Parametric results for: KM23V4100D under MASK ROMs

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Manufacturer Part Number: km23v4100d
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KM23V4100DG
Samsung Semiconductor
Check for Price No Obsolete 4.1943 Mbit 8 512KX8 3 V 120 ns MASK ROM USER CONFIGURABLE AS 256K X 16; CAN ALSO OPERATE AT 3V TO 3.6V SUPPLY 8 1 512000 524.288 k ASYNCHRONOUS PARALLEL 30 µA 25 µA 3.3 V 2.7 V CMOS COMMERCIAL R-PDSO-G40 Not Qualified e0 70 °C 40 PLASTIC/EPOXY SOP SOP40,.56 RECTANGULAR SMALL OUTLINE YES TIN LEAD GULL WING 1.27 mm DUAL 2.8 mm 25.65 mm 10.67 mm SAMSUNG SEMICONDUCTOR INC SOIC SOP, SOP40,.56 40 unknown EAR99 8542.32.00.71
KM23V4100DET
Samsung Semiconductor
Check for Price No Obsolete 4.1943 Mbit 8 512KX8 3 V 120 ns MASK ROM USER CONFIGURABLE AS 256K X 16; CAN ALSO OPERATE AT 3V TO 3.6V SUPPLY 8 1 512000 524.288 k ASYNCHRONOUS PARALLEL 30 µA 25 µA 3.3 V 2.7 V CMOS OTHER R-PDSO-G44 Not Qualified e0 85 °C -20 °C 44 PLASTIC/EPOXY TSOP2 TSOP44,.46,32 RECTANGULAR SMALL OUTLINE, THIN PROFILE YES TIN LEAD GULL WING 800 µm DUAL 1.2 mm 18.41 mm 10.16 mm SAMSUNG SEMICONDUCTOR INC TSOP2 TSOP2, TSOP44,.46,32 44 unknown EAR99 8542.32.00.71
KM23V4100D
Samsung Semiconductor
Check for Price No Obsolete 4.1943 Mbit 8 512KX8 3 V 120 ns MASK ROM USER CONFIGURABLE AS 256K X 16; CAN ALSO OPERATE AT 3V TO 3.6V SUPPLY 8 1 512000 524.288 k ASYNCHRONOUS PARALLEL 30 µA 25 µA 3.3 V 2.7 V CMOS COMMERCIAL R-PDIP-T40 Not Qualified e0 70 °C 40 PLASTIC/EPOXY DIP DIP40,.6 RECTANGULAR IN-LINE NO TIN LEAD THROUGH-HOLE 2.54 mm DUAL 5.08 mm 52.42 mm 15.24 mm SAMSUNG SEMICONDUCTOR INC DIP DIP, DIP40,.6 40 unknown EAR99 8542.32.00.71
KM23V4100D-12
Samsung Semiconductor
Check for Price No Obsolete 4.1943 Mbit 16 256KX16 3 V 120 ns MASK ROM CONFIGURABLE AS 256K X 16 8 1 256000 262.144 k ASYNCHRONOUS PARALLEL 30 µA 20 µA 3.3 V 2.7 V CMOS COMMERCIAL R-PDIP-T40 Not Qualified e0 70 °C 40 PLASTIC/EPOXY DIP DIP40,.6 RECTANGULAR IN-LINE NO TIN LEAD THROUGH-HOLE 2.54 mm DUAL 5.08 mm 52.42 mm 15.24 mm SAMSUNG SEMICONDUCTOR INC DIP DIP, DIP40,.6 40 unknown EAR99 8542.32.00.71
KM23V4100DT-10
Samsung Semiconductor
Check for Price Obsolete 4.1943 Mbit 16 256KX16 3.3 V 100 ns MASK ROM CONFIGURABLE AS 256K X 16 8 1 256000 262.144 k ASYNCHRONOUS PARALLEL 25 µA 3.6 V 3 V CMOS COMMERCIAL R-PDSO-G44 Not Qualified 70 °C 44 PLASTIC/EPOXY TSOP2 RECTANGULAR SMALL OUTLINE, THIN PROFILE YES GULL WING 800 µm DUAL 1.2 mm 18.41 mm 10.16 mm SAMSUNG SEMICONDUCTOR INC TSOP2 TSOP2, 44 unknown EAR99 8542.32.00.71
