Parametric results for: MAX1190, under Analog to Digital Converters
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MAX11900ETP+
Maxim Integrated Products
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$10.4282 | Yes | Transferred | 1.8 V | 3.6 V | 1 | 0.00076 % | 16 | 1 MHz | YES | ADC, SUCCESSIVE APPROXIMATION | -2.5 V | 1 | OFFSET BINARY | TRACK | 50 mA | CMOS | INDUSTRIAL | SERIAL | S-XQCC-N20 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | 30 | 20 | UNSPECIFIED | HVQCCN | LCC20,.16SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | MATTE TIN | NO LEAD | 500 µm | QUAD | 4 mm | 800 µm | 4 mm | MAXIM INTEGRATED PRODUCTS INC | compliant | 8542.39.00.01 | ||||||||||
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MAX11901ETP+
Maxim Integrated Products
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$29.4750 | Yes | Transferred | 1.8 V | 3.6 V | 1 | 0.0008 % | 16 | 1.6 MHz | YES | ADC, SUCCESSIVE APPROXIMATION | -2.5 V | 1 | OFFSET BINARY, 2'S COMPLEMENT BINARY | TRACK | CMOS | INDUSTRIAL | SERIAL | S-XQCC-N20 | e3 | 1 | 85 °C | -40 °C | 260 | 30 | 20 | UNSPECIFIED | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | MATTE TIN | NO LEAD | 500 µm | QUAD | 4 mm | 800 µm | 4 mm | MAXIM INTEGRATED PRODUCTS INC | compliant | 8542.39.00.01 | HVQCCN, | ||||||||||||
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MAX11902ETP+
Maxim Integrated Products
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$34.1885 | Yes | Transferred | 1.8 V | 3.6 V | 1 | 0.0006 % | 18 | 1 MHz | YES | ADC, SUCCESSIVE APPROXIMATION | -2.5 V | 1 | OFFSET BINARY, 2'S COMPLEMENT BINARY | TRACK | CMOS | INDUSTRIAL | SERIAL | S-XQCC-N20 | e3 | 1 | 85 °C | -40 °C | 260 | 30 | 20 | UNSPECIFIED | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | MATTE TIN | NO LEAD | 500 µm | QUAD | 4 mm | 800 µm | 4 mm | MAXIM INTEGRATED PRODUCTS INC | compliant | 8542.39.00.01 | HVQCCN, | ||||||||||||
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MAX1190ECM+
Maxim Integrated Products
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Check for Price | Yes | Yes | Transferred | 3.3 V | 1 V | 1 | 0.293 % | 10 | 120 MHz | YES | ADC, PROPRIETARY METHOD | -1 V | 2 | OFFSET BINARY, 2'S COMPLEMENT BINARY | TRACK | CMOS | INDUSTRIAL | PARALLEL, WORD | S-PQFP-G48 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 260 | 30 | 48 | PLASTIC/EPOXY | TFQFP | TQFP48,.35SQ | SQUARE | FLATPACK, THIN PROFILE, FINE PITCH | MATTE TIN | GULL WING | 500 µm | QUAD | 7 mm | 1.2 mm | 7 mm | MAXIM INTEGRATED PRODUCTS INC | compliant | 8542.39.00.01 | TFQFP, TQFP48,.35SQ | QFP | 48 | |||||||
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MAX11905ETP+
Maxim Integrated Products
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Check for Price | Yes | Transferred | 1.8 V | 3.6 V | 1 | 0.0006 % | 20 | 1.6 MHz | YES | ADC, SUCCESSIVE APPROXIMATION | -2.5 V | 1 | OFFSET BINARY, 2'S COMPLEMENT BINARY | TRACK | CMOS | INDUSTRIAL | SERIAL | S-XQCC-N20 | e3 | 1 | 85 °C | -40 °C | 260 | 30 | 20 | UNSPECIFIED | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | MATTE TIN | NO LEAD | 500 µm | QUAD | 4 mm | 800 µm | 4 mm | MAXIM INTEGRATED PRODUCTS INC | compliant | 8542.39.00.01 | TQFN-20 | ||||||||||||
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MAX11904ETP+
