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KFN4G16Q2M-DEB80
Samsung Semiconductor
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Check for Price | Yes | Obsolete | 4.295 Gbit | 16 | 64K | 256MX16 | 1.8 V | 76 ns | FLASH | YES | NO | 1 | 4K | 256000000 | 268.4355 M | SYNCHRONOUS | 1K words | PARALLEL | 1.8 V | YES | 50 µA | 35 µA | 1.95 V | 1.7 V | CMOS | COMMERCIAL EXTENDED | YES | SLC NAND TYPE | R-PBGA-B63 | Not Qualified | e1 | 3 | 85 °C | -30 °C | 260 | 63 | PLASTIC/EPOXY | TFBGA | BGA63,10X12,32 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | TIN SILVER COPPER | BALL | 800 µm | BOTTOM | 1.2 mm | 13 mm | 10 mm | SAMSUNG SEMICONDUCTOR INC | BGA | TFBGA, BGA63,10X12,32 | 63 | compliant | EAR99 | 8542.32.00.51 | |||
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KFN4G16Q2M-DEB8
Samsung Semiconductor
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Check for Price | Yes | Active | 4.295 Gbit | 16 | 64K | 256MX16 | 1.8 V | 9 ns | FLASH | YES | NO | 4K | 256000000 | 268.4355 M | 1K words | PARALLEL | YES | 50 µA | 35 µA | CMOS | OTHER | YES | MLC NAND TYPE | R-PBGA-B63 | Not Qualified | 85 °C | -30 °C | 63 | PLASTIC/EPOXY | FBGA | BGA63,10X12,32 | RECTANGULAR | GRID ARRAY, FINE PITCH | YES | BALL | 800 µm | BOTTOM | SAMSUNG SEMICONDUCTOR INC | compliant | EAR99 | 8542.32.00.51 | ||||||||||||||||||
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KFN4G16Q2M-DEB8T
Samsung Semiconductor
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Check for Price | Yes | Yes | Obsolete | 4.295 Gbit | 16 | 64K | 256MX16 | 1.8 V | 9 ns | FLASH | YES | NO | 4K | 256000000 | 268.4355 M | 1K words | PARALLEL | YES | 50 µA | 35 µA | CMOS | OTHER | YES | SLC NAND TYPE | R-PBGA-B63 | Not Qualified | e1 | 3 | 85 °C | -30 °C | 260 | 63 | PLASTIC/EPOXY | FBGA | BGA63,10X12,32 | RECTANGULAR | GRID ARRAY, FINE PITCH | YES | TIN SILVER COPPER | BALL | 800 µm | BOTTOM | SAMSUNG SEMICONDUCTOR INC | FBGA, BGA63,10X12,32 | compliant | EAR99 | 8542.32.00.51 | ||||||||||||
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KFN4G16Q2M-DEB80T
Samsung Semiconductor
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Check for Price | Yes | Obsolete | 4.295 Gbit | 16 | 64K | 256MX16 | 1.8 V | 76 ns | FLASH | YES | NO | 4K | 256000000 | 268.4355 M | 1K words | PARALLEL | YES | 50 µA | 45 µA | CMOS | OTHER | YES | SLC NAND TYPE | R-PBGA-B63 | Not Qualified | 85 °C | -30 °C | 63 | PLASTIC/EPOXY | FBGA | BGA63,10X12,32 | RECTANGULAR | GRID ARRAY, FINE PITCH | YES | BALL | 800 µm | BOTTOM | SAMSUNG SEMICONDUCTOR INC | FBGA, BGA63,10X12,32 | compliant | EAR99 | 8542.32.00.51 |