KM23V4100DET-10
Samsung Semiconductor
Check for Price Obsolete 4.1943 Mbit 16 256KX16 3.3 V 100 ns MASK ROM CONFIGURABLE AS 256K X 16 8 1 256000 262.144 k ASYNCHRONOUS PARALLEL 25 µA 3.6 V 3 V CMOS OTHER R-PDSO-G44 Not Qualified 85 °C -20 °C 44 PLASTIC/EPOXY TSOP2 RECTANGULAR SMALL OUTLINE, THIN PROFILE YES GULL WING 800 µm DUAL 1.2 mm 18.41 mm 10.16 mm SAMSUNG SEMICONDUCTOR INC TSOP2 TSOP2, 44 unknown EAR99 8542.32.00.71
KM23V4100DG-12
Samsung Semiconductor
Check for Price No Obsolete 4.1943 Mbit 16 256KX16 3 V 120 ns MASK ROM CONFIGURABLE AS 256K X 16 8 1 256000 262.144 k ASYNCHRONOUS PARALLEL 30 µA 20 µA 3.3 V 2.7 V CMOS COMMERCIAL R-PDSO-G40 Not Qualified e0 70 °C 40 PLASTIC/EPOXY SOP SOP40,.56 RECTANGULAR SMALL OUTLINE YES TIN LEAD GULL WING 1.27 mm DUAL 2.8 mm 25.65 mm 10.67 mm SAMSUNG SEMICONDUCTOR INC SOIC 0.525 INCH, SOP-40 40 unknown EAR99 8542.32.00.71
KM23V4100DT
Samsung Semiconductor
Check for Price No Obsolete 4.1943 Mbit 8 512KX8 3 V 120 ns MASK ROM USER CONFIGURABLE AS 256K X 16; CAN ALSO OPERATE AT 3V TO 3.6V SUPPLY 8 1 512000 524.288 k ASYNCHRONOUS PARALLEL 30 µA 25 µA 3.3 V 2.7 V CMOS COMMERCIAL R-PDSO-G40 Not Qualified e0 70 °C 40 PLASTIC/EPOXY TSOP2 TSOP44,.46,32 RECTANGULAR SMALL OUTLINE YES TIN LEAD GULL WING 800 µm DUAL 1.2 mm 18.41 mm 10.16 mm SAMSUNG SEMICONDUCTOR INC TSOP2 TSOP2, TSOP44,.46,32 44 unknown EAR99 8542.32.00.71
KM23V4100D-10
Samsung Semiconductor
Check for Price No Obsolete 4.1943 Mbit 16 256KX16 3.3 V 100 ns MASK ROM CONFIGURABLE AS 256K X 16 8 1 256000 262.144 k ASYNCHRONOUS PARALLEL 30 µA 25 µA 3.6 V 3 V CMOS COMMERCIAL R-PDIP-T40 Not Qualified e0 70 °C 40 PLASTIC/EPOXY DIP DIP40,.6 RECTANGULAR IN-LINE NO TIN LEAD THROUGH-HOLE 2.54 mm DUAL 5.08 mm 52.42 mm 15.24 mm SAMSUNG SEMICONDUCTOR INC DIP DIP, DIP40,.6 40 unknown EAR99 8542.32.00.71
KM23V4100DET-12
Samsung Semiconductor
Check for Price Obsolete 4.1943 Mbit 16 256KX16 3 V 120 ns MASK ROM CONFIGURABLE AS 256K X 16 8 1 256000 262.144 k ASYNCHRONOUS PARALLEL 25 µA 3.3 V 2.7 V CMOS OTHER R-PDSO-G44 Not Qualified 85 °C -20 °C 44 PLASTIC/EPOXY TSOP2 RECTANGULAR SMALL OUTLINE, THIN PROFILE YES GULL WING 800 µm DUAL 1.2 mm 18.41 mm 10.16 mm SAMSUNG SEMICONDUCTOR INC TSOP2 TSOP2, 44 unknown EAR99 8542.32.00.71