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K7D323674C-HC40
Samsung Semiconductor
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Check for Price | Yes | No | Obsolete | 37.7487 Mbit | 36 | 1MX36 | 400 MHz | STANDARD SRAM | COMMON | 1000000 | 1.0486 M | SYNCHRONOUS | 3-STATE | PARALLEL | 300 mA | 1.7 V | 700 µA | CMOS | COMMERCIAL | R-PBGA-B153 | Not Qualified | e1 | 70 °C | 153 | PLASTIC/EPOXY | BGA | BGA153,9X17,50 | RECTANGULAR | GRID ARRAY | YES | TIN SILVER COPPER | BALL | 1.27 mm | BOTTOM | SAMSUNG SEMICONDUCTOR INC | BGA, BGA153,9X17,50 | unknown | 3A991.B.2.A | 8542.32.00.41 | |||||||||||||
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K7D323674C-GC40
Samsung Semiconductor
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Check for Price | No | Yes | Obsolete | 37.7487 Mbit | 36 | 1MX36 | 400 MHz | STANDARD SRAM | COMMON | 1000000 | 1.0486 M | SYNCHRONOUS | 3-STATE | PARALLEL | 300 mA | 1.7 V | 700 µA | CMOS | COMMERCIAL | R-PBGA-B153 | Not Qualified | e1 | 70 °C | 153 | PLASTIC/EPOXY | BGA | BGA153,9X17,50 | RECTANGULAR | GRID ARRAY | YES | TIN SILVER COPPER | BALL | 1.27 mm | BOTTOM | SAMSUNG SEMICONDUCTOR INC | BGA, BGA153,9X17,50 | unknown | 3A991.B.2.A | 8542.32.00.41 | |||||||||||||
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K7D323674C-HC330
Samsung Semiconductor
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Check for Price | No | Obsolete | 37.7487 Mbit | 36 | 1MX36 | 2.5 V | 333 MHz | DDR SRAM | PIPELINED ARCHITECTURE | COMMON | 1 | 1000000 | 1.0486 M | SYNCHRONOUS | 3-STATE | PARALLEL | 300 mA | 1.7 V | 600 µA | 2.6 V | 1.7 V | CMOS | COMMERCIAL | R-PBGA-B153 | Not Qualified | e0 | 70 °C | 153 | PLASTIC/EPOXY | BGA | BGA153,9X17,50 | RECTANGULAR | GRID ARRAY | YES | TIN LEAD | BALL | 1.27 mm | BOTTOM | 2.21 mm | 22 mm | 14 mm | SAMSUNG SEMICONDUCTOR INC | BGA, BGA153,9X17,50 | compliant | 3A991.B.2.A | 8542.32.00.41 | BGA | 153 | ||||
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K7D323674C-GC400
Samsung Semiconductor
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Check for Price | Yes | Obsolete | 37.7487 Mbit | 36 | 1MX36 | 2.5 V | 400 MHz | DDR SRAM | PIPELINED ARCHITECTURE | COMMON | 1 | 1000000 | 1.0486 M | SYNCHRONOUS | 3-STATE | PARALLEL | 300 mA | 1.7 V | 700 µA | 2.6 V | 1.7 V | CMOS | COMMERCIAL | R-PBGA-B153 | Not Qualified | e1 | 2 | 70 °C | 153 | PLASTIC/EPOXY | BGA | BGA153,9X17,50 | RECTANGULAR | GRID ARRAY | YES | TIN SILVER COPPER | BALL | 1.27 mm | BOTTOM | 2.21 mm | 22 mm | 14 mm | SAMSUNG SEMICONDUCTOR INC | BGA, BGA153,9X17,50 | compliant | 3A991.B.2.A | 8542.32.00.41 | BGA | 153 | |||
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K7D323674C-HC37
Samsung Semiconductor
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Check for Price | No | No | Obsolete | 37.7487 Mbit | 36 | 1MX36 | 375 MHz | STANDARD SRAM | COMMON | 1000000 | 1.0486 M | SYNCHRONOUS | 3-STATE | PARALLEL | 300 mA | 1.7 V | 650 µA | CMOS | COMMERCIAL | R-PBGA-B153 | Not Qualified | e1 | 3 | 70 °C | 153 | PLASTIC/EPOXY | BGA | BGA153,9X17,50 | RECTANGULAR | GRID ARRAY | YES | TIN SILVER COPPER | BALL | 1.27 mm | BOTTOM | SAMSUNG SEMICONDUCTOR INC | BGA, BGA153,9X17,50 | unknown | 3A991.B.2.A | 8542.32.00.41 | ||||||||||||
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K7D323674C-HC33