Maxim Integrated Products
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Check for Price | Yes | Obsolete | 1.8 V | 3.6 V | 1 | 0.0005722 % | 20 | 1 MHz | YES | ADC, SUCCESSIVE APPROXIMATION | -2.5 V | 1 | OFFSET BINARY, 2'S COMPLEMENT BINARY | TRACK | 50 mA | CMOS | INDUSTRIAL | SERIAL | S-XQCC-N20 | e3 | 1 | 85 °C | -40 °C | 260 | 30 | 20 | UNSPECIFIED | HVQCCN | LCC20,.16SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | MATTE TIN | NO LEAD | 500 µm | QUAD | 4 mm | 800 µm | 4 mm | MAXIM INTEGRATED PRODUCTS INC | compliant | 8542.39.00.01 | HVQCCN, LCC20,.16SQ,20 | ||||||||||
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MAX11901ETP+T
Analog Devices Inc
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Check for Price | Yes | Active | 3.3 V | 1 | 0.0008 % | 16 | YES | A/D CONVERTER | 1 | OFFSET BINARY, 2'S COMPLEMENT BINARY | CMOS | INDUSTRIAL | S-PQCC-N20 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | 30 | 20 | PLASTIC/EPOXY | QCCN | LCC20,.16SQ,20 | SQUARE | CHIP CARRIER | Matte Tin (Sn) | NO LEAD | 500 µm | QUAD | ANALOG DEVICES INC | compliant | 20-LFCSP-4X4X0.75 | 20 | 20-LFCSP-4X4X0.75 | 2014-06-26 | Analog Devices | |||||||||||||||
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MAX11900ETP+
Analog Devices Inc
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Check for Price | Yes | Active | 1.8 V | 3.6 V | 1 | 0.00076 % | 16 | 1 MHz | YES | ADC, SUCCESSIVE APPROXIMATION | -2.5 V | 1 | OFFSET BINARY | TRACK | 50 mA | CMOS | INDUSTRIAL | SERIAL | S-XQCC-N20 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | 30 | 20 | UNSPECIFIED | HVQCCN | LCC20,.16SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Matte Tin (Sn) | NO LEAD | 500 µm | QUAD | 4 mm | 800 µm | 4 mm | ANALOG DEVICES INC | compliant | 20-LFCSP-4X4X0.75 | 20 | 20-LFCSP-4X4X0.75 | 2015-04-08 | Analog Devices | ||||||
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MAX1190ECM-D
Maxim Integrated Products
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Check for Price | No | No | Obsolete | 3.3 V | 1 V | 1 | 0.293 % | 10 | 120 MHz | YES | ADC, PROPRIETARY METHOD | -1 V | 2 | OFFSET BINARY, 2'S COMPLEMENT BINARY | TRACK | CMOS | INDUSTRIAL | PARALLEL, WORD | S-PQFP-G48 | Not Qualified | e0 | 85 °C | -40 °C | 240 | 20 | 48 | PLASTIC/EPOXY | TFQFP | TQFP48,.35SQ | SQUARE | FLATPACK, THIN PROFILE, FINE PITCH | TIN LEAD | GULL WING | 500 µm | QUAD | 7 mm | 1.2 mm | 7 mm | MAXIM INTEGRATED PRODUCTS INC | not_compliant | 8542.39.00.01 | TFQFP, TQFP48,.35SQ | QFP | 48 | 3A991.C.1 | |||||||
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MAX1190ECM+D
Maxim Integrated Products
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Check for Price | Yes | Yes | Transferred | 3.3 V | 1 V | 1 | 0.293 % | 10 | 120 MHz | YES | ADC, PROPRIETARY METHOD | -1 V | 2 | OFFSET BINARY, 2'S COMPLEMENT BINARY | TRACK | CMOS | INDUSTRIAL | PARALLEL, WORD | S-PQFP-G48 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 260 | 30 | 48 | PLASTIC/EPOXY | TFQFP | TQFP48,.35SQ | SQUARE | FLATPACK, THIN PROFILE, FINE PITCH | MATTE TIN | GULL WING | 500 µm | QUAD | 7 mm | 1.2 mm | 7 mm | MAXIM INTEGRATED PRODUCTS INC | compliant | 8542.39.00.01 | 7 X 7 MM, 1.0 MM HEIGHT, LEAD FREE, MS-026ABA-HD, TQFP-48 | QFP | 48 | EAR99 |