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LTC2284CUP#PBF
Linear Technology
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$73.7389 | Yes | Transferred | 3 V | 1 V | 2 | 14 | 105 MHz | YES | ADC, PROPRIETARY METHOD | -500 mV | 1 | OFFSET BINARY, 2'S COMPLEMENT BINARY | SAMPLE | CMOS | COMMERCIAL | PARALLEL, WORD | S-PQCC-N64 | Not Qualified | e3 | 1 | 70 °C | 260 | 30 | 64 | PLASTIC/EPOXY | HVQCCN | LCC64,.35SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Matte Tin (Sn) | NO LEAD | 500 µm | QUAD | 9 mm | 800 µm | 9 mm | LINEAR TECHNOLOGY CORP | QFN | 9 X 9 MM, LEAD FREE, PLASTIC, MO-220WNJR-5, QFN-64 | 64 | UP | compliant | 3A991.C.3 | 8542.39.00.01 | |||||
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LTC2284IUP#PBF
Linear Technology
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$83.0120 | Yes | Transferred | 3 V | 1 V | 2 | 14 | 105 MHz | YES | ADC, PROPRIETARY METHOD | -500 mV | 1 | OFFSET BINARY, 2'S COMPLEMENT BINARY | SAMPLE | CMOS | INDUSTRIAL | PARALLEL, WORD | S-PQCC-N64 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | 30 | 64 | PLASTIC/EPOXY | HVQCCN | LCC64,.35SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Matte Tin (Sn) | NO LEAD | 500 µm | QUAD | 9 mm | 800 µm | 9 mm | LINEAR TECHNOLOGY CORP | QFN | 9 X 9 MM, LEAD FREE, PLASTIC, MO-220WNJR-5, QFN-64 | 64 | UP | compliant | 3A991.C.3 | 8542.39.00.01 | ||||
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LTC2284IUP#PBF
Analog Devices Inc
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$155.0123 | No | Yes | Active | 3 V | 1 V | 2 | 14 | 105 MHz | YES | ADC, PROPRIETARY METHOD | -500 mV | 1 | OFFSET BINARY, 2'S COMPLEMENT BINARY | SAMPLE | CMOS | INDUSTRIAL | PARALLEL, WORD | S-PQCC-N64 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | 30 | 64 | PLASTIC/EPOXY | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Matte Tin (Sn) - annealed | NO LEAD | 500 µm | QUAD | 9 mm | 800 µm | 9 mm | ANALOG DEVICES INC | 9 X 9 MM, LEAD FREE, PLASTIC, MO-220WNJR-5, QFN-64 | 64 | 05-08-1705 | compliant | Analog Devices | ||||||
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LTC2284CUP
Linear Technology
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Check for Price | No | Transferred | 3 V | 1 V | 2 | 14 | 105 MHz | YES | ADC, PROPRIETARY METHOD | -500 mV | 1 | OFFSET BINARY, 2'S COMPLEMENT BINARY | SAMPLE | CMOS | COMMERCIAL | PARALLEL, WORD | S-PQCC-N64 | Not Qualified | e0 | 1 | 70 °C | 64 | PLASTIC/EPOXY | HVQCCN | LCC64,.35SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | TIN LEAD | NO LEAD | 500 µm | QUAD | 9 mm | 800 µm | 9 mm | LINEAR TECHNOLOGY CORP | QFN | HVQCCN, LCC64,.35SQ,20 | 64 | UP | not_compliant | 3A991.C.3 | 8542.39.00.01 | |||||||
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LTC2284IUP
Analog Devices Inc
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Check for Price | No | Obsolete | 3 V | 1 V | 2 | 14 | 105 MHz | YES | ADC, PROPRIETARY METHOD | -500 mV | 1 | OFFSET BINARY, 2'S COMPLEMENT BINARY | SAMPLE | CMOS | INDUSTRIAL | PARALLEL, WORD | S-PQCC-N64 | Not Qualified | e0 | 1 | 85 °C | -40 °C | 64 | PLASTIC/EPOXY | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Tin/Lead (Sn/Pb) | NO LEAD | 500 µm | QUAD | 9 mm | 800 µm | 9 mm | ANALOG DEVICES INC | 9 X 9 MM, PLASTIC, MO-220WNJR-5, QFN-64 | not_compliant | 3A991.C.3 | 8542.39.00.01 | ||||||||||
