Parametric results for: M27C256B-25XC6 under OTP ROMs

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Manufacturer Part Number: m27c256b25xc6
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M27C256B-25XC6
STMicroelectronics
Check for Price Yes Obsolete 262.144 kbit 8 32KX8 5 V 150 ns OTP ROM COMMON 1 32000 32.768 k ASYNCHRONOUS 3-STATE PARALLEL 12.75 V 100 µA 30 µA 5.25 V 4.75 V CMOS INDUSTRIAL R-PQCC-J32 Not Qualified e3 85 °C -40 °C 32 PLASTIC/EPOXY QCCJ LDCC32,.5X.6 RECTANGULAR CHIP CARRIER YES MATTE TIN J BEND 1.27 mm QUAD 3.56 mm 13.97 mm 11.43 mm STMICROELECTRONICS QFJ LEAD FREE, PLASTIC, LCC-32 32 compliant EAR99 8542.32.00.71
M27C256B-25XC6TR
STMicroelectronics
Check for Price Yes Obsolete 262.144 kbit 8 32KX8 5 V 150 ns OTP ROM COMMON 1 32000 32.768 k ASYNCHRONOUS 3-STATE PARALLEL 12.75 V 100 µA 30 µA 5.25 V 4.75 V CMOS INDUSTRIAL R-PQCC-J32 Not Qualified e3 85 °C -40 °C 32 PLASTIC/EPOXY QCCJ LDCC32,.5X.6 RECTANGULAR CHIP CARRIER YES MATTE TIN J BEND 1.27 mm QUAD 3.56 mm 13.97 mm 11.43 mm STMICROELECTRONICS QFJ LEAD FREE, PLASTIC, LCC-32 32 compliant EAR99 8542.32.00.71
M27C256B-25XC6X
STMicroelectronics
Check for Price Yes Obsolete 262.144 kbit 8 32KX8 5 V 150 ns OTP ROM COMMON 1 32000 32.768 k ASYNCHRONOUS 3-STATE PARALLEL 12.75 V 100 µA 30 µA 5.25 V 4.75 V CMOS INDUSTRIAL R-PQCC-J32 Not Qualified e3 85 °C -40 °C 32 PLASTIC/EPOXY QCCJ LDCC32,.5X.6 RECTANGULAR CHIP CARRIER YES MATTE TIN J BEND 1.27 mm QUAD 3.56 mm 13.995 mm 11.455 mm STMICROELECTRONICS QFJ PLASTIC, LCC-32 32 compliant EAR99 8542.32.00.71