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M27V256-200K6
STMicroelectronics
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Check for Price | No | Obsolete | 262.144 kbit | 8 | 32KX8 | 3.3 V | 200 ns | OTP ROM | COMMON | 1 | 32000 | 32.768 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 12.75 V | 10 µA | 10 µA | 3.6 V | 3 V | CMOS | INDUSTRIAL | R-PQCC-J32 | Not Qualified | e0 | 85 °C | -40 °C | 32 | PLASTIC/EPOXY | QCCJ | LDCC32,.5X.6 | RECTANGULAR | CHIP CARRIER | YES | TIN LEAD | J BEND | 1.27 mm | QUAD | 3.56 mm | 13.97 mm | 11.43 mm | STMICROELECTRONICS | QFJ | PLASTIC, LCC-32 | 32 | not_compliant | EAR99 | 8542.32.00.71 | |||
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M27V256-200F6
STMicroelectronics
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Check for Price | No | Obsolete | 262.144 kbit | 8 | 32KX8 | 3.3 V | 200 ns | UVPROM | COMMON | 1 | 32000 | 32.768 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 12.75 V | 10 µA | 10 µA | 3.6 V | 3 V | CMOS | INDUSTRIAL | R-GDIP-T28 | Not Qualified | e0 | 85 °C | -40 °C | 28 | CERAMIC, GLASS-SEALED | WDIP | DIP28,.6 | RECTANGULAR | IN-LINE, WINDOW | NO | TIN LEAD | THROUGH-HOLE | 2.54 mm | DUAL | 5.97 mm | 36.92 mm | 15.24 mm | STMICROELECTRONICS | DIP | FRIT SEALED, WINDOWED, CERAMIC, DIP-28 | 28 | not_compliant | EAR99 | 8542.32.00.61 | |||
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M27V256-100F6TR
STMicroelectronics
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Check for Price | Obsolete | 262.144 kbit | 8 | 32KX8 | 3.3 V | 100 ns | UVPROM | 1 | 32000 | 32.768 k | ASYNCHRONOUS | PARALLEL | 10 µA | 3.6 V | 3 V | CMOS | INDUSTRIAL | R-CDIP-T28 | Not Qualified | 85 °C | -40 °C | 28 | CERAMIC, METAL-SEALED COFIRED | WDIP | RECTANGULAR | IN-LINE, WINDOW | NO | THROUGH-HOLE | 2.54 mm | DUAL | 5.72 mm | 36.5 mm | 16 mm | STMICROELECTRONICS | DIP | WDIP, | 28 | unknown | EAR99 | 8542.32.00.61 | |||||||||||
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M27V256-100N1TR
STMicroelectronics
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Check for Price | No | No | Obsolete | 262.144 kbit | 8 | 32KX8 | 3.3 V | 100 ns | OTP ROM | COMMON | 1 | 32000 | 32.768 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 3.3 V | 10 µA | 10 µA | 3.6 V | 3 V | CMOS | COMMERCIAL | R-PDSO-G28 | Not Qualified | e0 | 70 °C | 28 | PLASTIC/EPOXY | LSSOP | TSSOP28,.53,22 | RECTANGULAR | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | YES | TIN LEAD | GULL WING | 550 µm | DUAL | 1.25 mm | 11.8 mm | 8 mm | STMICROELECTRONICS | TSOP | 8 X 13.40 MM, PLASTIC, TSOP-28 | 28 | not_compliant | EAR99 | 8542.32.00.71 | |||
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M27V256-200K1TR
STMicroelectronics
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Check for Price | No | Obsolete | 262.144 kbit | 8 | 32KX8 | 3.3 V | 200 ns | OTP ROM | COMMON | 1 | 32000 | 32.768 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 3.3 V | 10 µA | 10 µA | 3.6 V | 3 V | CMOS | COMMERCIAL | R-PQCC-J32 | Not Qualified | e0 | 70 °C | 32 | PLASTIC/EPOXY | QCCJ | LDCC32,.5X.6 | RECTANGULAR | CHIP CARRIER | YES | TIN LEAD | J BEND | 1.27 mm | QUAD | 3.56 mm | 13.97 mm | 11.43 mm | STMICROELECTRONICS | QFJ | PLASTIC, LCC-32 | 32 | not_compliant | EAR99 | 8542.32.00.71 | ||||
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M27V256-200N6TR
