Parametric results for: M27C2 under OTP ROMs

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Manufacturer Part Number: m27c2
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M27C256B-10C6
STMicroelectronics
$1.1079 Yes Obsolete 262.144 kbit 8 32KX8 5 V 100 ns OTP ROM 12.75V PROGRAMMING VOLTAGE COMMON 1 32000 32.768 k ASYNCHRONOUS 3-STATE PARALLEL 12.75 V 100 µA 30 µA 5.5 V 4.5 V CMOS INDUSTRIAL R-PQCC-J32 Not Qualified e3 85 °C -40 °C 32 PLASTIC/EPOXY QCCJ LDCC32,.5X.6 RECTANGULAR CHIP CARRIER YES MATTE TIN J BEND 1.27 mm QUAD 3.56 mm 13.97 mm 11.43 mm STMICROELECTRONICS QFJ QCCJ, LDCC32,.5X.6 32 compliant EAR99 8542.32.00.71 STMicroelectronics
M27C256B-90F6
STMicroelectronics
$3.3856 Yes Obsolete 262.144 kbit 8 32KX8 5 V 90 ns UVPROM COMMON 1 32000 32.768 k ASYNCHRONOUS 3-STATE PARALLEL 12.75 V 100 µA 30 µA 5.5 V 4.5 V CMOS INDUSTRIAL R-CDIP-T28 Not Qualified e3 85 °C -40 °C 28 CERAMIC, METAL-SEALED COFIRED WDIP DIP28,.6 RECTANGULAR IN-LINE, WINDOW NO MATTE TIN THROUGH-HOLE 2.54 mm DUAL 5.72 mm 36.92 mm 15.24 mm STMICROELECTRONICS DIP 0.280 INCH, LEAD FREE, CERAMIC, WINDOWED, FRIT SEALED, DIP-28 28 unknown EAR99 8542.32.00.61 STMicroelectronics
M27C256B-12F6
STMicroelectronics
$3.3856 Yes Obsolete 262.144 kbit 8 32KX8 5 V 120 ns UVPROM COMMON 1 32000 32.768 k ASYNCHRONOUS 3-STATE PARALLEL 12.75 V 100 µA 30 µA 5.5 V 4.5 V CMOS INDUSTRIAL R-CDIP-T28 Not Qualified e3 85 °C -40 °C 28 CERAMIC, METAL-SEALED COFIRED WDIP DIP28,.6 RECTANGULAR IN-LINE, WINDOW NO MATTE TIN THROUGH-HOLE 2.54 mm DUAL 5.72 mm 36.92 mm 15.24 mm STMICROELECTRONICS DIP 0.280 INCH, LEAD FREE, CERAMIC, WINDOWED, FRIT SEALED, DIP-28 28 unknown EAR99 8542.32.00.61 STMicroelectronics
M27C256B-12F1
STMicroelectronics
$3.3856 Yes Obsolete 262.144 kbit 8 32KX8 5 V 120 ns UVPROM COMMON 1 32000 32.768 k ASYNCHRONOUS 3-STATE PARALLEL 12.75 V 100 µA 30 µA 5.5 V 4.5 V CMOS COMMERCIAL R-CDIP-T28 Not Qualified e3 70 °C 28 CERAMIC, METAL-SEALED COFIRED WDIP DIP28,.6 RECTANGULAR IN-LINE, WINDOW NO MATTE TIN THROUGH-HOLE 2.54 mm DUAL 5.72 mm 36.92 mm 15.24 mm STMICROELECTRONICS DIP 0.280 INCH, LEAD FREE, CERAMIC, WINDOWED, FRIT SEALED, DIP-28 28 unknown EAR99 8542.32.00.61 STMicroelectronics
M27C2001-10F1
STMicroelectronics
