Parametric results for: KFN4G16Q2M-DEB8 under Flash Memories

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Manufacturer Part Number: kfn4g16q2mdeb8
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KFN4G16Q2M-DEB80
Samsung Semiconductor
Check for Price Yes Obsolete 4.295 Gbit 16 64K 256MX16 1.8 V 76 ns FLASH YES NO 1 4K 256000000 268.4355 M SYNCHRONOUS 1K words PARALLEL 1.8 V YES 50 µA 35 µA 1.95 V 1.7 V CMOS COMMERCIAL EXTENDED YES SLC NAND TYPE R-PBGA-B63 Not Qualified e1 3 85 °C -30 °C 260 63 PLASTIC/EPOXY TFBGA BGA63,10X12,32 RECTANGULAR GRID ARRAY, THIN PROFILE, FINE PITCH YES TIN SILVER COPPER BALL 800 µm BOTTOM 1.2 mm 13 mm 10 mm SAMSUNG SEMICONDUCTOR INC BGA TFBGA, BGA63,10X12,32 63 compliant EAR99 8542.32.00.51
KFN4G16Q2M-DEB8
Samsung Semiconductor
Check for Price Yes Active 4.295 Gbit 16 64K 256MX16 1.8 V 9 ns FLASH YES NO 4K 256000000 268.4355 M 1K words PARALLEL YES 50 µA 35 µA CMOS OTHER YES MLC NAND TYPE R-PBGA-B63 Not Qualified 85 °C -30 °C 63 PLASTIC/EPOXY FBGA BGA63,10X12,32 RECTANGULAR GRID ARRAY, FINE PITCH YES BALL 800 µm BOTTOM SAMSUNG SEMICONDUCTOR INC compliant EAR99 8542.32.00.51
KFN4G16Q2M-DEB8T
Samsung Semiconductor
Check for Price Yes Yes Obsolete 4.295 Gbit 16 64K 256MX16 1.8 V 9 ns FLASH YES NO 4K 256000000 268.4355 M 1K words PARALLEL YES 50 µA 35 µA CMOS OTHER YES SLC NAND TYPE R-PBGA-B63 Not Qualified e1 3 85 °C -30 °C 260 63 PLASTIC/EPOXY FBGA BGA63,10X12,32 RECTANGULAR GRID ARRAY, FINE PITCH YES TIN SILVER COPPER BALL 800 µm BOTTOM SAMSUNG SEMICONDUCTOR INC FBGA, BGA63,10X12,32 compliant EAR99 8542.32.00.51
KFN4G16Q2M-DEB80T
Samsung Semiconductor
Check for Price Yes Obsolete 4.295 Gbit 16 64K 256MX16 1.8 V 76 ns FLASH YES NO 4K 256000000 268.4355 M 1K words PARALLEL YES 50 µA 45 µA CMOS OTHER YES SLC NAND TYPE R-PBGA-B63 Not Qualified 85 °C -30 °C 63 PLASTIC/EPOXY FBGA BGA63,10X12,32 RECTANGULAR GRID ARRAY, FINE PITCH YES BALL 800 µm BOTTOM SAMSUNG SEMICONDUCTOR INC FBGA, BGA63,10X12,32 compliant EAR99 8542.32.00.51