Parametric results for: M27C516 under OTP ROMs

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Manufacturer Part Number: m27c516
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M27C516-70N6
STMicroelectronics
Check for Price No Obsolete 524.288 kbit 16 32KX16 5 V 70 ns OTP ROM COMMON 1 32000 32.768 k ASYNCHRONOUS 3-STATE PARALLEL 100 µA 30 µA 5.5 V 4.5 V CMOS INDUSTRIAL R-PDSO-G40 Not Qualified e0 85 °C -40 °C 40 PLASTIC/EPOXY TSOP1 TSSOP40,.56,20 RECTANGULAR SMALL OUTLINE, THIN PROFILE YES TIN LEAD GULL WING 500 µm DUAL 1.2 mm 12.4 mm 10 mm STMICROELECTRONICS TSOP 10 X 14 MM, PLASTIC, TSOP-40 40 not_compliant EAR99 8542.32.00.71
M27C516-85XC6
STMicroelectronics
Check for Price No Obsolete 524.288 kbit 16 32KX16 5 V 85 ns OTP ROM COMMON 1 32000 32.768 k ASYNCHRONOUS 3-STATE PARALLEL 100 µA 30 µA 5.25 V 4.75 V CMOS INDUSTRIAL S-PQCC-J44 Not Qualified e0 85 °C -40 °C 44 PLASTIC/EPOXY QCCJ LDCC44,.7SQ SQUARE CHIP CARRIER YES TIN LEAD J BEND 1.27 mm QUAD 4.7 mm 16.5862 mm 16.5862 mm STMICROELECTRONICS LCC PLASTIC, LCC-44 44 not_compliant EAR99 8542.32.00.71
M27C516-15XC1
STMicroelectronics
Check for Price No No Obsolete 524.288 kbit 16 32KX16 5 V 150 ns OTP ROM COMMON 1 32000 32.768 k ASYNCHRONOUS 3-STATE PARALLEL 100 µA 30 µA 5.25 V 4.75 V CMOS COMMERCIAL S-PQCC-J44 Not Qualified e0 70 °C 44 PLASTIC/EPOXY QCCJ LDCC44,.7SQ SQUARE CHIP CARRIER YES TIN LEAD J BEND 1.27 mm QUAD 4.57 mm 16.5862 mm 16.5862 mm STMICROELECTRONICS LCC PLASTIC, LCC-44 44 not_compliant EAR99 8542.32.00.71
M27C516-12XN1
STMicroelectronics
Check for Price No Obsolete 524.288 kbit 16 32KX16 5 V 120 ns COMMON 32000 32.768 k 3-STATE 100 µA 30 µA CMOS COMMERCIAL R-PDSO-G40 Not Qualified e0 70 °C 40 PLASTIC/EPOXY TSSOP TSSOP40,.56,20 RECTANGULAR SMALL OUTLINE, THIN PROFILE, SHRINK PITCH YES Tin/Lead (Sn/Pb) GULL WING 500 µm DUAL STMICROELECTRONICS not_compliant EAR99 8542.32.00.71
M27C516-45XC1
STMicroelectronics
Check for Price No Obsolete 524.288 kbit 16 32KX16 5 V 45 ns OTP ROM COMMON 1 32000 32.768 k ASYNCHRONOUS 3-STATE PARALLEL 100 µA 30 µA 5.25 V 4.75 V CMOS COMMERCIAL S-PQCC-J44 Not Qualified e0 70 °C 44 PLASTIC/EPOXY QCCJ LDCC44,.7SQ SQUARE CHIP CARRIER YES TIN LEAD J BEND 1.27 mm QUAD 4.7 mm 16.5862 mm 16.5862 mm STMICROELECTRONICS LCC PLASTIC, LCC-44 44 not_compliant EAR99 8542.32.00.71
M27C516-10N1TR
STMicroelectronics
Check for Price No Obsolete 524.288 kbit 16 32KX16 5 V 85 ns OTP ROM COMMON 1 32000 32.768 k ASYNCHRONOUS 3-STATE PARALLEL 100 µA 30 µA 5.5 V 4.5 V CMOS COMMERCIAL R-PDSO-G40 Not Qualified e0 70 °C 40 PLASTIC/EPOXY TSOP TSSOP40,.56,20 RECTANGULAR SMALL OUTLINE, THIN PROFILE, SHRINK PITCH YES TIN LEAD GULL WING 500 µm DUAL 1.2 mm 12.4 mm 10 mm STMICROELECTRONICS TSOP 10 X 14 MM, PLASTIC, TSOP-40 40 not_compliant EAR99 8542.32.00.71
M27C516-20C1
STMicroelectronics
Check for Price No No Obsolete 524.288 kbit 16 32KX16 5 V 200 ns OTP ROM COMMON 1 32000 32.768 k ASYNCHRONOUS 3-STATE PARALLEL 100 µA 30 µA 5.5 V 4.5 V CMOS COMMERCIAL S-PQCC-J44 Not Qualified e0 70 °C 44 PLASTIC/EPOXY QCCJ LDCC44,.7SQ SQUARE CHIP CARRIER YES TIN LEAD J BEND 1.27 mm QUAD 4.57 mm 16.5862 mm 16.5862 mm STMICROELECTRONICS LCC PLASTIC, LCC-44 44 not_compliant EAR99 8542.32.00.71
M27C516-55XN6
STMicroelectronics
Check for Price No Obsolete 524.288 kbit 16 32KX16 5 V 55 ns OTP ROM COMMON 1 32000 32.768 k ASYNCHRONOUS 3-STATE PARALLEL 100 µA 30 µA 5.25 V 4.75 V CMOS INDUSTRIAL R-PDSO-G40 Not Qualified e0 85 °C -40 °C 40 PLASTIC/EPOXY TSOP1 TSSOP40,.56,20 RECTANGULAR SMALL OUTLINE, THIN PROFILE YES TIN LEAD GULL WING 500 µm DUAL 1.2 mm 12.4 mm 10 mm STMICROELECTRONICS TSOP 10 X 14 MM, PLASTIC, TSOP-40 40 not_compliant EAR99 8542.32.00.71
M27C516-90XN6
STMicroelectronics
Check for Price No Obsolete 524.288 kbit 16 32KX16 5 V 90 ns COMMON 32000 32.768 k 3-STATE 100 µA 30 µA CMOS INDUSTRIAL R-PDSO-G40 Not Qualified e0 85 °C -40 °C 40 PLASTIC/EPOXY TSSOP TSSOP40,.56,20 RECTANGULAR SMALL OUTLINE, THIN PROFILE, SHRINK PITCH YES Tin/Lead (Sn/Pb) GULL WING 500 µm DUAL STMICROELECTRONICS not_compliant EAR99 8542.32.00.71
M27C516-10F1
STMicroelectronics
Check for Price No No Obsolete 524.288 kbit 16 32KX16 5 V 100 ns UVPROM COMMON 1 32000 32.768 k ASYNCHRONOUS 3-STATE PARALLEL 200 µA 30 µA 5.5 V 4.5 V CMOS COMMERCIAL R-GDIP-T40 Not Qualified e0 70 °C 40 CERAMIC, GLASS-SEALED WDIP DIP40,.6 RECTANGULAR IN-LINE, WINDOW NO TIN LEAD THROUGH-HOLE 2.54 mm DUAL 5.71 mm 15.24 mm STMICROELECTRONICS DIP FRIT SEALED, WINDOWED, CERAMIC, DIP-40 40 not_compliant EAR99 8542.32.00.61