STMicroelectronics
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Check for Price | No | No | Obsolete | 262.144 kbit | 8 | 32KX8 | 3.3 V | 200 ns | OTP ROM | COMMON | 1 | 32000 | 32.768 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 3.3 V | 10 µA | 10 µA | 3.6 V | 3 V | CMOS | INDUSTRIAL | R-PDSO-G28 | Not Qualified | e0 | 85 °C | -40 °C | 28 | PLASTIC/EPOXY | LSSOP | TSSOP28,.53,22 | RECTANGULAR | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | YES | TIN LEAD | GULL WING | 550 µm | DUAL | 1.25 mm | 11.8 mm | 8 mm | STMICROELECTRONICS | TSOP | 8 X 13.40 MM, PLASTIC, TSOP-28 | 28 | not_compliant | EAR99 | 8542.32.00.71 | ||
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M27V256-90F1TR
STMicroelectronics
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Check for Price | Obsolete | 262.144 kbit | 8 | 32KX8 | 3.3 V | 90 ns | UVPROM | 1 | 32000 | 32.768 k | ASYNCHRONOUS | PARALLEL | 10 µA | 3.6 V | 3 V | CMOS | COMMERCIAL | R-CDIP-T28 | Not Qualified | 70 °C | 28 | CERAMIC, METAL-SEALED COFIRED | WDIP | RECTANGULAR | IN-LINE, WINDOW | NO | THROUGH-HOLE | 2.54 mm | DUAL | 5.72 mm | 36.5 mm | 16 mm | STMICROELECTRONICS | DIP | WDIP, | 28 | unknown | EAR99 | 8542.32.00.61 | ||||||||||||
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M27V256-90K6
STMicroelectronics
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Check for Price | No | Obsolete | 262.144 kbit | 8 | 32KX8 | 3.3 V | 90 ns | OTP ROM | COMMON | 1 | 32000 | 32.768 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 12.75 V | 10 µA | 10 µA | 3.6 V | 3 V | CMOS | INDUSTRIAL | R-PQCC-J32 | Not Qualified | e0 | 85 °C | -40 °C | 32 | PLASTIC/EPOXY | QCCJ | LDCC32,.5X.6 | RECTANGULAR | CHIP CARRIER | YES | TIN LEAD | J BEND | 1.27 mm | QUAD | 3.56 mm | 13.97 mm | 11.43 mm | STMICROELECTRONICS | QFJ | PLASTIC, LCC-32 | 32 | not_compliant | EAR99 | 8542.32.00.71 | |||
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M27V256-120N6
STMicroelectronics
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Check for Price | No | No | Obsolete | 262.144 kbit | 8 | 32KX8 | 3.3 V | 120 ns | OTP ROM | COMMON | 1 | 32000 | 32.768 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 12.75 V | 10 µA | 10 µA | 3.6 V | 3 V | CMOS | INDUSTRIAL | R-PDSO-G28 | Not Qualified | e0 | 85 °C | -40 °C | 28 | PLASTIC/EPOXY | LSSOP | TSSOP28,.53,22 | RECTANGULAR | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | YES | TIN LEAD | GULL WING | 550 µm | DUAL | 1.25 mm | 11.8 mm | 8 mm | STMICROELECTRONICS | TSOP | 8 X 13.40 MM, PLASTIC, TSOP-28 | 28 | not_compliant | EAR99 | 8542.32.00.71 | ||
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M27V256-200N1
STMicroelectronics
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Check for Price | No | No | Obsolete | 262.144 kbit | 8 | 32KX8 | 3.3 V | 200 ns | OTP ROM | COMMON | 1 | 32000 | 32.768 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 12.75 V | 10 µA | 10 µA | 3.6 V | 3 V | CMOS | COMMERCIAL | R-PDSO-G28 | Not Qualified | e0 | 70 °C | 28 | PLASTIC/EPOXY | LSSOP | TSSOP28,.53,22 | RECTANGULAR | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | YES | TIN LEAD | GULL WING | 550 µm | DUAL | 1.25 mm | 11.8 mm | 8 mm | STMICROELECTRONICS | TSOP | 8 X 13.40 MM, PLASTIC, TSOP-28 | 28 | not_compliant | EAR99 | 8542.32.00.71 |