Samsung Semiconductor
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Check for Price | No | No | Obsolete | 37.7487 Mbit | 36 | 1MX36 | 333 MHz | STANDARD SRAM | COMMON | 1000000 | 1.0486 M | SYNCHRONOUS | 3-STATE | PARALLEL | 300 mA | 1.7 V | 600 µA | CMOS | COMMERCIAL | R-PBGA-B153 | Not Qualified | e1 | 3 | 70 °C | 153 | PLASTIC/EPOXY | BGA | BGA153,9X17,50 | RECTANGULAR | GRID ARRAY | YES | TIN SILVER COPPER | BALL | 1.27 mm | BOTTOM | SAMSUNG SEMICONDUCTOR INC | BGA, BGA153,9X17,50 | unknown | 3A991.B.2.A | 8542.32.00.41 | ||||||||||||
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K7D323674C-GC370
Samsung Semiconductor
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Check for Price | Yes | Obsolete | 37.7487 Mbit | 36 | 1MX36 | 2.5 V | 375 MHz | DDR SRAM | PIPELINED ARCHITECTURE | COMMON | 1 | 1000000 | 1.0486 M | SYNCHRONOUS | 3-STATE | PARALLEL | 300 mA | 1.7 V | 650 µA | 2.6 V | 1.7 V | CMOS | COMMERCIAL | R-PBGA-B153 | Not Qualified | e1 | 2 | 70 °C | 153 | PLASTIC/EPOXY | BGA | BGA153,9X17,50 | RECTANGULAR | GRID ARRAY | YES | TIN SILVER COPPER | BALL | 1.27 mm | BOTTOM | 2.21 mm | 22 mm | 14 mm | SAMSUNG SEMICONDUCTOR INC | BGA, BGA153,9X17,50 | compliant | 3A991.B.2.A | 8542.32.00.41 | BGA | 153 | |||
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K7D323674C-GC33
Samsung Semiconductor
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Check for Price | Yes | Yes | Obsolete | 37.7487 Mbit | 36 | 1MX36 | 333 MHz | STANDARD SRAM | COMMON | 1000000 | 1.0486 M | SYNCHRONOUS | 3-STATE | PARALLEL | 300 mA | 1.7 V | 600 µA | CMOS | COMMERCIAL | R-PBGA-B153 | Not Qualified | e1 | 3 | 70 °C | 153 | PLASTIC/EPOXY | BGA | BGA153,9X17,50 | RECTANGULAR | GRID ARRAY | YES | TIN SILVER COPPER | BALL | 1.27 mm | BOTTOM | SAMSUNG SEMICONDUCTOR INC | BGA, BGA153,9X17,50 | unknown | 3A991.B.2.A | 8542.32.00.41 | ||||||||||||
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K7D323674C-HC370
Samsung Semiconductor
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Check for Price | No | Obsolete | 37.7487 Mbit | 36 | 1MX36 | 2.5 V | 375 MHz | DDR SRAM | PIPELINED ARCHITECTURE | COMMON | 1 | 1000000 | 1.0486 M | SYNCHRONOUS | 3-STATE | PARALLEL | 300 mA | 1.7 V | 650 µA | 2.6 V | 1.7 V | CMOS | COMMERCIAL | R-PBGA-B153 | Not Qualified | e0 | 70 °C | 153 | PLASTIC/EPOXY | BGA | BGA153,9X17,50 | RECTANGULAR | GRID ARRAY | YES | TIN LEAD | BALL | 1.27 mm | BOTTOM | 2.21 mm | 22 mm | 14 mm | SAMSUNG SEMICONDUCTOR INC | BGA, BGA153,9X17,50 | compliant | 3A991.B.2.A | 8542.32.00.41 | BGA | 153 | ||||
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K7D323674C-GC330
Samsung Semiconductor
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Check for Price | Yes | Obsolete | 37.7487 Mbit | 36 | 1MX36 | 2.5 V | 333 MHz | DDR SRAM | PIPELINED ARCHITECTURE | COMMON | 1 | 1000000 | 1.0486 M | SYNCHRONOUS | 3-STATE | PARALLEL | 300 mA | 1.7 V | 600 µA | 2.6 V | 1.7 V | CMOS | COMMERCIAL | R-PBGA-B153 | Not Qualified | e1 | 2 | 70 °C | 153 | PLASTIC/EPOXY | BGA | BGA153,9X17,50 | RECTANGULAR | GRID ARRAY | YES | TIN SILVER COPPER | BALL | 1.27 mm | BOTTOM | 2.21 mm | 22 mm | 14 mm | SAMSUNG SEMICONDUCTOR INC | BGA, BGA153,9X17,50 | compliant | 3A991.B.2.A | 8542.32.00.41 | BGA | 153 |