$3.3856 Yes Obsolete 2.0972 Mbit 8 256KX8 5 V 100 ns UVPROM COMMON 1 256000 262.144 k ASYNCHRONOUS 3-STATE PARALLEL 100 µA 30 µA 5.5 V 4.5 V CMOS COMMERCIAL R-CDIP-T32 Not Qualified e3 70 °C 245 10 32 CERAMIC, METAL-SEALED COFIRED WDIP DIP32,.6 RECTANGULAR IN-LINE, WINDOW NO Matte Tin (Sn) THROUGH-HOLE 2.54 mm DUAL 5.72 mm 41.885 mm 15.24 mm STMICROELECTRONICS DIP LEAD FREE, WINDOWED, FRIT SEALED, CERAMIC, DIP-32 32 unknown EAR99 8542.32.00.61 STMicroelectronics
M27C2001-12F1
STMicroelectronics
$3.4000 Yes Obsolete 2.0972 Mbit 8 256KX8 5 V 120 ns UVPROM COMMON 1 256000 262.144 k ASYNCHRONOUS 3-STATE PARALLEL 100 µA 30 µA 5.5 V 4.5 V CMOS COMMERCIAL R-CDIP-T32 Not Qualified e3 70 °C 245 32 CERAMIC, METAL-SEALED COFIRED WDIP DIP32,.6 RECTANGULAR IN-LINE, WINDOW NO MATTE TIN THROUGH-HOLE 2.54 mm DUAL 5.72 mm 41.885 mm 15.24 mm STMICROELECTRONICS DIP LEAD FREE, WINDOWED, FRIT SEALED, CERAMIC, DIP-32 32 unknown EAR99 8542.32.00.61 STMicroelectronics
NM27C256VE150
Rochester Electronics LLC
Check for Price Contact Manufacturer 262.144 kbit 8 32KX8 5 V 150 ns OTP ROM 1 32000 32.768 k ASYNCHRONOUS PARALLEL 5.5 V 4.5 V CMOS INDUSTRIAL R-PQCC-J32 e0 85 °C -40 °C 32 PLASTIC/EPOXY QCCJ RECTANGULAR CHIP CARRIER YES TIN LEAD J BEND 1.27 mm QUAD 3.56 mm 13.995 mm 11.455 mm ROCHESTER ELECTRONICS LLC QCCJ, unknown EAR99 8542.32.00.71
AM27C256-55PC
AMD
Check for Price No Obsolete 262.144 kbit 8 32KX8 5 V 55 ns OTP ROM COMMON 1 32000 32.768 k ASYNCHRONOUS 3-STATE PARALLEL 12.75 V 100 µA 25 µA 5.5 V 4.5 V CMOS COMMERCIAL R-PDIP-T28 Not Qualified e0 70 °C 28 PLASTIC/EPOXY DIP DIP28,.6 RECTANGULAR IN-LINE NO TIN LEAD THROUGH-HOLE 2.54 mm DUAL 5.715 mm 37.084 mm 15.24 mm ADVANCED MICRO DEVICES INC DIP PLASTIC, DIP-28 28 unknown EAR99 8542.32.00.71
M27C202-90K3
STMicroelectronics
Check for Price Yes Obsolete 2.0972 Mbit 16 128KX16 5 V 90 ns OTP ROM COMMON 1 128000 131.072 k ASYNCHRONOUS 3-STATE PARALLEL 100 µA 50 µA 5.5 V 4.5 V CMOS AUTOMOTIVE S-PQCC-J44 Not Qualified e3 125 °C -40 °C 44 PLASTIC/EPOXY QCCJ LDCC44,.7SQ SQUARE CHIP CARRIER YES MATTE TIN J BEND 1.27 mm QUAD 4.7 mm 16.5862 mm 16.5862 mm STMICROELECTRONICS LCC QCCJ, LDCC44,.7SQ 44 compliant EAR99 8542.32.00.71
M27C2001-25N6TR
STMicroelectronics
Check for Price Yes Obsolete 2.0972 Mbit 8 256KX8 5 V 250 ns OTP ROM COMMON 1 256000 262.144 k ASYNCHRONOUS 3-STATE PARALLEL 100 µA 30 µA 5.5 V 4.5 V CMOS INDUSTRIAL R-PDSO-G32 Not Qualified e3 85 °C -40 °C 32 PLASTIC/EPOXY TSOP1 TSSOP32,.8,20 RECTANGULAR SMALL OUTLINE, THIN PROFILE YES TIN GULL WING 500 µm DUAL 1.2 mm 18.4 mm 8 mm STMICROELECTRONICS TSOP 8 X 20 MM, LEAD FREE, PLASTIC, TSOP-32 32 compliant EAR99 8542.32.00.71