SELF REFRESH 1 1 2000000 2.0972 M SYNCHRONOUS YES 3.6 V 2.7 V CMOS OTHER R-PBGA-B90 Not Qualified 70 °C -25 °C 240 30 90 PLASTIC/EPOXY LFBGA RECTANGULAR GRID ARRAY, LOW PROFILE, FINE PITCH YES BALL 800 µm BOTTOM 1.4 mm 13 mm 8 mm SAMSUNG SEMICONDUCTOR INC compliant EAR99 8542.32.00.02 BGA LFBGA, 90
K4S643233H-FF1H
 Samsung Semiconductor 		Check for Price No Active 67.1089 Mbit 32 2MX32 7 ns 105 MHz 4096 SYNCHRONOUS DRAM COMMON 1,2,4,8 2000000 2.0972 M 3-STATE 1,2,4,8,FP 500 µA 120 µA CMOS OTHER R-PBGA-B90 Not Qualified e0 70 °C -25 °C 90 PLASTIC/EPOXY FBGA BGA90,9X15,32 RECTANGULAR GRID ARRAY, FINE PITCH YES Tin/Lead (Sn/Pb) BALL 800 µm BOTTOM SAMSUNG SEMICONDUCTOR INC compliant EAR99 8542.32.00.02
K4S643233H-FC1L0
 Samsung Semiconductor 		Check for Price No Obsolete 67.1089 Mbit 32 2MX32 3 V 7 ns FOUR BANK PAGE BURST SYNCHRONOUS DRAM AUTO/SELF REFRESH 1 1 2000000 2.0972 M SYNCHRONOUS YES 3.6 V 2.7 V CMOS OTHER R-PBGA-B90 Not Qualified 70 °C -25 °C 240 30 90 PLASTIC/EPOXY LFBGA RECTANGULAR GRID ARRAY, LOW PROFILE, FINE PITCH YES BALL 800 µm BOTTOM 1.4 mm 13 mm 8 mm SAMSUNG SEMICONDUCTOR INC compliant EAR99 8542.32.00.02 BGA LFBGA, 90
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