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MAX1124EGK+D
Maxim Integrated Products
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$70.8398 | Yes | Yes | Transferred | 1.8 V | 1.375 V | 1 | 0.2344 % | 10 | 250 MHz | YES | ADC, PROPRIETARY METHOD | 1.1 V | 1 | BINARY, OFFSET BINARY, 2'S COMPLEMENT BINARY | TRACK | INDUSTRIAL | PARALLEL, WORD | S-XQCC-N68 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 260 | 30 | 68 | UNSPECIFIED | HVQCCN | LCC68,.4SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | MATTE TIN | NO LEAD | 500 µm | QUAD | 10 mm | 900 µm | 10 mm | MAXIM INTEGRATED PRODUCTS INC | QFN | 10 X 10 MM, 0.90 MM HEIGHT, ROHS COMPLIANT, MO-220, QFN-68 | 68 | compliant | 3A991.C.1 | 8542.39.00.01 | |||||
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MAX1124EGK
Maxim Integrated Products
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Check for Price | No | Obsolete | 1.8 V | 1.375 V | 1 | 0.2344 % | 10 | 250 MHz | YES | ADC, PROPRIETARY METHOD | 1.1 V | 1 | BINARY, OFFSET BINARY, 2'S COMPLEMENT BINARY | TRACK | INDUSTRIAL | PARALLEL, WORD | S-XQCC-N68 | Not Qualified | e0 | 85 °C | -40 °C | 68 | UNSPECIFIED | HVQCCN | LCC68,.4SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Tin/Lead (Sn/Pb) | NO LEAD | 500 µm | QUAD | 10 mm | 900 µm | 10 mm | MAXIM INTEGRATED PRODUCTS INC | QFN | 10 X 10 MM, 0.90 MM HEIGHT, MO-220, QFN-68 | 68 | not_compliant | 3A991.C.1 | 8542.39.00.01 | |||||||||
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MAX1124EGK+D
Analog Devices Inc
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Check for Price | Yes | Active | 1.8 V | 1.375 V | 1 | 0.2344 % | 10 | 250 MHz | YES | ADC, PROPRIETARY METHOD | 1.1 V | 1 | BINARY, OFFSET BINARY, 2'S COMPLEMENT BINARY | TRACK | INDUSTRIAL | PARALLEL, WORD | S-XQCC-N68 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 260 | 30 | 68 | UNSPECIFIED | HVQCCN | LCC68,.4SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Matte Tin (Sn) | NO LEAD | 500 µm | QUAD | 10 mm | 900 µm | 10 mm | ANALOG DEVICES INC | 68-LFCSP-10X10X0.85 | 10 X 10 MM, 0.90 MM HEIGHT, ROHS COMPLIANT, MO-220, QFN-68 | 68 | compliant | 68-LFCSP-10X10X0.85 | 2003-11-10 | Analog Devices | |||||
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MAX1124EGK-D
Maxim Integrated Products
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Check for Price | No | Obsolete | 1.8 V | 1.375 V | 1 | 0.2344 % | 10 | 250 MHz | YES | ADC, PROPRIETARY METHOD | 1.1 V | 1 | BINARY, OFFSET BINARY, 2'S COMPLEMENT BINARY | TRACK | INDUSTRIAL | PARALLEL, WORD | S-XQCC-N68 | Not Qualified | e0 | 1 | 85 °C | -40 °C | 68 | UNSPECIFIED | HVQCCN | LCC68,.4SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | TIN LEAD | NO LEAD | 500 µm | QUAD | 10 mm | 900 µm | 10 mm | MAXIM INTEGRATED PRODUCTS INC | QFN | 10 X 10 MM, 0.90 MM HEIGHT, MO-220, QFN-68 | 68 | not_compliant | 3A991.C.1 | 8542.39.00.01 | ||||||||
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MAX1124EGK+TD
Maxim Integrated Products
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Check for Price | Yes | Yes | Transferred | 1.8 V | 1.375 V | 1 | 0.2344 % | 10 | 250 MHz | YES | ADC, PROPRIETARY METHOD | 1.1 V | 1 | BINARY, OFFSET BINARY, 2'S COMPLEMENT BINARY | TRACK | INDUSTRIAL | PARALLEL, WORD | S-XQCC-N68 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 68 | UNSPECIFIED | HVQCCN | LCC68,.4SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | MATTE TIN | NO LEAD | 500 µm | QUAD | 10 mm | 900 µm | 10 mm | MAXIM INTEGRATED PRODUCTS INC | QFN | HVQCCN, LCC68,.4SQ,20 | 68 | compliant | 3A991.C.1 | 8542.39.00.01 | |||||||
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MAX1124EGK-TD
Maxim Integrated Products
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Check for Price | No | Obsolete | 1.8 V | 1.375 V | 1 | 0.2344 % | 10 | 250 MHz | YES | ADC, PROPRIETARY METHOD | 1.1 V | 1 | BINARY, OFFSET BINARY, 2'S COMPLEMENT BINARY | TRACK | INDUSTRIAL | PARALLEL, WORD | S-XQCC-N68 | Not Qualified | 1 | 85 °C | -40 °C | 68 | UNSPECIFIED | HVQCCN | LCC68,.4SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | NO LEAD | 500 µm | QUAD | 10 mm | 900 µm | 10 mm | MAXIM INTEGRATED PRODUCTS INC | QFN | 10 X 10 MM, 0.90 MM HEIGHT, MO-220, QFN-68 | 68 | not_compliant | 3A991.C.1 | 8542.39.00.01 |