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LTC2284IUP#TR
Linear Technology
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Check for Price | No | Transferred | 3 V | 1 V | 2 | 14 | 105 MHz | YES | ADC, PROPRIETARY METHOD | -500 mV | 1 | OFFSET BINARY, 2'S COMPLEMENT BINARY | SAMPLE | CMOS | INDUSTRIAL | PARALLEL, WORD | S-PQCC-N64 | Not Qualified | e0 | 1 | 85 °C | -40 °C | 64 | PLASTIC/EPOXY | HVQCCN | LCC64,.35SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | TIN LEAD | NO LEAD | 500 µm | QUAD | 9 mm | 800 µm | 9 mm | LINEAR TECHNOLOGY CORP | QFN | HVQCCN, LCC64,.35SQ,20 | 64 | UP | not_compliant | 3A991.C.3 | 8542.39.00.01 | ||||||
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LTC2284CUP
Analog Devices Inc
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Check for Price | No | Obsolete | 3 V | 1 V | 2 | 14 | 105 MHz | YES | ADC, PROPRIETARY METHOD | -500 mV | 1 | OFFSET BINARY, 2'S COMPLEMENT BINARY | SAMPLE | CMOS | COMMERCIAL | PARALLEL, WORD | S-PQCC-N64 | Not Qualified | e0 | 1 | 70 °C | 64 | PLASTIC/EPOXY | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Tin/Lead (Sn/Pb) | NO LEAD | 500 µm | QUAD | 9 mm | 800 µm | 9 mm | ANALOG DEVICES INC | 9 X 9 MM, PLASTIC, MO-220WNJR-5, QFN-64 | not_compliant | 3A991.C.3 | 8542.39.00.01 | |||||||||||
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LTC2284IUP#TR
Analog Devices Inc
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Check for Price | No | Obsolete | 3 V | 1 V | 2 | 14 | 105 MHz | YES | ADC, PROPRIETARY METHOD | -500 mV | 1 | OFFSET BINARY, 2'S COMPLEMENT BINARY | SAMPLE | CMOS | INDUSTRIAL | PARALLEL, WORD | S-PQCC-N64 | Not Qualified | e0 | 1 | 85 °C | -40 °C | 64 | PLASTIC/EPOXY | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Tin/Lead (Sn/Pb) | NO LEAD | 500 µm | QUAD | 9 mm | 800 µm | 9 mm | ANALOG DEVICES INC | 9 X 9 MM, PLASTIC, MO-220WNJR-5, QFN-64 | not_compliant | 3A991.C.3 | 8542.39.00.01 | ||||||||||
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LTC2284CUP#TR
Linear Technology
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Check for Price | No | Transferred | 3 V | 1 V | 2 | 14 | 105 MHz | YES | ADC, PROPRIETARY METHOD | -500 mV | 1 | OFFSET BINARY, 2'S COMPLEMENT BINARY | SAMPLE | CMOS | COMMERCIAL | PARALLEL, WORD | S-PQCC-N64 | Not Qualified | e0 | 1 | 70 °C | 64 | PLASTIC/EPOXY | HVQCCN | LCC64,.35SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | TIN LEAD | NO LEAD | 500 µm | QUAD | 9 mm | 800 µm | 9 mm | LINEAR TECHNOLOGY CORP | QFN | HVQCCN, LCC64,.35SQ,20 | 64 | UP | not_compliant | 3A991.C.3 | 8542.39.00.01 | |||||||
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LTC2284IUP#TRPBF
Analog Devices Inc
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Check for Price | No | Yes | Active | 3 V | 1 V | 2 | 14 | 105 MHz | YES | ADC, PROPRIETARY METHOD | -500 mV | 1 | OFFSET BINARY, 2'S COMPLEMENT BINARY | SAMPLE | CMOS | INDUSTRIAL | PARALLEL, WORD | S-PQCC-N64 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | 30 | 64 | PLASTIC/EPOXY | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Matte Tin (Sn) - annealed | NO LEAD | 500 µm | QUAD | 9 mm | 800 µm | 9 mm | ANALOG DEVICES INC | 9 X 9 MM, LEAD FREE, PLASTIC, MO-220WNJR-5, QFN-64 | 64 | 05-08-1705 | compliant |